公开(公告)号：US20200227588A1

公开(公告)日：2020-07-16

申请号：US16640063

申请日：2018-08-21

Applicant: Osram OLED GmbH

Inventor： Fabian Kopp ,  Attila Molnar

IPC: H01L33/08 ,  H01L33/38 ,  H01L33/62

Abstract: A radiation-emitting semiconductor chip may include a semiconductor body having a first layer, a second layer, and an active layer therebetween. The active layer may be subdivided into a multiplicity of segments in a plan view of the chip. A separating structure may be formed in the semiconductor body between neighboring segments. The multiplicity of segments may be electrically connected to one another in series and/or in parallel. At least one segment may be assigned a first contact layer having a first contact finger structure and a second contact layer having a second contact finger structure. There may be a direct electrical contact between the first contact layer and the second contact layer in places.

公开(公告)号：US20200212343A1

公开(公告)日：2020-07-02

申请号：US16813922

申请日：2020-03-10

Applicant: OSRAM OLED GmbH

Inventor： Erwin Lang ,  Thomas Wehlus ,  Arne Fleißner ,  Sebastian Wittmann

IPC: H01L51/52

Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.

公开(公告)号：US20200185568A1

公开(公告)日：2020-06-11

申请号：US16792608

申请日：2020-02-17

Applicant: OSRAM OLED GmbH

Inventor： Daniel Riedel ,  Andreas Rausch ,  Ulrich Niedermeier

IPC: H01L33/40 ,  H01L33/20 ,  H01L25/04 ,  H01L27/32

Abstract: A light-emitting component a first layer stack configured to generate light, at least one additional layer stack configured to generate light, where each of the first layer stack and the at least one additional layer stack are separately drivable from one another and where an auxiliary structure is arranged between the first layer stacks and the at least one additional layer stacks.

公开(公告)号：US10672962B2

公开(公告)日：2020-06-02

申请号：US16091080

申请日：2017-04-10

Applicant: OSRAM OLED GMBH

Inventor： Siegfried Herrmann ,  Michael Völkl

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/48 ,  H01L27/15 ,  H01L33/00 ,  H01L33/22 ,  H01L33/32 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L25/075

Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.

公开(公告)号：US20200168773A1

公开(公告)日：2020-05-28

申请号：US16635566

申请日：2018-07-31

Applicant: OSRAM OLED GmbH

Inventor： Norbert HARENDT

IPC: H01L33/50

Abstract: An optoelectronic component may include a layer sequence having an active layer configured to emit an electromagnetic primary radiation and a conversion element arranged in the beam path of the primary radiation. The conversion element may include a conversion layer and a conversion potting arranged over the conversion layer. The conversion layer may include a first matrix material and a converter material, and the conversion potting may include a second matrix material and a converter material. There may be a jump in concentration of converter material between the conversion layer and the conversion potting.

公开(公告)号：US20200168766A1

公开(公告)日：2020-05-28

申请号：US16630495

申请日：2018-07-12

Applicant: Osram OLED GmbH

Inventor： Tansen VARGHESE ,  Stefan ILLEK

IPC: H01L33/22 ,  H01L33/00 ,  H01L33/30 ,  H01L33/38

Abstract: An optoelectronic component may include a semiconductor body and a radiation transmissive bonding layer. The semiconductor body may include a first region of a first conductivity type, a second region of a second conductivity type, and an active region. The active region may be disposed between the first region and the second region. The first region may include a recess and a contact region adjacent to the recess. The active region may be arranged to emit electromagnetic radiation. The semiconductor body may have a first radiation exit surface at a main surface of the second region remote from the active region, and a portion of the electromagnetic radiation may exit the semiconductor body through the first radiation exit surface. The semiconductor body may include a first electrical connection layer and a second electrical connection layer where the second electrical connection layer is arranged at least partially in the recess.

