中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

369 records (took 0.015 seconds)

    Method for contacting partially conductive textile materials
    94.
    发明申请
    Method for contacting partially conductive textile materials 有权
    接触部分导电纺织材料的方法

    公开(公告)号：US20100048066A1

    公开(公告)日：2010-02-25

    申请号：US11989637

    申请日：2006-07-28

    Applicant: Michael Steffen Bertsch ,  Michael Grimm

    Inventor： Michael Steffen Bertsch ,  Michael Grimm

    IPC: H01R13/502 ,  H05K3/34 ,  H05K3/30

    CPC classification number: H05K3/363 ,  H01R4/58 ,  H01R12/592 ,  H01R13/506 ,  H05K1/00 ,  H05K2201/0281 ,  H05K2201/0293 ,  H05K2201/10393 ,  Y10T29/4913 ,  Y10T29/49144

    Abstract: A method for electrically connecting conductive thread (40) at any number of termination locations of a textile material (5) with an termination element preferably formed in a circuit board with the following steps being provided: placing the circuit board in a respectively formed recess of a support plate of a tool with the termination locations (122) of the circuit board (12) facing upwardly; arranging the material (5) on the circuit board (12) such that in the area of the termination locations of the circuit board (12) a termination location of the material (5) which is to be connected is being placed. Fixedly mounting, preferably by clamping the material adjacent to and on a side of the termination locations of the circuit board, preferably stretching the material (5) in longitudinal direction wherein the direction of the extension of the conductive threads. Fixedly clamping the material in an area opposite to the first clamping area and adjacent to the desired termination location. Soldering the blank conductive threads (40) to the termination locations of the circuit board (12).

    Abstract translation: 一种用于在纺织材料（5）的任何数量的终端位置处电连接导电线（40）的方法，其中终端元件优选地形成在电路板中，并提供以下步骤：将电路板放置在 工具的支撑板，其中电路板（12）的端接位置（122）面向上; 将材料（5）布置在电路板（12）上，使得在电路板（12）的端接位置的区域中，放置要连接的材料（5）的终止位置。 固定地安装，优选地通过夹紧邻近电路板的端接位置的一侧并且在电路板的端接位置的一侧上的材料，优选地在导电线的延伸方向的纵向上拉伸材料（5）。 将材料固定地夹紧在与第一夹紧区域相对的区域中并且与所需的终止位置相邻。 将空白的导电螺纹（40）焊接到电路板（12）的端接位置。

    TEXTILE FOR CONNECTION OF ELECTRONIC DEVICES
    95.
    发明申请
    TEXTILE FOR CONNECTION OF ELECTRONIC DEVICES 失效
    用于电子设备连接的纺织品

    公开(公告)号：US20100013406A1

    公开(公告)日：2010-01-21

    申请号：US12444419

    申请日：2007-10-03

    Applicant: Rabin Bhattacharya

    Inventor： Rabin Bhattacharya

    IPC: H05B37/02 ,  D03D15/00 ,  H05K7/02

    CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/00 ,  D03D15/00 ,  D10B2401/16 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y10T442/3179

    Abstract: A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a-f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved there between, and a second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved there between. The second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) form loops (110; 425, 431, 441) around non-conductive warp yarns in the upper (101) and intermediate (103) warp layers, each of the loops (110; 425, 431, 441) providing a first upper layer connection point (307; 408-410) for enabling connection of an electronic device (309; 401-403) between the first upper layer connection point (307; 408-410) and a second upper layer connection point (308).

    Abstract translation: 一种具有多层经纱的织物（100; 300; 400），其包括上导向经纱（104a-b; 303a-e; 406a-b）的上经线层（101），下经纱层 （102）包括下阵列的导电经纱（106a-b; 306a-e; 421a-d）和布置在上（101）和下（102）经线层之间的中间经纱层（103）。 纺织品还包括纬纱，其中第一组导电纬纱（108; 302a-f; 407a-b）穿过导电经纱的上排阵列（104a-b，303a-e; 406a-b），使得 在第二组导电纬纱（109a-b; 305a-f; 424,430,440）与第二组导电经纱（106a-b; 306a-e; 421a-d ），使得之间实现电接触。 第二组导电纬纱（109a-b; 305a-f; 424,430,440）在上（101）和中间（103）中的非导电经纱周围形成环（110; 425,431,441） 经线层，每个环路（110; 425,431,441）提供第一上层连接点（307; 408-410），用于使第一上层连接点（307; 408-410）能够连接电子设备（309; 401-403） 点（307; 408-410）和第二上层连接点（308）。

    Low cost heating devices manufactured from conductive loaded resin-based materials
    99.
    发明授权
    Low cost heating devices manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本加热装置

    公开(公告)号：US07372006B2

    公开(公告)日：2008-05-13

    申请号：US10819808

    申请日：2004-04-07

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: H05B3/58

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  H05B3/12 ,  H05B3/145 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 加热装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    CIRCUIT BOARD ASSEMBLIES WITH COMBINED FLUID-CONTAINING HEATSPREADER-GROUND PLANE AND METHODS THEREFOR
    100.
    发明申请
    CIRCUIT BOARD ASSEMBLIES WITH COMBINED FLUID-CONTAINING HEATSPREADER-GROUND PLANE AND METHODS THEREFOR 审中-公开
    具有组合含流体的加热器接地平面的电路板组件及其方法

    公开(公告)号：US20080087456A1

    公开(公告)日：2008-04-17

    申请号：US11871498

    申请日：2007-10-12

    Applicant: Franz Michael Schuette

    Inventor： Franz Michael Schuette

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K1/0207 ,  H05K1/0272 ,  H05K3/4641 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0379 ,  H05K2201/064 ,  H05K2201/09681 ,  Y10T29/49124

    Abstract: Circuit board assemblies and methods that employ integrated heatspreaders to cool the assemblies and serve as electrical ground planes for the assemblies. Such a circuit board assembly includes a substrate having at least one circuit device on at least a first surface thereof and an electrical ground plane. The circuit device has a first set of solder connections electrically connected to the electrical ground plane and a second set of solder connections electrically connected to power and signal traces on the first surface of the substrate. The assembly further includes a heatspreader embedded in the substrate and defining an electrical element of the electrical ground plane as a result of being electrically connected to the first set of solder connections. The heatspreader is configured as a plate-mesh-plate laminate that defines a cavity containing a fluid for transferring heat from the circuit device.

    Abstract translation: 电路板组件和方法采用集成散热器来冷却组件并用作组件的电接地平面。 这种电路板组件包括在其至少第一表面上具有至少一个电路装置的基板和电接地平面。 电路装置具有电连接到电接地平面的第一组焊接连接和电连接到衬底的第一表面上的功率和信号迹线的第二组焊接连接。 组件还包括嵌入在基板中并且由于电连接到第一组焊接连接而限定电接地平面的电元件的散热器。 散热器被配置为板网板层压板，其限定包含用于从电路装置传递热量的流体的空腔。

Patent Agency Ranking