中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.016 seconds)

    OPTICAL PACKAGE
    1.
    发明申请
    OPTICAL PACKAGE 有权

    公开(公告)号：US20210134857A1

    公开(公告)日：2021-05-06

    申请号：US16670836

    申请日：2019-10-31

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Chia Yun HSU

    IPC: H01L27/146

    Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.

    INTERCONNECTION STRUCTURE AND SENSOR PACKAGE
    4.
    发明申请
    INTERCONNECTION STRUCTURE AND SENSOR PACKAGE 审中-公开

    公开(公告)号：US20200027834A1

    公开(公告)日：2020-01-23

    申请号：US16514962

    申请日：2019-07-17

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsun-Wei CHAN ,  Shih-Chieh TANG

    IPC: H01L23/528 ,  H05K1/18

    Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

    ELECTRONIC MODULE AND OPTICAL DEVICE
    6.
    发明申请
    ELECTRONIC MODULE AND OPTICAL DEVICE 有权

    公开(公告)号：US20230062337A1

    公开(公告)日：2023-03-02

    申请号：US17465729

    申请日：2021-09-02

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Shih-Chieh TANG ,  Ying-Chung CHEN

    IPC: G02B6/42

    Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.

    OPTICAL MODULE
    7.
    发明申请
    OPTICAL MODULE 有权

    公开(公告)号：US20240427092A1

    公开(公告)日：2024-12-26

    申请号：US18830534

    申请日：2024-09-10

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

    IPC: G02B6/42

    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210358823A1

    公开(公告)日：2021-11-18

    申请号：US16877197

    申请日：2020-05-18

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Shih-Chieh TANG ,  Yu-Min PENG ,  Hui-Chung LIU

    IPC: H01L23/31 ,  H01L21/56

    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).

    SEMICONDUCTOR DEVICE PACKAGE
    9.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE 有权

    公开(公告)号：US20210280755A1

    公开(公告)日：2021-09-09

    申请号：US16809506

    申请日：2020-03-04

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Shih-Chieh TANG ,  Lu-Ming LAI

    IPC: H01L33/58 ,  G02B3/00

    Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

    SEMICONDUCTOR DEVICE PACKAGE
    10.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE 审中-公开

    公开(公告)号：US20190202686A1

    公开(公告)日：2019-07-04

    申请号：US16212609

    申请日：2018-12-06

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Shih-Chieh TANG ,  Hsin-Ying HO ,  Hsun-Wei CHAN

    IPC: B81B7/02 ,  H01L33/60

    Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.

Patent Agency Ranking