公开(公告)号：US20170207352A1

公开(公告)日：2017-07-20

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Chia Yun HSU ,  Tsung-Yu LIN

IPC: H01L31/0232 ,  G01J1/02 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0203 ,  F21V8/00 ,  G01J1/04

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.

公开(公告)号：US20210175135A1

公开(公告)日：2021-06-10

申请号：US16703385

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Yun HSU ,  Ying-Chung CHEN

IPC: H01L23/04 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/02

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

公开(公告)号：US20210134857A1

公开(公告)日：2021-05-06

申请号：US16670836

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Chia Yun HSU

IPC: H01L27/146

Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.

公开(公告)号：US20200235153A1

公开(公告)日：2020-07-23

申请号：US16254389

申请日：2019-01-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia Yun HSU ,  Ying-Chung CHEN

IPC: H01L27/146

Abstract: An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1≥H3.