Abstract:
A system for fabricating a radiation-cured structure is provided. The system includes a radiation-sensitive material configured to at least one of initiate, polymerize, crosslink and dissociate with exposure to radiation. At least one radiation source is configured to project a radiation beam toward the radiation-sensitive material. A smart glass device is disposed between the radiation-sensitive material and the at least one radiation source. The smart glass device includes at least one switchable layer selectively operable from an active state to an inactive state. The smart glass device is configured to expose the radiation-sensitive material to a desired exposure pattern when in one of the active state and the inactive state. A method for fabricating the radiation-cured structure is also provided.
Abstract:
A method of making a relief image printing element from a photosensitive printing blank is provided. A photosensitive printing blank with a laser ablatable layer disposed on at least one photocurable layer is ablated with a laser to create an in situ mask. The printing blank is then exposed to at least one source of actinic radiation through the in situ mask to selectively cross link and cure portions of the photocurable layer. Diffusion of air into the at least one photocurable layer is limited during the exposing step and preferably at least one of the type, power and incident angle of illumination of the at least one source of actinic radiation is altered during the exposure step. The resulting relief image comprises a plurality of dots and a dot shape of the plurality of dots that provide optimal print performance on various substrates, including corrugated board.
Abstract:
A method to fabricate a tilted logpile photonic crystal requires only two lithographic exposures and does not require mask repositioning between exposures. The mask and photoresist-coated substrate are spaced a fixed and constant distance apart using a spacer and the stack is clamped together. The stack is then tilted at a crystallographic symmetry angle (e.g., 45 degrees) relative to the X-ray beam and rotated about the surface normal until the mask is aligned with the X-ray beam. The stack is then rotated in plane by a small stitching angle and exposed to the X-ray beam to pattern the first half of the structure. The stack is then rotated by 180° about the normal and a second exposure patterns the remaining half of the structure. The method can use commercially available DXRL scanner technology and LIGA processes to fabricate large-area, high-quality tilted logpile photonic crystals.
Abstract:
A system according to an embodiment of the present invention comprises a movable stage having a top surface. A photosensitive material may be deposited on the top surface and a mask may be placed on the photosensitive material. A vessel, having a top portion, one or more flexible sides, and a transparent base, is configured to be placed adjacent to the mask. The base is configured to be movable relative to the top portion of the vessel. In this way, the movable stage, photosensitive material, and mask may move in conjunction with the base of the vessel.
Abstract:
A method for producing surface convexes or concaves enabling easy and highly precise formation of desired convex/concave shapes using a photomask is provided.A mask member 20 having light transmitting sections and non-light transmitting sections is disposed over one side of a photosensitive film 10 consisting of a photosensitive resin composition with an interval with respect to the photosensitive film 10, and a light diffusing member 30 is disposed on the opposite side of the photosensitive film 10 across the mask member 20. Light is irradiated from a light source disposed on the opposite side of the mask member 20 across the light diffusing member 30 to subject the photosensitive film 10 to light exposure through the light diffusing member 30 and the light transmitting sections of the mask member 20. Exposed portions or unexposed portions of the photosensitive film 10 are removed by development to produce convexes or concaves on the photosensitive film 10 in shapes determined by shapes of the exposed portions or unexposed portions. In the light exposure, light exposure conditions such as haze of the light diffusing member 30 are controlled to control the shapes of the exposed portions or unexposed portions.
Abstract:
An exposure mask 24, includes a quartz (transparent) substrate 20, a film 21 formed on the quartz substrate 20, a rectangular main feature 21a formed in the film 21, a first assist feature 21b formed in the film 21 away from the main feature 21a and having a size that is not resolved as a rectangle that has a long side 21e opposing to one side 21d of the main feature 21d, and a second assist feature 21c formed in the film 21 and positioned on a virtual prolonged line L of a diagonal of the main feature 21a and having a size that is not resolved.
Abstract:
In a lithographic proximity method for wiring an end or internal side surface of a substrate the required exposure of strips (76), defining the wiring pattern, is performed by means of a mask (70) comprising a diffraction structure (74) to deflect exposure radiation (b) to the side surface. An exposure beam, which is perpendicularly incident on the mask, is used so that enhanced tolerance for proximity gap width variations is obtained. The method allows manufacture of accurate and fine wiring.
Abstract:
What is described is a lithographic method for fabricating three-dimensional structures on the micrometric and submicro-metric scale, including the operations of: depositing a layer of a first resist on a substrate; depositing a layer of a second resist on the layer of the first resist; forming a pattern of the second resist by lithography; depositing a further layer of the first resist on the previous layers; and forming a pattern of the first resist by lithography. The second resist is sensitive to exposure to charged particles or to electromagnetic radiation in a different way from the first; in other words, it is transparent to the particles or to the electromagnetic radiation to which the first resist is sensitive, and therefore the processes of exposure and development of the two resists are mutually incompatible to the extent that the exposure and development of one does not interfere with the exposure and development of the other.
Abstract:
A method of manufacturing a master plate includes the steps of forming a photoresist film on a substrate, disposing a photomask having a plurality of island radiation shields on the photoresist film followed by integrating the photomask and the photoresist film, applying light from a light source to the photoresist film through the photomask for selectively exposing the photoresist film, and developing the photoresist film to form a master plate, in which the method includes irradiating the photoresist film with the light from plural directions through the photomask to selectively expose the photoresist film from the respective directions.
Abstract:
The present inventors have developed an accurate method for forming a plurality of images on a substrate. The present method provides an improved pattern replication technique that provides submicron resolution, for example 20 nm or less, especially 10 nm or less. The method may involve moving a structured beam of energetic radiation across a target substrate. The motion of an image of the template mask on the substrate is achieved by tilting a mask and substrate assembly relative to the axis of the incident beam. The technique does not require high precision motion of the template mask relative to the target substrate. The energetic radiation may comprise energetic particles. The technique is insensitive to particle energy and can be applied to uncharged, neutral particles.