-
公开(公告)号:US20240324247A1
公开(公告)日:2024-09-26
申请号:US18474111
申请日:2023-09-25
Applicant: Advanced Micro Devices, Inc.
Inventor: Samuel Naffziger , William George En , John Wuu
CPC classification number: H10B80/00 , H01L24/08 , H01L25/18 , H01L25/50 , H01L23/5286 , H01L24/06 , H01L2224/06181 , H01L2224/08145
Abstract: A method for die pair partitioning can include providing a circuit die that has a metal stack and that includes a majority of logic transistors of an integrated circuit. The method can also include providing one or more additional circuit die that have one or more additional metal stacks of which at least one is connected to the metal stack of the circuit die and a majority of static random access memory and analog devices of the integrated circuit. The method can further include connecting at least one of the one or more additional metal stacks to the metal stack of the circuit die. Various other methods, systems, and computer-readable media are also disclosed.
-
公开(公告)号:US20240321827A1
公开(公告)日:2024-09-26
申请号:US18474158
申请日:2023-09-25
Applicant: Advanced Micro Devices, Inc. , Xilinx, Inc.
Inventor: Omar Zia , Thomas D Burd , Kevin Gillespie , Samuel Naffziger , Richard Schultz , Raja Swaminathan , Srividhya Venkataraman , Yan Wang , John Wuu
IPC: H01L25/065 , H01L23/00 , H01L23/36 , H01L23/48 , H10B80/00
CPC classification number: H01L25/0657 , H01L23/36 , H01L23/481 , H01L24/08 , H01L24/16 , H01L24/80 , H10B80/00 , H01L2224/08145 , H01L2224/16145 , H01L2224/80895 , H01L2224/80896
Abstract: A method for circuit die stacking can include providing a first circuit die having a first metal stack, wherein the first circuit die corresponds to a primary thermal source of an integrated circuit including the first circuit die. The method can additionally include providing a second circuit die of the integrated circuit, wherein the second circuit die has a second metal stack and is configured for connection to at least one of a package substrate or an additional die. The method can also include connecting the first metal stack to the second metal stack. Various other methods, systems, and computer-readable media are also disclosed.
-
公开(公告)号:US20240321668A1
公开(公告)日:2024-09-26
申请号:US18474138
申请日:2023-09-25
Applicant: Advanced Micro Devices, Inc. , Xilinx, Inc.
Inventor: Thomas D. Burd , Gabriel H. Loh , John Wuu , Kevin Gillespie , Raja Swaminathan , Richard Schultz , Samuel Naffziger , Srividhya Venkataraman , Yan Wang
IPC: H01L23/34 , H01L23/00 , H01L25/065 , H10B80/00
CPC classification number: H01L23/34 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/80 , H01L25/0652 , H10B80/00 , H01L2224/08145 , H01L2224/16225 , H01L2224/32221 , H01L2224/80895 , H01L2224/80896 , H01L2924/1437
Abstract: A method for die pair partitioning can include providing a first circuit die having a first metal stack. The method can additionally include positioning a second circuit die having a second metal stack in a manner that places a temperature sensor in a transistor layer of the second circuit die in planar proximity to at least one hot spot located in an additional transistor layer of the first circuit die. The method can also include connecting the first metal stack of the first circuit die to the second metal stack of the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.
-
公开(公告)号:US20240319964A1
公开(公告)日:2024-09-26
申请号:US18126107
申请日:2023-03-24
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor: Onur Kayiran , Lee Evan Eisen , Michael Estlick , Jay Fleischman , Matthew R. Poremba , Gabriel H. Loh
IPC: G06F7/503
CPC classification number: G06F7/503
Abstract: A processor includes one or more processor cores configured to perform accumulate top (ACCT) and accumulate bottom (ACCB) instructions. To perform such instructions, at least one processor core of the processor includes an ACCT data path that adds a first portion of a block of data to a first lane of a set of lanes of a top accumulator and adds a carry-out bit to a second lane of the set of lanes of the top accumulator. Further, the at least one processor core includes an ACCB data path that adds a second portion of the block of data to a first lane of a set of lanes of a bottom accumulator and adds a carry-out bit to a second lane of the set of lanes of the bottom accumulator.
-
95.
公开(公告)号:US20240319781A1
公开(公告)日:2024-09-26
申请号:US18189993
申请日:2023-03-24
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor: Gia Tung Phan , Randall Brown , Ashish Jain
IPC: G06F1/3234 , G06F1/3228 , G06F1/3287
CPC classification number: G06F1/3275 , G06F1/3228 , G06F1/3287
Abstract: An apparatus and method for efficient power management of multiple integrated circuits. In various implementations, a computing system includes an integrated circuit with a security processor. The security processor determines the integrated circuit transitions to an active state from a sleep state that is not intended to maintain configuration information to return to the active state without restarting an operating system. In the sleep state, multiple components of the integrated circuit have a power supply reference level turned off, which provides low power consumption for the integrated circuit. The security processor performs the bootup operation using information stored in persistent on-chip memory. By not using information stored in off-chip memory, the security processor reduces the latency of the transition. The persistent on-chip memory utilizes synchronous random-access memory that receives a standby power supply reference level that continually supplies a voltage magnitude by not being turned off.
