公开(公告)号：US20230371613A1

公开(公告)日：2023-11-23

申请号：US18318199

申请日：2023-05-16

Applicant: Hainan Moore Brothers Technology Co., Ltd.

Inventor： Deke XIE ,  Weidong ZHOU ,  Zhan ZHAO ,  Chao XU ,  Xiao'an ZHU

IPC: A24F40/60 ,  F21V8/00 ,  H05K1/14 ,  H01M50/284 ,  H01M50/202 ,  H01M50/262 ,  A24F40/40 ,  A24F40/50

CPC classification number: A24F40/60 ,  G02B6/0091 ,  G02B6/0068 ,  H05K1/144 ,  H01M50/284 ,  H01M50/202 ,  H01M50/262 ,  A24F40/40 ,  A24F40/50 ,  H05K2201/048 ,  H01M2220/30 ,  A61M15/06

Abstract: A battery assembly for an electronic vaporization device includes: a first circuit board for controlling operation of the electronic vaporization device; a second circuit board, stacked with the first circuit board, an orthographic projection of the second circuit board on the first circuit board not exceeding a maximum distance of the first circuit board in a length direction or a width direction; and a plurality of light emitting elements arranged on a surface of the second circuit board away from the first circuit board.

公开(公告)号：US20190215961A1

公开(公告)日：2019-07-11

申请号：US16325403

申请日：2017-08-15

Applicant: GE Aviation Systems Limited

Inventor： Alexander James Rainbow

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/52 ,  H01R12/73

CPC classification number: H05K1/144 ,  H01R12/523 ,  H01R12/73 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/048 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A power distribution assembly includes a printed circuit board (PCB) having a power input and electrical components connected to PCB conductive trace. A power bus extends from the PCB and has a conductive core, a dielectric layer on an exterior surface of the conductive core, a conductive trace on the dielectric layer, and a power cut through the dielectric layer to the conductive core. The conductive core is connected to the power input by way of the power cut through and the at least one second conductive trace is connected to the PCB conductive trace.

公开(公告)号：US20190212116A1

公开(公告)日：2019-07-11

申请号：US16311981

申请日：2017-06-16

Applicant: BAE SYSTEMS plc

Inventor： GARY ROY MOORE ,  PAUL BICKNELL

IPC: F42B15/01 ,  F42B10/46 ,  H05K1/14 ,  H05K7/14

CPC classification number: F42B15/01 ,  F42B10/46 ,  F42B19/005 ,  F42B30/006 ,  H05K1/14 ,  H05K1/141 ,  H05K3/366 ,  H05K7/1434 ,  H05K2201/048 ,  H05K2201/09027

Abstract: The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

公开(公告)号：US20190052008A1

公开(公告)日：2019-02-14

申请号：US15945802

申请日：2018-04-05

Applicant: TE CONNECTIVITY CORPORATION

Inventor： John Joseph Consoli ,  Matthew Jeffrey Sypolt

IPC: H01R12/73 ,  H05K1/14 ,  H05K7/14

CPC classification number: H01R12/737 ,  H01R12/7064 ,  H01R12/712 ,  H01R12/727 ,  H01R12/87 ,  H01R13/05 ,  H01R13/62905 ,  H05K1/14 ,  H05K7/1417 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/10325 ,  H05K2201/10333

Abstract: A communication system includes first and second circuit card assemblies mated such that first and second PCBs move relative to each other along a board mating axis parallel to a slot in the first PCB with the first PCB oriented perpendicular to the second PCB and with first and second mating ends of first and second electrical connectors oriented parallel to the board mating axis. The first and second circuit card assemblies are mated such that the first electrical connector and the second electrical connector move relative to each other along a connector mating axis perpendicular to the board mating axis. First mating interfaces of first contacts are mated to second mating interfaces of second contacts in a contact mating direction non-parallel to the board mating axis and non-parallel to the connector mating axis.

公开(公告)号：US20180310419A1

公开(公告)日：2018-10-25

申请号：US15769476

申请日：2016-10-21

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Gernot Grober ,  Sabine Liebfahrt ,  Marco Gavagnin

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/4614 ,  H05K1/0237 ,  H05K1/0271 ,  H05K1/14 ,  H05K1/185 ,  H05K3/36 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/086 ,  H05K2201/09136 ,  H05K2201/09163

Abstract: A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.

公开(公告)号：US09961793B1

公开(公告)日：2018-05-01

申请号：US15353820

申请日：2016-11-17

Applicant: Google Inc.

