公开(公告)号：US07939994B2

公开(公告)日：2011-05-10

申请号：US12300831

申请日：2007-05-16

Applicant: Mike Kunze ,  Ingo Daumiller

Inventor： Mike Kunze ,  Ingo Daumiller

IPC: H01L41/053 ,  H01L41/047

CPC classification number: F04B43/046 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/016 ,  B81B2201/032 ,  H01F21/04 ,  H01F2007/068 ,  H01G5/18 ,  H01L41/047 ,  H01L41/0933 ,  H01L41/094 ,  H01L41/0973

Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

Abstract translation: 半导体致动器包括基板，弯曲结构，其连接到基板基底并且可相对于基板基底至少部分地偏转。 该弯曲结构基于主要III族元素的氮化物和至少两个给弯曲结构施加电压或施加电压的电流的电源触点而具有半导体化合物。 至少两个电源触点分别设置在弯曲结构上和/或与后者集成在一起的彼此间隔开。

公开(公告)号：US07924574B2

公开(公告)日：2011-04-12

申请号：US12326793

申请日：2008-12-02

Applicant: Yoshihiko Suzuki ,  Hiroshi Konishi ,  Madoka Nishiyama

Inventor： Yoshihiko Suzuki ,  Hiroshi Konishi ,  Madoka Nishiyama

IPC: H05K1/11

CPC classification number: H01F17/0006 ,  B81B7/0003 ,  B81B2201/014 ,  H01F27/06 ,  H01G5/18 ,  H05K1/147 ,  H05K1/165 ,  H05K3/4691

Abstract: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.

Abstract translation: 公开了高频电路部件，其中降低了高频电路元件与基板之间的寄生电容，提高了机械强度。 示例性部件具有导电基板，作为高频电路元件的线圈，包括安装有线圈的薄电介质膜的安装基板和将安装基板耦合到基板的支撑板。 由于支撑板的故意翘曲，安装板被联接以使其相对于基板漂浮。

公开(公告)号：US20110063068A1

公开(公告)日：2011-03-17

申请号：US12828268

申请日：2010-06-30

Applicant: Shumin Zhang ,  Mona Zaghloul ,  Wansheng Su ,  Anis Nurashikin Nordin

Inventor： Shumin Zhang ,  Mona Zaghloul ,  Wansheng Su ,  Anis Nurashikin Nordin

IPC: H01H37/02

CPC classification number: B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H1/0036 ,  H01H2001/0084 ,  H01H2037/008

Abstract: A radio frequency (RF) micro electromechanical system (MEMS) switch formed on a substrate (e.g., a CMOS substrate). The RF MEMS switch includes a micromechanical member including a flexible switch membrane configured to move between an on state and an off state of the RF MEMS switch. The flexible switch membrane includes a first set of fingers on a sidewall thereof to be vertically coupled with a second set of fingers formed at an output of the RF MEMS switch on the substrate, and an actuation member in operable communication with the micromechanical member and configured to thermally actuate the micromechanical member such that the first set of fingers electrically couple with the second set of fingers upon thermal actuation of the micromechanical member to enable transmission of an RF signal.

Abstract translation: 形成在基板（例如CMOS基板）上的射频（RF）微机电系统（MEMS）开关。 RF MEMS开关包括微机械构件，其包括被配置为在RF MEMS开关的导通状态和断开状态之间移动的柔性开关膜。 柔性开关膜包括在其侧壁上的第一组指状物，以与形成在基板上的RF MEMS开关的输出端处的第二组指状件垂直耦合，以及与微机械构件可操作地连通的致动构件， 以热致动所述微机械构件，使得所述第一组指状件在所述微机械构件的热致动时与所述第二组指状物电耦合以使得能够传输RF信号。

公开(公告)号：US20110049649A1

公开(公告)日：2011-03-03

申请号：US12548697

申请日：2009-08-27

Applicant: Felix P. ANDERSON ,  Thomas L. McDEVITT ,  Anthony K. STAMPER

Inventor： Felix P. ANDERSON ,  Thomas L. McDEVITT ,  Anthony K. STAMPER

IPC: H01L21/311 ,  H01L21/306 ,  H01L29/84 ,  G06F17/50

CPC classification number: B81C1/0015 ,  B81B3/0018 ,  B81B2201/014 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  G06F17/5068 ,  H01L21/302

Abstract: Integrated MEMS switches, design structures and methods of fabricating such switches are provided. The method includes forming at least one tab of sacrificial material on a side of a switching device which is embedded in the sacrificial material. The method further includes stripping the sacrificial material through at least one opening formed on the at least one tab which is on the side of the switching device, and sealing the at least one opening with a capping material.