-
公开(公告)号:US12099867B2
公开(公告)日:2024-09-24
申请号:US15993061
申请日:2018-05-30
Applicant: Advanced Micro Devices, Inc.
Inventor: Sooraj Puthoor , Joseph Gross , Xulong Tang , Bradford Michael Beckmann
CPC classification number: G06F9/4881
Abstract: Systems, apparatuses, and methods for implementing a multi-kernel wavefront scheduler are disclosed. A system includes at least a parallel processor coupled to one or more memories, wherein the parallel processor includes a command processor and a plurality of compute units. The command processor launches multiple kernels for execution on the compute units. Each compute unit includes a multi-level scheduler for scheduling wavefronts from multiple kernels for execution on its execution units. A first level scheduler creates scheduling groups by grouping together wavefronts based on the priority of their kernels. Accordingly, wavefronts from kernels with the same priority are grouped together in the same scheduling group by the first level scheduler. Next, the first level scheduler selects, from a plurality of scheduling groups, the highest priority scheduling group for execution. Then, a second level scheduler schedules wavefronts for execution from the scheduling group selected by the first level scheduler.
-
公开(公告)号:US12099609B2
公开(公告)日:2024-09-24
申请号:US17127554
申请日:2020-12-18
Applicant: Advanced Micro Devices, Inc.
Inventor: Hsiu-Ming Chu
IPC: G06F21/57 , G06F8/65 , G06F9/44 , G06F9/4401 , G06F11/14
CPC classification number: G06F21/572 , G06F8/65 , G06F9/4403 , G06F11/1417 , G06F2201/805 , G06F2221/033
Abstract: A computing system may implement a basic input/output system (BIOS) update method. The BIOS also includes identifying an installed central processing unit (CPU) of a computer system coupled to a BIOS chipset, selecting CPU firmware corresponding to the installed CPU from a plurality of CPU platform firmware stored on a first memory, and loading the CPU firmware into a shared portion of a second memory coupled to the BIOS chipset, where the shared portion of the second memory is configured to store the CPU firmware as secondary CPU firmware.
-
公开(公告)号:US20240311199A1
公开(公告)日:2024-09-19
申请号:US18120646
申请日:2023-03-13
Applicant: Advanced MICRO DEVICES, INC.
Inventor: Nicolai Haehnle , Mark Leather , Brian Emberling , Michael John Bedy , Daniel Schneider
Abstract: A program code executing on a processing system includes one or more instructions each identifying a workload that includes a plurality of waves and each identifying resource allocations for the plurality of waves of the workgroup. In response to receiving an instruction identifying a workload and resource allocations for the plurality of waves of the workgroup, a processor allocates a first set of processing resources to a compute unit of the processor based on the resource allocations for the plurality of waves. The compute unit then performs operations for the workgroup using the allocated set of processing resources.
-
公开(公告)号:US12094853B2
公开(公告)日:2024-09-17
申请号:US17963729
申请日:2022-10-11
Applicant: ADVANCED MICRO DEVICES, INC. , ATI TECHNOLOGIES ULC
Inventor: Bryan Black , Michael Z. Su , Gamal Refai-Ahmed , Joe Siegel , Seth Prejean
IPC: H01L23/48 , H01L23/00 , H01L25/065
CPC classification number: H01L25/0657 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/03 , H01L24/11 , H01L2224/0233 , H01L2224/02331 , H01L2224/0401 , H01L2224/05022 , H01L2224/05095 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05567 , H01L2224/0557 , H01L2224/05572 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/06181 , H01L2224/13022 , H01L2224/13025 , H01L2224/131 , H01L2224/17181 , H01L2225/06548 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2224/131 , H01L2924/014 , H01L2924/00014 , H01L2224/05552 , H01L2924/351 , H01L2924/00 , H01L2924/14 , H01L2924/00
Abstract: A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic contact with the first ends of the first plurality of conductive vias.
-
公开(公告)号:US12093181B2
公开(公告)日:2024-09-17
申请号:US17852296
申请日:2022-06-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Chintan S. Patel , Alexander J. Branover , Benjamin Tsien , Edgar Munoz , Vydhyanathan Kalyanasundharam
IPC: G06F12/08 , G06F12/0811 , G06F12/0864 , G06F12/0871
CPC classification number: G06F12/0871 , G06F12/0811 , G06F12/0864
Abstract: A technique for operating a cache is disclosed. The technique includes based on a workload change, identifying a first allocation permissions policy; operating the cache according to the first allocation permissions policy; based on set sampling, identifying a second allocation permissions policy; and operating the cache according to the second allocation permissions policy.
-
-
-
-
-
-
-
-
-