公开(公告)号：US20190241772A1

公开(公告)日：2019-08-08

申请号：US16313622

申请日：2017-06-27

Applicant: UNIVERSITY OF LIMERICK

Inventor： Bin ZHAO ,  Conor MCCARTHY

IPC: C09J11/04 ,  C09J163/00 ,  C09J9/02

CPC classification number: C09J11/04 ,  C08K3/042 ,  C08K3/22 ,  C08K7/06 ,  C08K7/24 ,  C08K2003/2275 ,  C08K2201/001 ,  C08K2201/005 ,  C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2205/11 ,  C09J2205/302

Abstract: An adhesive composition degradable by dielectric heating. The adhesive composition comprises a thermosetting polymer and a material sensitive to dielectric heating. The material sensitive to dielectric heating is selected from any one or more of hollow nanospheres, nanotubes, nanorods, nanofibres, nanosheets, graphene, graphene derivatives, nano/micro hybrids and mixtures of two or more nanoscale particles. The adhesive composition may be particularly useful in the assembly and disassembly of parts, particularly parts which have complicated and/or blocked joined surfaces. A method of joining at least two parts of an article together and a method of disassembling at least two parts of an article, using the adhesive composition are also provided. The adhesive composition may provide a reworkable nanocomposite adhesive. The adhesive composition maybe used to reversibly bond a biomedical or dental implant to a part of a human or animal body.

公开(公告)号：US20190214781A1

公开(公告)日：2019-07-11

申请号：US16356546

申请日：2019-03-18

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01R43/20 ,  H01R4/04 ,  C09J9/02 ,  C09J7/20 ,  H01R43/00 ,  H05K3/32

CPC classification number: H01R43/205 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/143 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1344

Abstract: An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

公开(公告)号：US20180352660A1

公开(公告)日：2018-12-06

申请号：US15778369

申请日：2016-12-06

Applicant: DIC Corporation

Inventor： Koji HAYASHI ,  Sumio SHIMOOKA ,  Shota TANII ,  Akinori MORINO

IPC: H05K3/38 ,  H05K1/02 ,  H05K3/46 ,  C09J7/21 ,  C09J7/20 ,  C09J7/28 ,  C09J7/35 ,  C09J11/04 ,  C09J7/25 ,  C09J5/06

CPC classification number: H05K3/386 ,  C08K2201/001 ,  C09J5/06 ,  C09J7/205 ,  C09J7/21 ,  C09J7/255 ,  C09J7/28 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/16 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2467/006 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/4644 ,  H05K2203/1105

Abstract: An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 μm or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 μm or less thickness.

公开(公告)号：US20180194101A1

公开(公告)日：2018-07-12

申请号：US15916354

申请日：2018-03-09

Applicant: Lintec of America, Inc.

Inventor： Marcio D. Lima ,  Julia Bykova

IPC: B32B5/02 ,  C08K3/04 ,  B32B7/12

CPC classification number: C08K3/041 ,  B32B5/02 ,  B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B9/007 ,  B32B9/043 ,  B32B15/14 ,  B32B17/10788 ,  B32B17/10889 ,  B32B27/30 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2311/18 ,  B82Y40/00 ,  C08J5/042 ,  C08J5/18 ,  C08J7/047 ,  C08J2383/04 ,  C08J2483/04 ,  C08K3/04 ,  C08K3/042 ,  C08K3/045 ,  C08K3/08 ,  C08K7/06 ,  C08K2003/0831 ,  C08K2003/0881 ,  C08K2201/011 ,  C08L23/0853 ,  C08L29/14 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J201/02 ,  C09J2201/16 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102

Abstract: Techniques are disclosed for producing multilayered composites of adhesive nanofiber composites. Specifically, one or more sheets of highly aligned nanofibers are partially embedded in an adhesive such that at least a portion of the nanofiber sheet is free from adhesive and is available to conduct current with adjacent electrical features. In some example embodiments, the adhesive nanofiber composites are metallized with a conductive metal and in these and other embodiments, the adhesive nanofiber composites may also be stretchable.

公开(公告)号：US09960139B2

公开(公告)日：2018-05-01

申请号：US14428582

申请日：2013-09-17

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi Sato ,  Yasushi Akutsu

IPC: H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B23B3/30 ,  C09J9/02 ,  B29C59/02 ,  B32B33/00 ,  C09J7/00 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  B32B3/08 ,  C08K3/08 ,  B29K63/00 ,  B29L9/00 ,  B29L31/34 ,  B29C35/08

CPC classification number: H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

公开(公告)号：US20170267899A1

公开(公告)日：2017-09-21

申请号：US15101801

申请日：2014-10-24

Applicant: Cima NanoTech Israel Ltd.

Inventor： Jonathan Alton Brodd ,  Chandarasekaran Krishnan ,  Jing Jiang ,  Dov Zamir

IPC: C09J7/02 ,  H05K9/00 ,  H01B3/44 ,  H01B1/22 ,  H01B13/00

CPC classification number: H01B13/0036 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/006 ,  C09J2467/006 ,  H01B1/22 ,  H01B3/447 ,  H01B13/003 ,  H05K1/0224 ,  H05K3/207 ,  H05K9/0083 ,  H05K2201/0108 ,  H05K2201/0257

Abstract: A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.

