SUBSTRATE FOR MOUNTING LIGHT RADIATION SOURCES AND CORRESPONDING METHOD
    1.
    发明申请
    SUBSTRATE FOR MOUNTING LIGHT RADIATION SOURCES AND CORRESPONDING METHOD 审中-公开
    用于安装光辐射源的基板和相应的方法

    公开(公告)号:US20170047485A1

    公开(公告)日:2017-02-16

    申请号:US15231806

    申请日:2016-08-09

    Applicant: OSRAM GmbH

    Abstract: A substrate for mounting electrically-powered light radiation sources, e.g. LED sources, includes a base layer of electrically-insulating material, such as PET, and a contact layer of electrically conductive material, e.g. copper. The contact layer includes a mounting area for a light radiation source having opposed anode and cathode terminals, including two portions with a gap therebetween. Therefore, the light radiation source may be mounted bridge-like across gap, with anode and cathode terminals soldered to respective soldering surfaces provided in the one and the other of said two portions of the mounting area. The latter portions include respective solder flow blocking formations including fork-shaped apertures in contact layer leaving base layer uncovered. The fork-shaped apertures have a web portion and prongs extending from web portion towards said soldering surfaces.

    Abstract translation: 用于安装电动光辐射源的基板,例如 LED源包括诸如PET的电绝缘材料的基层,以及导电材料的接触层,例如, 铜。 接触层包括用于具有相对的阳极和阴极端子的光辐射源的安装区域,包括两个在其间具有间隙的部分。 因此,光辐射源可以跨越间隙安装为桥状,阳极和阴极端子焊接到设置在安装区域的所述两个部分中的一个和另一个中的相应焊接表面。 后面的部分包括相应的焊料流动阻塞结构,其包括接触层中的叉形孔,使基层未被覆盖。 叉形孔具有腹板部分和从腹板部分朝向所述焊接表面延伸的尖头。

    METHOD FOR MANUFACTURING A LIGHT-EMITTING DEVICE

    公开(公告)号:US20210351317A1

    公开(公告)日:2021-11-11

    申请号:US17283973

    申请日:2019-10-10

    Applicant: OSRAM GmbH

    Abstract: A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).

    A METHOD OF THERMAL DECOUPLING OF PRINTED CIRCUITS AND A PRINTED CIRCUIT FOR USE THEREIN

    公开(公告)号:US20190059163A1

    公开(公告)日:2019-02-21

    申请号:US15761453

    申请日:2016-09-19

    Applicant: OSRAM GmbH

    Abstract: In order to counter heat propagation between adjacent sections of a ribbon-like printed circuit board, the sections being individually exposed to heat between opposed border lines, with printed circuit board including an electrically insulating substrate with electrically conductive pads for mounting components thereon, the adjacent sections are terminated at the opposed border lines with at least one electrically conductive borderline pad, which has a separation gap to the border line, and/or is coupled to an electrically conductive line extending on substrate between a first end at borderline pad and a second end away from borderline pad. The first end and the second end may be located at a first and at a second distances to border line, the second distance being longer than the first distance, and/or the electrically conductive line may have a narrower cross section than the first and the second ends.

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