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公开(公告)号：US09974215B1
公开(公告)日：2018-05-15
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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公开(公告)号：US11527488B2
公开(公告)日：2022-12-13
申请号：US17235055
申请日：2021-04-20
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Kisu Joo , Kyu Jae Lee , Seungjae Lee
IPC: H01L23/00 , H01L23/552 , H01L21/48 , H01L21/78
Abstract: A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
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公开(公告)号：US20180132390A1
公开(公告)日：2018-05-10
申请号：US15362872
申请日：2016-11-29
Applicant: Ntrium Inc.
Inventor： Se Young Jeong , Ki Su Joo , Ju Young Lee , Jeong Woo Hwang , Jin Ho Yoon
CPC classification number: H05K9/0088 , H01L23/3135 , H01L23/552 , H01L2924/1203 , H01L2924/1304 , H01L2924/1438 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/095 , H05K1/186 , H05K3/4644 , H05K3/4664 , H05K3/467 , H05K9/0024 , H05K2201/0715 , H05K2201/083
Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
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