Abstract translation: 提供集成的MEMS开关，设计结构和制造这种开关的方法。 该方法包括在嵌入在牺牲材料中的开关装置的侧面上形成牺牲材料的至少一个突片。 该方法还包括通过形成在开关装置侧面上的至少一个突片上的至少一个开口剥离牺牲材料，并用封盖材料密封至少一个开口。

公开(公告)号：US20110006874A1

公开(公告)日：2011-01-13

申请号：US12919618

申请日：2009-02-23

Applicant: Mike Becker ,  Dietmar Lütke-Notarp ,  Klaus Froehner

Inventor： Mike Becker ,  Dietmar Lütke-Notarp ,  Klaus Froehner

IPC: H01H37/46 ,  H01L21/302 ,  H02N10/00

CPC classification number: H01H61/04 ,  B81B2201/014 ,  B81B2201/031 ,  B81B2203/051 ,  B81C1/00682 ,  H01H2001/0047 ,  H01H2001/0078 ,  H01H2061/006 ,  H01H2061/008

Abstract: A micromechanical actuator includes a movable first spring element having metal and/or silicon. The first spring element is fitted at a first point and can move freely at a second point. A second spring element connected to the first spring element has silicon and is partially arranged on an electrically insulating material which is applied to a substrate. The second spring element is arranged at a distance from the substrate above the substrate on a first plane, and the first spring element is arranged above the second spring element on a second plane which is at a distance from the first plane such that the first and second spring elements can move with respect to the substrate. The actuator has a third spring element which is mechanically coupled to the first spring element. The elastic deformation of the second spring element can be induced by a length change of the third spring element.

Abstract translation: 微机械致动器包括具有金属和/或硅的可移动的第一弹簧元件。 第一弹簧元件安装在第一点上，并可在第二点自由移动。 连接到第一弹簧元件的第二弹簧元件具有硅并且部分地布置在施加到基板的电绝缘材料上。 第二弹簧元件在第一平面上与衬底上方的基板一定距离设置，并且第一弹簧元件布置在第二平面上方的第二平面上，第二平面与第一平面成一定距离，使得第一和 第二弹簧元件可以相对于基底移动。 致动器具有机械地联接到第一弹簧元件的第三弹簧元件。 第二弹簧元件的弹性变形可以由第三弹簧元件的长度变化引起。

公开(公告)号：US20100314669A1

公开(公告)日：2010-12-16

申请号：US12813832

申请日：2010-06-11

Applicant: HERB HE HUANG

Inventor： HERB HE HUANG

IPC: H01L29/84 ,  H01L21/77

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81C1/00246 ,  B81C2203/0714 ,  H01H1/0036

Abstract: The present invention discloses a capacitive MEMS switch on top of a semiconductor substrate containing a CMOS driving circuitry. The capacitive MEMS switch disclosed includes: 1) a semiconductor substrate containing a driving circuitry inside, and first and second conductors as well as a bottom electrode on top; 2) a suspended composite beam above and anchored onto the semiconductor substrate, containing a top electrode aligned to the bottom electrode with a first vertical distance, a top conductor, capped by a dielectric layer, having a first and second contact tips aligned with the first and second bottom conductors with a second vertical distance differentially smaller than the first vertical distance. The electrostatic attraction generated between the top electrode and the bottom electrode pulls the first and second contact tips in physical contact with and electrically connects the first and second bottom conductors through the top conductor.

Abstract translation: 本发明公开了一种在包含CMOS驱动电路的半导体衬底之上的电容MEMS开关。 所公开的电容MEMS开关包括：1）在其内部包含驱动电路的半导体衬底，以及顶部的第一和第二导体以及底部电极; 2）在半导体衬底之上并锚固在半导体衬底上的悬挂复合梁，其包含具有第一垂直距离的与底部电极对准的顶部电极，由电介质层封盖的顶部导体，具有与第一垂直距离对准的第一和第二接触尖端 以及具有小于第一垂直距离的第二垂直距离的第二底部导体。 在顶部电极和底部电极之间产生的静电吸引力拉动第一和第二接触尖端物理接触并通过顶部导体电连接第一和第二底部导体。

公开(公告)号：US20090233058A1

公开(公告)日：2009-09-17

申请号：US12379801

申请日：2009-03-02

Applicant: Kenji Hata ,  Yuuhei Hayamizu ,  Takeo Yamada

Inventor： Kenji Hata ,  Yuuhei Hayamizu ,  Takeo Yamada

IPC: B32B5/16 ,  C23C16/44

CPC classification number: B81C1/0015 ,  B81B2201/014 ,  Y10T428/24802

Abstract: An arbitrary three-dimensional shaped structure which is integrally formed with only carbon nanotubes having desired physical properties and electrical properties, and anisotropy, and a method for producing the same are disclosed. The carbon nanotube structure is constituted of a carbon nanotube aggregate comprising plural carbon nanotubes oriented in the same direction, wherein the carbon nanotube has weight density of 0.1 g/cm3 or more, the structure comprises a first part contacting a base, a second part separated from the base, and a curved third part which connects the first part and the second part, and orientation axes of at least a part of carbon nanotubes in the first part, the second part and the third part are continued.