公开(公告)号：US20170253769A1

公开(公告)日：2017-09-07

申请号：US15449502

申请日：2017-03-03

Applicant: SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ik Hwan Cho ,  Byeong Do Kwak ,  Il Jin Kim ,  Sung Hyun Mun ,  Gwang Hwan Lee ,  Jae Hyun Han

IPC: C09J7/00 ,  C09J11/08 ,  G02B5/30 ,  C09J9/02

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/308 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/206 ,  B32B2457/208 ,  C09J7/10 ,  C09J133/066 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2433/00 ,  G02B5/3033

Abstract: An adhesive film, an optical member including the same, and an optical display including the same are provided. An adhesive film has a tan δ ratio at 25° C. of about 1 to about 2 as calculated by Equation 1 and a tan δ ratio at −20° C. of about 0.1 to about 1.5 as calculated by Equation 2, and is formed of an adhesive composition including a monomer mixture including a hydroxyl group-containing (meth)acrylic acid ester.

公开(公告)号：US09701874B2

公开(公告)日：2017-07-11

申请号：US14781746

申请日：2014-03-27

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida ,  Yoshitaka Ishibashi

IPC: C09J9/02 ,  C09J133/14 ,  C09J163/10 ,  H01B1/22 ,  C09D133/06 ,  C09J7/00 ,  C08K3/08 ,  C08K7/18

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0862 ,  C09D133/068 ,  C09J7/00 ,  C09J7/10 ,  C09J133/14 ,  C09J163/10 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/22

Abstract: [Problem] To provide: a conductive adhesive which contains an epoxy (meth)acrylate resin and which can form a bonded zone that is not susceptible to being deteriorated by halogen; an anisotropic conductive film; and electronic devices using both. [Solution] A conductive adhesive and an anisotropic conductive film which each contain a conductive filler and a binder resin, wherein: the binder resin comprises an epoxy (meth)acrylate resin that is a product of addition reaction of (meth)acrylic acid and an epoxy compound having a sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, preferably 50 mass ppm or less; and the conductive filler is dispersed in the binder resin which comprises such an epoxy (meth)acrylate resin. The epoxy (meth)acrylate resin is preferably prepared by subjecting a starting compound (substrate) having a carbon-carbon double bond to epoxidation of the double bond with an oxidizing agent consisting of hydrogen peroxide, and then subjecting the obtained epoxy compound to addition reaction with (meth)acrylic acid.

公开(公告)号：US20170194526A1

公开(公告)日：2017-07-06

申请号：US14987567

申请日：2016-01-04

Applicant: The Boeing Company

Inventor： Eric M. Rehder

IPC: H01L31/05 ,  B32B7/04 ,  B32B15/16 ,  H01L31/043 ,  B32B37/12 ,  B32B5/16 ,  B32B37/04 ,  B32B38/00 ,  B32B7/12 ,  B32B15/04

CPC classification number: H01L31/0512 ,  B32B5/16 ,  B32B7/04 ,  B32B7/12 ,  B32B15/01 ,  B32B15/043 ,  B32B15/16 ,  B32B37/04 ,  B32B37/12 ,  B32B38/0036 ,  B32B2037/1269 ,  B32B2305/30 ,  B32B2307/202 ,  B32B2457/00 ,  C09J5/00 ,  C09J2201/602 ,  C09J2203/326 ,  H01L31/043 ,  Y02E10/50

Abstract: An anisotropic conducting adhesive is improved in conductivity without increasing the density of admixed conductive particles by inducing metallic fusion between the surfaces of the conducting particles and the surfaces being bonded. The metallic fusion may be promoted by physical/chemical interaction characteristic of certain materials at a compressed interface; by compression sufficient to deform the conductive particles in a manner that increases the mechanical contact area; by heating (with or without melting of a material), which may also serve to cure the adhesive matrix; or by acoustic vibration, e.g., ultrasonic vibration. The resulting metallic-fusion joint is stronger, as well as more conductive, than a joint in which the particles and surfaces are held in unfused mechanical contact.

公开(公告)号：US09676986B2

公开(公告)日：2017-06-13

申请号：US15025542

申请日：2015-03-16

Applicant: LG Chem, Ltd.

Inventor： Ji-Hye Kim ,  Byung-Ho Ra ,  Jang-Soon Kim

IPC: C09K5/08 ,  C09J7/02 ,  C09J133/06 ,  C09J9/00 ,  C09K5/14

CPC classification number: C09K5/08 ,  C08L2312/06 ,  C09J9/00 ,  C09J133/06 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/20 ,  C09J2433/00 ,  C09K5/14 ,  C08K3/0033 ,  C08K5/3475 ,  C08K3/013

Abstract: Provided is an adhesive composition for a heat dissipating adhesive tape, the adhesive composition comprising a (meth)acrylic acid ester based photocurable resin, a thermal conductive filler, and a benzotriazole-based compound.