Abstract:
A double-sided heat-sensitive adhesive sheet comprises a support provided with a release layer on one side thereof and heat-sensitive adhesive layers which are formed on both sides of the support and have sufficient adhesion to the support but can be easily peeled apart from the release layer, wherein the release layer and the heat-sensitive adhesive layer has at their interface a 180° peeling resistance of 10-30 g/50 mm in a peel test performed at a peeling speed of 500 mm/min. in an atmosphere of 20° C. and 65% RH. The adhesive sheet is interposed between each opposed pair of information-recorded faces of recording material having on one side at least two spaces for information-recording, and heat is applied to the resultant assembly to make a laminate. The laminate can have a size and weight suitable for mailing as a postcard, and can bear confidential information on the inside and be peeled apart when desired.
Abstract:
A dimensionally stable carpet underlay manufactured from needle-punched fibers arranged to form a non-woven felt fabric, to which an acrylic latex pressure sensitive adhesive is applied by a dipping process that coats the surfaces of the fibers and fills the interstices between the fibers. The acrylic adhesive is applied to the felt substrate in a dip and squeeze operation, which passes a felt web through a trough of adhesive and then through an excess adhesive removal station, after which, a protective releasable polymer film is applied to the exposed adhesive surfaces prior to curing step. The acrylic adhesive is selected to exhibit sufficient tackiness to secure the carpet in place, but allowing for easy removal and not leaving a residue after removal of the carpet from the underlay or removal of the underlay from the underlying supporting floor surface.
Abstract:
An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200null C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 nullm. A lead frame for semiconductor comprises a lead frame and an adhesive film for semiconductor according to the present invention. A semiconductor device comprises a lead frame and a semiconductor element, in which the lead frame and the semiconductor element are adhered to each other via an adhesive film for semiconductor according to the present invention.
Abstract:
A doublefaced pressure-sensitive adhesive sheet including an inner pressure-sensitive adhesive layer is provided. The adhesive layer includes an outer silicone-series release liner and an outer non-silicon-series release liner on the opposite side of the sheet from the silicone-series release liner. The non-silicone-series release liner includes a plastic film having at least three layers, wherein the plastic film including a releasing layer which is a surface layer including a polyethylene film, a surface film layer which is the other surface layer and is equal in coefficient of linear thermal expansion to the releasing layer, and a reinforcing layer having a melting point of 120° C. or higher as an interlayer.
Abstract:
A single- or double-sided pressure-sensitive adhesive tape having an elastomeric backing layer, characterized in that a) the framework substance of the backing layer consists of natural rubber or of a mixture of natural rubber and at least one styrene-butadiene rubber, b) an essential constituent of the backing layer is an electron beam-crosslinkable, polyfunctional crosslinker, c) a pressure-sensitive adhesive is applied to one or both sides of the backing layer, and d) between backing layer and pressure-sensitive adhesive there is an interlayer of a polyamide or of a mixture of polyamides.
Abstract:
Conformable pressure-sensitive adhesive tapes which comprise a layer of polymeric foam in the backing and may be adhered firmly to a substrate and thereafter removed therefrom after only being stretched at an angle no greater than about 35° from the surface of the substrate. Articles for mounting an object such as a picture to a surface such as a wall comprising a pressure-sensitive adhesive tape of the invention are also described.
Abstract:
A waterproofing membrane is provided which includes a waterproof synthetic resin film presenting opposed first and second surfaces, and an inner bitumen adhesive supported on the first surface of the film. The membrane is manufactured by heating the bitumen adhesive and applying it to a web of the waterproof synthetic resin film. As such, the resulting membrane includes an adhesive possessing a coating temperature at which the adhesive can be applied to the film as a viscous liquid, and a film possessing a still higher transition temperature that permits the film to function as a substrate for the bitumen adhesive during manufacture.
Abstract:
A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.
Abstract:
A vinyl graphic marking film or label coated with a pressure sensitive acrylic adhesive designed to achieve high or permanent adhesion to polymeric low energy surfaces is disclosed. In addition to good adhesion to low energy surfaces, the graphic marking film or label may have microperforated or micro-rough edges which initiate tearing when removal is attempted. The article maintains flexibility and film strength for easy fabrication in graphic marking film or label manufacture.
Abstract:
A double-faced adhesive tape without release liner is provided. A weakly adhesive layer 12 having a relatively weak adhesive force is formed on one face of a resin film 11 and a strongly adhesive layer 13 having a stronger adhesive force than that of the weakly adhesive layer 12 is formed on the other face and the assembly is formed into a roll of a double-faced adhesive tape 5. The weakly adhesive layer 12 is formed after the surface of the resin film 11 has been subjected to a rubbing treatment to increase the adhesive force between them, so that the weakly adhesive layer 12 and the strongly adhesive layer 13 are separated without using a release liner when the tape is rolled up.