公开(公告)号：US20240243039A1

公开(公告)日：2024-07-18

申请号：US18098560

申请日：2023-01-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/49 ,  H01L25/065

CPC classification number: H01L23/4952 ,  H01L21/4885 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/49 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05568 ,  H01L2224/29023 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48177 ,  H01L2224/48179 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2924/182

Abstract: At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.

公开(公告)号：US20240038677A1

公开(公告)日：2024-02-01

申请号：US17877795

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L25/167 ,  H01L23/49861 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.

公开(公告)号：US20210175135A1

公开(公告)日：2021-06-10

申请号：US16703385

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Yun HSU ,  Ying-Chung CHEN

IPC: H01L23/04 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/02

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

公开(公告)号：US20200235153A1

公开(公告)日：2020-07-23

申请号：US16254389

申请日：2019-01-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia Yun HSU ,  Ying-Chung CHEN

IPC: H01L27/146

Abstract: An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1≥H3.

公开(公告)号：US20200020827A1

公开(公告)日：2020-01-16

申请号：US16505331

申请日：2019-07-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L33/08 ,  H01L33/10 ,  H01L33/26

Abstract: An optical device includes a substrate, an electronic component, a lid and a barrier. The electronic component is disposed on the substrate. The electronic component has an active surface faces away from the substrate. The lid is disposed on the substrate. The lid has a wall structure extending toward the active surface of electronic component and is spaced apart from the active surface of the electronic component. The barrier is disposed on the active surface of the electronic component and is spaced apart from the wall structure of the lid.

公开(公告)号：US20180017741A1

公开(公告)日：2018-01-18

申请号：US15643458

申请日：2017-07-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G02B6/42 ,  H01L33/48 ,  H01L25/16 ,  H01L31/0203 ,  B29C43/36 ,  H01S5/022 ,  B29C33/00 ,  B29C35/08

CPC classification number: H01L25/167 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0025 ,  G02B6/0028 ,  G02B6/0031 ,  G02B6/0036 ,  G02B6/0045 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0065 ,  G02B6/0073 ,  G02B6/0076 ,  G02B6/0091 ,  G02B6/0096 ,  G02B6/4206 ,  G02B6/4212 ,  G02B6/4257 ,  H01L23/142 ,  H01L23/145 ,  H01L23/15 ,  H01L25/165 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/15 ,  H01L31/02327 ,  H01L33/58 ,  H01L2924/12042 ,  H01L2924/16151 ,  H01L2924/16196 ,  H01L2924/16251 ,  H01L2933/0058 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02288 ,  H05K1/03

Abstract: An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module further includes a first light transmission element disposed on the first opening and a second light transmission element disposed on the second opening. A first opaque layer is disposed on the first light transmission element, the first opaque layer defining a first aperture, and a second opaque layer disposed on the second light transmission element, the second opaque layer defining a second aperture.

公开(公告)号：US20230062337A1

公开(公告)日：2023-03-02

申请号：US17465729

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.

公开(公告)号：US20220328713A1

公开(公告)日：2022-10-13

申请号：US17227152

申请日：2021-04-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H04B10/40 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20220246592A1

公开(公告)日：2022-08-04

申请号：US17168010

申请日：2021-02-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: H01L25/16 ,  H01L33/52 ,  H01L33/00 ,  H01L31/16 ,  H01L33/62 ,  H01L31/02 ,  H01L31/18

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.

公开(公告)号：US20220221332A1

公开(公告)日：2022-07-14

申请号：US17707802

申请日：2022-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN

IPC: G01J1/02

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.