Abstract:
A substrate for mounting electrically-powered light radiation sources, e.g. LED sources, includes a base layer of electrically-insulating material, such as PET, and a contact layer of electrically conductive material, e.g. copper. The contact layer includes a mounting area for a light radiation source having opposed anode and cathode terminals, including two portions with a gap therebetween. Therefore, the light radiation source may be mounted bridge-like across gap, with anode and cathode terminals soldered to respective soldering surfaces provided in the one and the other of said two portions of the mounting area. The latter portions include respective solder flow blocking formations including fork-shaped apertures in contact layer leaving base layer uncovered. The fork-shaped apertures have a web portion and prongs extending from web portion towards said soldering surfaces.
Abstract:
A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).
Abstract:
A method for manufacturing a light-emitting device may include producing a support having at least one conductor track on a surface of the support. The method may further include producing a reflective coating directly on the at least one conductor track by means of a film transfer method such that the conductor track is substantially covered by the reflective coating and arranging a light-emitting component on or above the reflective coating. The light-emitting component may be electrically conductively connected to the conductor track(s).
Abstract:
In order to counter heat propagation between adjacent sections of a ribbon-like printed circuit board, the sections being individually exposed to heat between opposed border lines, with printed circuit board including an electrically insulating substrate with electrically conductive pads for mounting components thereon, the adjacent sections are terminated at the opposed border lines with at least one electrically conductive borderline pad, which has a separation gap to the border line, and/or is coupled to an electrically conductive line extending on substrate between a first end at borderline pad and a second end away from borderline pad. The first end and the second end may be located at a first and at a second distances to border line, the second distance being longer than the first distance, and/or the electrically conductive line may have a narrower cross section than the first and the second ends.