公开(公告)号：US20180295719A1

公开(公告)日：2018-10-11

申请号：US15570879

申请日：2015-06-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Charles Nathan Logan ,  Adrian Rothenbuhler ,  Christine m. Wells

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40

CPC classification number: H05K1/0275 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/09227 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09781

Abstract: In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.

公开(公告)号：US10349517B2

公开(公告)日：2019-07-09

申请号：US15570879

申请日：2015-06-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Charles Nathan Logan ,  Adrian Rothenbuhler ,  Christine M. Wells

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/02 ,  H05K1/09

Abstract: In one implementation, a printed circuit board (PCB) includes a plurality of pads that form a pad pattern on the PCB. In that implementation, the plurality of pads include a group of load pads, a dummy pad, and a false pad. The group of load pads act as contact points to establish an electrical path between a first circuitry and a second circuitry. The dummy pad is coupled to a via that floats electrically and the false pad is coupled to a third circuitry.