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公开(公告)号：US09974215B1
公开(公告)日：2018-05-15
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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公开(公告)号：US20180132390A1
公开(公告)日：2018-05-10
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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