PRINTED CIRCUIT BOARD
    1.
    发明公开

    公开(公告)号:US20240164019A1

    公开(公告)日:2024-05-16

    申请号:US18124146

    申请日:2023-03-21

    CPC classification number: H05K1/113 H05K2201/0347 H05K2201/09827

    Abstract: The present disclosure relates to a printed circuit board including a first insulating layer, a pad embedded in an upper portion of the first insulating and having an upper surface portion, a side surface portion, and a lower surface portion, where a portion of the upper surface portion and a portion of the side surface portion protrude from the upper surface of the first insulating layer, and a metal layer covering the portion of the upper surface portion, the portion of the side surface portion, and a portion of the lower surface portion of the pad.

    MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20230262888A1

    公开(公告)日:2023-08-17

    申请号:US18303648

    申请日:2023-04-20

    Inventor: Hiromichi TANAKA

    Abstract: A multilayer structure having a main surface includes: a first conductor extending in parallel with the main surface; a second conductor extending in parallel with the main surface and disposed at a different position from the first conductor with respect to a thickness direction of the multilayer structure; and a third conductor having a shape extending in at least any direction as seen in a direction perpendicular to the main surface. In a range higher than a lower end of the third conductor and lower than an upper end of the third conductor in the thickness direction of the multilayer structure, at least a part of the first conductor is included and at least a part of the second conductor is included.

    Wired circuit board and producing method thereof

    公开(公告)号:US10021780B2

    公开(公告)日:2018-07-10

    申请号:US15800680

    申请日:2017-11-01

    Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

Patent Agency Ranking