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公开(公告)号：US20160351485A1
公开(公告)日：2016-12-01
申请号：US15191729
申请日：2016-06-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas J. Brunschwiler , Dominic Gschwend , Keiji Matsumoto , Stefano S. Oggioni , Gerd Schlottig , Timo J. Tick , Jonas Zuercher
IPC: H01L23/498 , H01L23/373 , H01L23/367
CPC classification number: H01L23/49822 , H01L23/14 , H01L23/367 , H01L23/3735 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H05K1/0206 , H05K1/0298 , H05K3/3436 , H05K3/4046 , H05K2201/048 , Y10T29/49126 , H01L2924/00
Abstract: An electronic circuit includes a substrate device which includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are perpendicular with respect to one another.
Abstract translation: 电子电路包括基板装置，该基板装置包括第一基板部分，第一基板部分包括具有第一取向（x2）的彼此附接的第一多个层，以及包括彼此附接的第二多个层的第二基板部分。 第二多个层具有第二取向（x3）。 第一取向（x2）和第二取向（x3）相对于彼此垂直。
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2.发明授权Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section 有权基板装置和电路装置，其具有垂直于第二基板部分的第一基板部分公开(公告)号：US09433077B2
公开(公告)日：2016-08-30
申请号：US14599672
申请日：2015-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas J. Brunschwiler , Dominic Gschwend , Keiji Matsumoto , Stefano S. Oggioni , Gerd Schlottig , Timo J. Tick , Jonas Zuercher
IPC: H01L21/76 , H05K1/02 , H01L23/14 , H01L23/373 , H05K3/34 , H05K3/40 , H01L23/498
CPC classification number: H01L23/49822 , H01L23/14 , H01L23/367 , H01L23/3735 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H05K1/0206 , H05K1/0298 , H05K3/3436 , H05K3/4046 , H05K2201/048 , Y10T29/49126 , H01L2924/00
Abstract: A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are angled (α) with respect to one another.
Abstract translation: 一种用于电子电路或器件的衬底装置包括：第一衬底部分，包括彼此附接的第一多个层，具有第一取向（x2）;以及第二衬底部分，第二衬底部分包括彼此附接的第二多个层。 第二多个层具有第二取向（x3）。 第一取向（x2）和第二取向（x3）相对于彼此成角度（α）。
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公开(公告)号：US20150237729A1
公开(公告)日：2015-08-20
申请号：US14599672
申请日：2015-01-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas J. Brunschwiler , Dominic Gschwend , Keiji Matsumoto , Stefano S. Oggioni , Gerd Schlottig , Timo J. Tick , Jonas Zuercher
CPC classification number: H01L23/49822 , H01L23/14 , H01L23/367 , H01L23/3735 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H05K1/0206 , H05K1/0298 , H05K3/3436 , H05K3/4046 , H05K2201/048 , Y10T29/49126 , H01L2924/00
Abstract: A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are angled (α) with respect to one another.
Abstract translation: 一种用于电子电路或器件的衬底装置包括：第一衬底部分，包括彼此附接的第一多个层，具有第一取向（x2）;以及第二衬底部分，第二衬底部分包括彼此附接的第二多个层。 第二多个层具有第二取向（x3）。 第一取向（x2）和第二取向（x3）相对于彼此成角度（α）。
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公开(公告)号：US09698089B2
公开(公告)日：2017-07-04
申请号：US15191729
申请日：2016-06-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas J. Brunschwiler , Dominic Gschwend , Keiji Matsumoto , Stefano S. Oggioni , Gerd Schlottig , Timo J. Tick , Jonas Zuercher
IPC: H01L21/76 , H01L23/498 , H05K1/02 , H01L23/14 , H01L23/373 , H01L23/367 , H05K3/34 , H05K3/40
CPC classification number: H01L23/49822 , H01L23/14 , H01L23/367 , H01L23/3735 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H05K1/0206 , H05K1/0298 , H05K3/3436 , H05K3/4046 , H05K2201/048 , Y10T29/49126 , H01L2924/00
Abstract: An electronic circuit includes a substrate device which includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are perpendicular with respect to one another.
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