公开(公告)号：US20080029405A1

公开(公告)日：2008-02-07

申请号：US11829946

申请日：2007-07-29

Applicant: Lex KOSOWSKY ,  Robert Fleming

Inventor： Lex KOSOWSKY ,  Robert Fleming

IPC: C25C1/12

CPC classification number: H01C17/06586 ,  B82Y10/00 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一个或多个实施方案提供了组合物，其包括（i）导电或半导电的有机材料，和（ii）有机材料以外的导体和/或半导体颗粒。 有机材料和导体和/或半导体颗粒被组合以提供组合物的特征是：（i）不存在超过特征电压水平的电压的电介质，以及（ii）通过施加超过 特征电压电平。

公开(公告)号：US07268077B2

公开(公告)日：2007-09-11

申请号：US11292690

申请日：2005-12-02

Applicant: Chi-Won Hwang

Inventor： Chi-Won Hwang

IPC: H01L21/44

CPC classification number: H01L24/73 ,  B82Y10/00 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49877 ,  H01L23/585 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/1358 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/328 ,  H05K2201/026 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus including an interconnect structure having a surface, a plurality of nanotubes disposed adjacent to the surface, and a metallic layer disposed adjacent to the surface and substantially including the nanotubes. An assembly may include a first embodiment of an apparatus as described, and may further include a second such embodiment at least one of physically and electrically coupled to the first embodiment.

公开(公告)号：US20070148467A1

公开(公告)日：2007-06-28

申请号：US11614505

申请日：2006-12-21

Applicant: Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

Inventor： Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

IPC: B32B9/04

CPC classification number: H05K1/0373 ,  B82Y10/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/31504 ,  H01L2924/00

Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.

Abstract translation: 热管理电路材料包括导电层; 介电层，其包含聚合物基质和导热的不导电的颗粒填料，其中所述电介质层设置在所述导电层上并至少部分地与所述导电层接触，并且其中所述电路材料具有大于 或等于约1瓦/米开尔文。

公开(公告)号：US20070145097A1

公开(公告)日：2007-06-28

申请号：US11313344

申请日：2005-12-20

Applicant: Daewoong Suh

Inventor： Daewoong Suh

IPC: A47J36/02

CPC classification number: H05K3/3484 ,  B82Y10/00 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13393 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract translation: 本发明的实施例是互连技术。 制备碳纳米管（CNT）。 形成含有预定体积分数的CNT和焊料的CNT-焊料复合浆料。

公开(公告)号：US20070128883A1

公开(公告)日：2007-06-07

申请号：US11292690

申请日：2005-12-02

Applicant: Chi-Won Hwang

Inventor： Chi-Won Hwang

IPC: H01L21/31

CPC classification number: H01L24/73 ,  B82Y10/00 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49877 ,  H01L23/585 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/1358 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/328 ,  H05K2201/026 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus including an interconnect structure having a surface, a plurality of nanotubes disposed adjacent to the surface, and a metallic layer disposed adjacent to the surface and substantially including the nanotubes. An assembly may include a first embodiment of an apparatus as described, and may further include a second such embodiment at least one of physically and electrically coupled to the first embodiment.

Abstract translation: 一种包括具有表面的互连结构，与表面相邻布置的多个纳米管的方法和设备，以及邻近表面设置并且基本上包括纳米管的金属层。 组件可以包括所描述的装置的第一实施例，并且还可以包括第二实施例，物理地和电耦合到第一实施例中的至少一个。

公开(公告)号：US20070096083A1

公开(公告)日：2007-05-03

申请号：US11259806

申请日：2005-10-27

Applicant: Nachiket Raravikar ,  Ravindra Tanikella ,  Nirupama Chakrapani

Inventor： Nachiket Raravikar ,  Ravindra Tanikella ,  Nirupama Chakrapani

IPC: H01L51/00

CPC classification number: B82Y40/00 ,  B82Y10/00 ,  B82Y30/00 ,  C01B32/168 ,  C01B32/174 ,  C01B2202/22 ,  C08K7/24 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026

Abstract: Embodiments of substrate core polymer nanocomposite with nanoparticles and randomly oriented nanotubes and method for making the substrate core are generally described herein. Other embodiments may be described and claimed. In some embodiments, a nanotube suspension is combined with nanoparticle-impregnated polymer.

Abstract translation: 具有纳米颗粒和随机取向的纳米管的衬底芯聚合物纳米复合材料的实施方案和制备衬底芯的方法一般在本文中描述。 可以描述和要求保护其他实施例。 在一些实施方案中，将纳米管悬浮液与纳米颗粒浸渍的聚合物组合。

公开(公告)号：US20060211327A1

公开(公告)日：2006-09-21

申请号：US11080195

申请日：2005-03-15

Applicant: Michael Lee ,  Kishio Yokouchi

Inventor： Michael Lee ,  Kishio Yokouchi

IPC: H01J9/12 ,  H01J9/04

CPC classification number: H01L21/76838 ,  B81C1/0038 ,  B82Y10/00 ,  H01L21/288 ,  H01L51/0048 ,  H05K3/1266 ,  H05K3/249 ,  H05K2201/026 ,  H05K2203/105 ,  H05K2203/135

Abstract: The present invention generally relates to circuits on the nanotechnology scale. Specifically, it is directed to methods of fabricating carbon nanotube-based (i.e., CNT-based) circuits. The method involves providing a mixture of carbon nanotubes that is substantially disaggregated and patterning carbon nanotubes through the use of electrostatic forces. Carbon nanotubes in the mixture are typically disaggregated through the introduction of positive charge on the individual nanotubes. The patterning of the carbon nanotubes is typically accomplished using electrostatic attraction between pre-formed metal lines and the charged carbon nanotubes.