公开(公告)号：US10651338B2

公开(公告)日：2020-05-12

申请号：US15759972

申请日：2016-10-04

Applicant: OSRAM OLED GMBH

Inventor： Dominik Scholz

IPC: H01L33/00 ,  H01L31/0203 ,  H01L31/0304 ,  H01L31/18 ,  H01L33/32 ,  H01L33/54 ,  H01L21/683 ,  H01L31/0352 ,  H01L33/06 ,  H01L33/62

Abstract: A method for fabricating an optoelectronic semiconductor component is disclosed. A semiconductor chip is produced by singularizing a wafer. The semiconductor chip comprises a substrate and a semiconductor layer sequence with an active layer applied to a main side of the substrate. The semiconductor layer sequence has an active region for emission or absorption of radiation and a sacrificial region arranged next to the active region. The sacrificial region in the finished semiconductor component is not intended to emit or absorb radiation. A trench, introduced into the semiconductor layer sequence, penetrates the active layer and separates the active region from the sacrificial region. The semiconductor chip with the semiconductor layer sequence is applied on a carrier. The substrate is detached from the active region of the semiconductor layer sequence. In the sacrificial region, the semiconductor layer sequence remains mechanically connected to the substrate.

公开(公告)号：US10630057B2

公开(公告)日：2020-04-21

申请号：US16092495

申请日：2017-03-27

Applicant: OSRAM OLED GMBH

Inventor： Bernhard Stojetz ,  Georg Brüderl

IPC: H01S5/32 ,  H01S5/042 ,  H01S5/22 ,  H01S5/323

Abstract: In an embodiment a laser include a semiconductor layer sequence having an active zone for generating radiation and an electrical contact web arranged on a top side of the semiconductor layer sequence, wherein the contact web is located on the top side only in an electrical contact region or is in electrical contact with the top side only in the contact region so that the active zone is supplied with current only in places during operation, wherein the contact web comprises a plurality of metal layers at least partially stacked one above the other, wherein at least one of the metal layers comprises a structuring so that the at least one metal layer only partially covers the contact region and has at least one opening or interruption, and wherein the structuring reduces stresses of the semiconductor layer sequence on account of different thermal expansion coefficients of the metal layers.

公开(公告)号：US10607969B2

公开(公告)日：2020-03-31

申请号：US16098212

申请日：2017-05-09

Applicant: OSRAM OLED GmbH

Inventor： Jürgen Moosburger ,  Frank Singer ,  Thomas Schwarz ,  Alexander Martin

IPC: H01L25/075 ,  G09F9/302 ,  H01L33/58 ,  H01L33/54 ,  G09F9/33 ,  G09F27/00 ,  H01L33/62 ,  H01L33/48

Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

公开(公告)号：US10605422B2

公开(公告)日：2020-03-31

申请号：US15651508

申请日：2017-07-17

Applicant: OSRAM OLED GmbH

Inventor： Ulrich Kastner-Jung ,  Markus Klein ,  Stan Maes ,  Romana Sigl ,  Annette Haid ,  Stephan Lintner ,  Julian Herget ,  Gregor Matjan

IPC: F21S10/02 ,  F21V23/04 ,  F21V33/00 ,  G04C19/02 ,  G04G11/00 ,  G04G13/02 ,  H05B33/08 ,  H05B33/22 ,  H05B37/00 ,  H05B37/02 ,  B60Q3/74 ,  B60Q3/30 ,  B60Q1/26 ,  B60Q7/00 ,  B05B1/18 ,  F24D19/06 ,  F21S8/00 ,  F21S8/04 ,  F21S8/06 ,  F21S9/03 ,  F21Y105/00 ,  F21Y115/15 ,  F21Y113/10 ,  F21Y113/20 ,  H01L51/50

Abstract: An organic light-emitting diode comprising an organic layer sequence, a radiation exit area and an encapsulation. The organic layer sequence comprises at least one radiation-emitting region which generates electromagnetic radiation in the spectral range from infrared radiation to UV radiation during operation. The radiation exit area is structured, so that the electromagnetic radiation has a directional emission profile. The encapsulation forms a seal of the organic layer sequence against environmental influences.