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公开(公告)号：US20210327824A1
公开(公告)日：2021-10-21
申请号：US17235055
申请日：2021-04-20
Applicant: Ntrium Inc.
Inventor： Se Young JEONG , Kisu JOO , Kyu Jae LEE , Seungjae LEE
IPC: H01L23/552 , H01L23/00 , H01L21/48 , H01L21/78
Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
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公开(公告)号：US11527488B2
公开(公告)日：2022-12-13
申请号：US17235055
申请日：2021-04-20
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Kisu Joo , Kyu Jae Lee , Seungjae Lee
IPC: H01L23/00 , H01L23/552 , H01L21/48 , H01L21/78
Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
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3.发明申请公开(公告)号：US20190206804A1
公开(公告)日：2019-07-04
申请号：US16211959
申请日：2018-12-06
Applicant: NTRIUM INC.
Inventor： Se Young JUNG , Jung Woo HWANG , Yoon Hyun KIM , Ki Su JOO , Kyu Jae LEE
IPC: H01L23/552 , H01L21/3205 , H01L23/31 , B22F7/04
Abstract: Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
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Patent Agency Ranking
4.发明申请公开(公告)号：US20180235116A1
公开(公告)日：2018-08-16
申请号：US15950287
申请日：2018-04-11
Applicant: Ntrium Inc.
Inventor： Se Young JEONG , Ki Su JOO , Ju Young LEE , Jeong Woo HWANG , Jin Ho YOON
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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公开(公告)号：US09974215B1
公开(公告)日：2018-05-15
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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公开(公告)号：US10541210B2
公开(公告)日：2020-01-21
申请号：US16211959
申请日：2018-12-06
Applicant: NTRIUM INC.
Inventor： Se Young Jung , Jung Woo Hwang , Yoon Hyun Kim , Ki Su Joo , Kyu Jae Lee
IPC: H01L23/552 , H01L21/3205 , H01L23/31 , B22F7/04
Abstract: Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
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公开(公告)号：US20180132390A1
公开(公告)日：2018-05-10
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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公开(公告)号：US20150194366A1
公开(公告)日：2015-07-09
申请号：US14591363
申请日：2015-01-07
Applicant: Ntrium Inc.
Inventor： Se Young JEONG
IPC: H01L23/373 , H01L21/48
CPC classification number: H01L23/3736 , H01L23/3737 , H01L2224/11 , H01L2924/0002 , H01L2924/00
Abstract: The present invention provides a heat transfer structure which includes a first object, a second object and a thermal transfer adhesive material which is placed between the first object and the second object so as to be in contact with at least one of the first object or the second object. The heat transfer adhesive material includes a resin and at least one thermal conductive material, and the at least one thermal conductive material is distributed by being dispersed in the resin and forms surface contact with at least one of the first object or the second object.
Abstract translation: 本发明提供一种传热结构，其包括第一物体，第二物体和热转印粘合剂材料，其被放置在第一物体和第二物体之间，以便与第一物体或第二物体中的至少一个接触， 第二个对象 传热粘合剂材料包括树脂和至少一种导热材料，并且所述至少一种导热材料通过分散在树脂中而分散，并与第一物体或第二物体中的至少一个形成表面接触。
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