公开(公告)号：US20060113511A1

公开(公告)日：2006-06-01

申请号：US11228943

申请日：2005-09-16

Applicant: Ga-Lane Chen

Inventor： Ga-Lane Chen

IPC: H01B1/12

CPC classification number: H05K3/323 ,  B82Y10/00 ,  H01B1/22 ,  H05K2201/026 ,  H05K2201/0329 ,  H05K2201/10378 ,  Y10S977/743 ,  Y10S977/753 ,  Y10S977/77 ,  Y10S977/846

Abstract: An anisotropic conductive film (10) is used for bonding a semiconductor component to a circuit board. The anisotropic conductive film includes an insulative adhesive film (12) and a plurality of nano-scaled conductive particles (14). The nano-scaled conductive particles are dispersed in the insulative adhesive film. The nano-scaled conductive particles are a nanotubes each containing metal particles and polyaniline therein. Because the sizes of the nano-scaled conductive particle are very small, more of the nano-scaled conductive particles can be compressed between two corresponding contacts of the semiconductor component and the circuit board. The interface area between the two corresponding contacts is correspondingly enlarged. In addition, the polyaniline both in the opening and inside of the nanotubes also has a more favorable viscosity. The bonding effect between a semiconductor component and a circuit board is improved.

Abstract translation: 各向异性导电膜（10）用于将半导体部件接合到电路板。 各向异性导电膜包括绝缘粘合膜（12）和多个纳米级导电颗粒（14）。 纳米尺度的导电颗粒分散在绝缘粘合膜中。 纳米尺度的导电颗粒是各自含有金属颗粒和聚苯胺的纳米管。 由于纳米级导电颗粒的尺寸非常小，所以可以在半导体组件和电路板的两个对应的触点之间压缩更多的纳米级导电颗粒。 两个对应的触点之间的接口面积相应地扩大。 此外，纳米管的开口和内部的聚苯胺也具有更好的粘度。 提高了半导体元件与电路基板之间的接合效果。

公开(公告)号：US20060071344A1

公开(公告)日：2006-04-06

申请号：US11079108

申请日：2005-03-15

Applicant: Mizuhisa Nihei

Inventor： Mizuhisa Nihei

IPC: H01L23/48

CPC classification number: B82Y10/00 ,  H01L23/49827 ,  H01L23/49877 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H05K3/4076 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00

Abstract: Disclosed is a wiring connection structure comprising a wiring on which a preferable carbon nanotube can be formed, and a method for forming the same. On a lower layer Cu wiring, Mo is deposited to form a connection layer. On this connection layer, a carbon nanotube is grown using a CVD method. When the connection layer composed of Mo is formed, the following advantages can be obtained. Even when heat is applied during the CVD for growing the carbon nanotube, thermal diffusion of Cu in the lower layer Cu wiring is suppressed so that activity of the catalyst metal can be kept. Further, since the contact resistance between Mo and the carbon nanotube is low, a low resistance connection between the lower layer Cu wiring and the carbon nanotube can be secured and at the same time, a preferable carbon nanotube can be formed.

Abstract translation: 公开了一种布线连接结构及其形成方法，其中可以形成优选的碳纳米管的布线。 在下层Cu布线上，沉积Mo形成连接层。 在该连接层上，使用CVD法生长碳纳米管。 当形成由Mo组成的连接层时，可获得以下优点。 即使在用于生长碳纳米管的CVD期间施加热量，也抑制Cu在下层Cu布线中的热扩散，从而可以保持催化剂金属的活性。 此外，由于Mo和碳纳米管之间的接触电阻低，因此可以确保下层Cu布线和碳纳米管之间的低电阻连接，同时可以形成优选的碳纳米管。

公开(公告)号：US20050048697A1

公开(公告)日：2005-03-03

申请号：US10653860

申请日：2003-09-03

Applicant: Ruoh-Huey Uang ,  Yu-Hua Chen

Inventor： Ruoh-Huey Uang ,  Yu-Hua Chen

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H05K3/24 ,  H05K3/40 ,  H01L21/50

CPC classification number: H01L24/13 ,  B82Y10/00 ,  H01L23/53276 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05111 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1133 ,  H01L2224/13099 ,  H01L2224/13193 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/06 ,  H05K3/249 ,  H05K3/4007 ,  H05K2201/026 ,  Y10S977/882 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is then positioned juxtaposed to the carbon nanotubes for forming a bond between the carbon nanotubes and the metal pads facilitated by a chemical affinity existed between the functional groups and the metal pad.

Abstract translation: 一种自组装纳米导电凸块及其制造方法。 在该方法中，首先提供用化学官能团在两端涂覆的多个碳纳米管。 然后将配备有表面上的至少一个键合焊盘的衬底与碳纳米管并置放置，以形成碳纳米管与金属衬底之间的键，这通过官能团和金属衬垫之间存在的化学亲合力而促进。