DRIVING ASSEMBLY WITH REDUCED SIZE AND NOISE, CAMERA MODULE AND ELECTRONIC DEVICES HAVING THE SAME

    公开(公告)号:US20230066451A1

    公开(公告)日:2023-03-02

    申请号:US17731542

    申请日:2022-04-28

    Abstract: A drive assembly with reduced size and reduced noise includes a bottom box, an elastic member, a movable plate, a PCB board, and a plurality of shape memory alloy wires. The bottom box comprises a bottom plate and a plurality of side plates. The plurality of side plates is arranged on a side of the bottom plate to form a receiving groove, the plurality of side plates defines a position groove connects to the receiving groove. The elastic member, the movable plate, the plurality of shape memory alloy wires, and a partial of the rigid printed circuit board are located within the receiving groove, another partial of the rigid printed circuit board is disposed with the position groove. The elastic member connects between the bottom plate and the movable plate, the plurality of shape memory alloy wires connects between the movable plate and the rigid printed circuit board.

    LENS PROTECTION STRUCTURE AND ELECTRONIC DEVICE HAVING LENS PROTECTION STRUCTURE

    公开(公告)号:US20220221618A1

    公开(公告)日:2022-07-14

    申请号:US17195898

    申请日:2021-03-09

    Abstract: A lens protection structure includes a base, a polyester film, a first silica gel, a second silica gel, and a protective cover. Each of the base, the polyester film, the first silica gel, and the second silica gel defines a through hole for cooperatively receiving a lens. The polyester film is coupled to a surface of the base, and the first silica gel is coupled to a surface of the base opposite the polyester film. The second silica gel is coupled to the polyester film. The protective cover is coupled to the second silica gel and seals a receiving cavity within the base. At least one air escape channel is defined in the base. The at least one air escape channel communicates the receiving cavity of the base to an exterior of the lens protection structure.

    ANTI-TERMBLE MECHANISM, CAMERA MODULE USING SAME, AND ELECTRONIC DEVICE

    公开(公告)号:US20210132406A1

    公开(公告)日:2021-05-06

    申请号:US16699971

    申请日:2019-12-02

    Abstract: A mechanism to render a lens module immune to trembling and jarring includes a carrier, a support element movably mounted on the carrier, and a driving element. The driving element includes a conductive structure arranged on the carrier, a plurality of positive pads on the carrier, and a plurality of shape memory alloy (SMA) wires. The SMA wires are electrically connected to the positive pads and the conductive structure. When currents flow into the SMA wires via the positive pads, the SMA wires deform upon heating and pull on the conductive structure, thus the conductive structure drives the support element to rotate in a plane parallel to the carrier. A lens module and an electronic device including the mechanism are also disclosed.

    HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE

    公开(公告)号:US20210127527A1

    公开(公告)日:2021-04-29

    申请号:US16711734

    申请日:2019-12-12

    Abstract: A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

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