Abstract translation: 公开了与仅具有所需物理性能和电性能的碳纳米管一体形成的任意三维形结构，各向异性及其制造方法。 碳纳米管结构由包含沿相同方向取向的多个碳纳米管的碳纳米管集合体构成，其中碳纳米管具有0.1g / cm 3以上的重量密度，该结构包括与基底接触的第一部分，分离的第二部分 以及连接第一部分和第二部分的弯曲的第三部分和第一部分，第二部分和第三部分中的至少一部分碳纳米管的取向轴继续。

公开(公告)号：US07567018B2

公开(公告)日：2009-07-28

申请号：US11400407

申请日：2006-04-10

Applicant: Takashi Kawakubo ,  Toshihiko Nagano ,  Kazuhide Abe ,  Michihiko Nishigaki

Inventor： Takashi Kawakubo ,  Toshihiko Nagano ,  Kazuhide Abe ,  Michihiko Nishigaki

IPC: H01L41/08

CPC classification number: B81B3/0021 ,  B81B2201/014 ,  B81B2201/045 ,  G02B26/0858 ,  H01G5/18 ,  H01G5/40 ,  H01H2057/006

Abstract: A micro-mechanical device includes a first piezoelectric actuator including a piezoelectric film, and lower and upper electrodes interleaving the piezoelectric film, and extending from a first fixing part on a substrate to a first operating end, and a second piezoelectric actuator connected to the first piezoelectric actuator via a connecting part at the first operating end of the first piezoelectric actuator, and extending from the connecting part to a second operating end, the second piezoelectric actuator being shorter than the first piezoelectric actuator.

Abstract translation: 微机械装置包括：第一压电致动器，其包括压电膜，下电极和上电极交错压电膜，并从衬底上的第一固定部分延伸到第一操作端;以及第二压电致动器， 压电致动器经由第一压电致动器的第一操作端处的连接部分并且从连接部分延伸到第二操作端，第二压电致动器比第一压电致动器短。

公开(公告)号：US20070207584A1

公开(公告)日：2007-09-06

申请号：US11364334

申请日：2006-03-01

Applicant: Alok Paranjpye ,  Douglas Thompson

Inventor： Alok Paranjpye ,  Douglas Thompson

IPC: H01L21/8222

CPC classification number: B81C1/0069 ,  B81B2201/014 ,  B81C2201/018 ,  G03F7/40 ,  H01H61/04 ,  H01H2061/008

Abstract: A method for curing an epoxy-based photoresist uses a continuously varying temperature profile, to continuously raise the kinetic energy of the monomers involved in the curing process, allowing them to cross-link. By using the continuously varying temperature profile, the maximum temperature to achieve a more completely cured film is reduced, as is the total processing time. In addition, curing using the continuously varying temperature profile is a single step method, rather than a multi-step method of the prior art, significantly simplifying the process flow for producing the cured structures. The cured structures may have mechanical properties which render them suitable as functional elements of various MEMS devices, including rigid, dielectric tethers used in MEMS thermal switches, for example.

Abstract translation: 固化环氧系光致抗蚀剂的方法使用连续变化的温度分布，以连续提高参与固化过程的单体的动能，从而使它们交联。 通过使用连续变化的温度曲线，总的处理时间也减少了实现更完全固化的膜的最高温度。 此外，使用连续变化的温度分布的固化是单步法，而不是现有技术的多步法，显着简化了用于生产固化结构的工艺流程。 固化的结构可以具有机械性质，使得它们适合作为各种MEMS装置的功能元件，例如包括用于MEMS热开关的刚性介电系绳。

公开(公告)号：US20070146095A1

公开(公告)日：2007-06-28

申请号：US11317960

申请日：2005-12-22

Applicant: Tsung-Kuan Allen Chou ,  Quan Tran

Inventor： Tsung-Kuan Allen Chou ,  Quan Tran

IPC: H01P1/10

CPC classification number: H01H59/0009 ,  B81B3/0013 ,  B81B2201/014 ,  H01H1/5822 ,  H01H2059/0063 ,  H01H2059/0072

Abstract: An electromechanical switch includes an actuation electrode, a cantilever electrode, a contact, a suspended conductor, and a signal line. The actuation electrode is mounted to a substrate, the cantilever electrode is suspended proximate to the actuation electrode, and the contact is mounted to the cantilever electrode. The suspended conductor is coupled to the contact and straddles a portion of the cantilever electrode. The signal line is positioned to form a closed circuit with the contact and the suspended conductor when an actuation voltage is applied between the actuation electrode and the cantilever electrode.

Abstract translation: 机电开关包括致动电极，悬臂电极，触点，悬挂导体和信号线。 致动电极安装在基板上，悬臂电极悬挂在致动电极附近，接触件安装在悬臂电极上。 悬挂的导体耦合到接触件并跨越悬臂电极的一部分。 当在致动电极和悬臂电极之间施加致动电压时，信号线被定位成与触点和悬挂导体形成闭合电路。