Inventor： Jason Cinge Wong ,  Jason Okamoto ,  Alvin Alza Dominguez ,  Brett Mateo

IPC: H05K5/00 ,  H05K7/02 ,  H01R12/73 ,  H01R12/79 ,  H01R43/26 ,  H05K7/14 ,  H05K9/00 ,  H05K13/00 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/028 ,  H01R13/641 ,  H04M1/0202 ,  H05K1/142 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/048

Abstract: An electronic module for a modular electronic device may include improved features for retaining the electronic module relative a frame of the modular electronic device and/or for subsequently removing such module from the frame. In addition, aspects of the present subject matter related to improved methods for assembling an electronic module for use with a modular electronic device.

公开(公告)号：US09930780B1

公开(公告)日：2018-03-27

申请号：US15358189

申请日：2016-11-22

Applicant: Lear Corporation

Inventor： Riad Ghabra ,  William Ramsey Reynolds ,  Jason Summerford

IPC: H01R13/648 ,  H05K1/14 ,  H05K1/11 ,  G07C9/00 ,  G08C17/02 ,  B60R25/40

CPC classification number: H05K1/141 ,  B60R25/406 ,  G07C9/00111 ,  G08C17/02 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/048 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10318

Abstract: A portable remote control device such as a key fob includes a motherboard, a battery daughterboard having a battery holder to secure a battery, and an interconnect mounting the battery daughterboard to the motherboard. The battery daughterboard may include a first via and the motherboard may include a second via in which the vias are misaligned with one another. The interconnect includes a first pin inserted through the first via and the second via to mount the battery daughterboard to the motherboard. The first pin has a disjointed configuration over a length of the pin in correspondence with a misalignment of the first via and the second via.

公开(公告)号：US09883598B2

公开(公告)日：2018-01-30

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Ming-Hao Wu ,  Cheng-Po Yu

IPC: H01L35/30 ,  H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  G06F1/20 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US09799973B2

公开(公告)日：2017-10-24

申请号：US15259144

申请日：2016-09-08

Applicant: Ross Video Limited

Inventor： Donald Mark Sizemore ,  Curtis Rylee Keim ,  Nicholas Daniel Parry ,  Mark Justin Sonderegger ,  Thomas Curtis Brown

IPC: H01R12/00 ,  H01R12/73 ,  H01R12/70 ,  H05K1/11 ,  H05K3/36

CPC classification number: H01R12/737 ,  H01R12/7011 ,  H01R12/7047 ,  H01R12/722 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10409 ,  H05K2201/209 ,  H05K2203/167

Abstract: Printed circuit board pad layouts and mechanical retainers are disclosed herein. For example, a printed circuit board is disclosed having a row of electrically conductive pads, the row of pads including pairs of signal pads with exactly one reference pad interposed between each pair of the signal pads. As another example, a mechanical retainer is disclosed that may assist in interconnecting two printed circuit boards and that has a longitudinal body with a threaded end, a head at an end opposite the threaded end, and a shank connecting the head to the threaded end.

公开(公告)号：US09562679B2

公开(公告)日：2017-02-07

申请号：US14211046

申请日：2014-03-14

Applicant: LG Innotek Co., Ltd.

Inventor： Dong Nyung Lim ,  Do Hwan Kim ,  Sang Hoon Lee ,  Keun Tak Joo ,  Tae Young Choi

IPC: F21S4/00 ,  F21V21/00 ,  F21V29/00 ,  H05K3/36 ,  F21V29/77 ,  F21V23/00 ,  F21Y101/00

CPC classification number: F21V29/773 ,  F21K9/23 ,  F21K9/238 ,  F21K9/90 ,  F21V23/006 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10106

Abstract: A lighting device may be provided that includes: a heat sink; a light source module which is disposed on the heat sink, includes a substrate having at least one hole, and includes a plurality of light emitting devices disposed on a top surface of the substrate; a power supply unit which is disposed within the heat sink and includes a support plate and a plurality of parts disposed on the support plate; and a soldering portion which connects the substrate and the support plate. The support plate includes an extended substrate which is disposed in the hole of the substrate. The extended substrate includes a through-portion which has passed through the hole of the substrate. The soldering portion electrically connects the through-portion of the extended substrate and the top surface of the substrate.

Abstract translation: 可以提供照明装置，其包括：散热器; 设置在散热器上的光源模块包括具有至少一个孔的衬底，并且包括设置在衬底顶表面上的多个发光器件; 电源单元，其设置在所述散热器内，并且包括支撑板和设置在所述支撑板上的多个部件; 以及连接基板和支撑板的焊接部。 支撑板包括设置在基板的孔中的延伸基板。 延伸的基板包括穿过基板的孔的通孔部分。 焊接部电连接延伸基板的贯通部和基板的上表面。