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公开(公告)号：US11646501B2
公开(公告)日：2023-05-09
申请号：US17338481
申请日：2021-06-03
Applicant: Apple Inc.
Inventor： Jiangfeng Wu , Siwen Yong , Simon G. Begashaw , Yi Jiang , Lijun Zhang
CPC classification number: H01Q19/005 , H01Q1/38 , H01Q21/065 , H01Q1/243
Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.
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公开(公告)号：US20220393365A1
公开(公告)日：2022-12-08
申请号：US17338481
申请日：2021-06-03
Applicant: Apple Inc.
Inventor： Jiangfeng Wu , Siwen Yong , Simon G. Begashaw , Yi Jiang , Lijun Zhang
Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.
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公开(公告)号：US11502391B2
公开(公告)日：2022-11-15
申请号：US17031618
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Siwen Yong , Jiangfeng Wu , Yi Jiang , Simon G. Begashaw , Harish Rajagopalan , Hee-Joung Joun , Thomas W. Yang , Mattia Pascolini
Abstract: An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.
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公开(公告)号：US20220294119A1
公开(公告)日：2022-09-15
申请号：US17832421
申请日：2022-06-03
Applicant: Apple Inc.
Inventor： Bhaskara R. Rupakula , Harish Rajagopalan , Hao Xu , Jennifer M. Edwards , Bilgehan Avser , Siwen Yong
Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
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公开(公告)号：US20220255212A1
公开(公告)日：2022-08-11
申请号：US17728817
申请日：2022-04-25
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Siwen Yong , Jiangfeng Wu , Harish Rajagopalan , Bilgehan Avser , Simone Paulotto , Mattia Pascolini
Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.
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Patent Agency Ranking
公开(公告)号：US11362429B2
公开(公告)日：2022-06-14
申请号：US17031775
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Bhaskara R. Rupakula , Harish Rajagopalan , Hao Xu , Jennifer M. Edwards , Bilgehan Avser , Siwen Yong
Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
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公开(公告)号：US20220094067A1
公开(公告)日：2022-03-24
申请号：US17031775
申请日：2020-09-24
Applicant: Apple Inc.
Inventor： Bhaskara R. Rupakula , Harish Rajagopalan , Hao Xu , Jennifer M. Edwards , Bilgehan Avser , Siwen Yong
Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
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公开(公告)号：US20220094053A1
公开(公告)日：2022-03-24
申请号：US17026974
申请日：2020-09-21
Applicant: Apple Inc.
Inventor： Yi Jiang , Jiangfeng Wu , Siwen Yong , Hao Xu , Ana Papio Toda , Carlo di Nallo , Michael D. Quinones , Mattia Pascolini , Amin Tayebi , Aaron J. Cooper , Per Jakob Helander , Johan Avendal
Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.
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公开(公告)号：US20220094048A1
公开(公告)日：2022-03-24
申请号：US17028864
申请日：2020-09-22
Applicant: Apple Inc.
Inventor： Jiangfeng Wu , Lijun Zhang , Mattia Pascolini , Siwen Yong , Yi Jiang
Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.
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公开(公告)号：US20220077565A1
公开(公告)日：2022-03-10
申请号：US17527906
申请日：2021-11-16
Applicant: Apple Inc.
Inventor： Miroslav Samardzija , Yiren Wang , Yuehui Ouyang , Joseph Hakim , Qingxiang Li , Robert W. Schlub , Ruben Caballero , Siwen Yong , Erik G. de Jong
IPC: H01Q1/22 , G04R60/10 , G04G21/04 , H01Q1/27 , H01Q7/00 , H04B5/00 , H01Q1/52 , H01Q9/42 , H01Q21/28 , G06F1/16 , H01L27/32 , H04B5/02 , H05K1/02 , H05K5/00 , H05K5/03 , H01Q9/04
Abstract: An electronic device may have a display. A display cover layer and a transparent inner display member may overlap a display pixel layer. The display pixel layer may have an array of display pixels for displaying images for a user. A touch sensor layer may be interposed between the display pixel layer and the transparent display member. A ferromagnetic shielding layer may be mounted below the display pixel layer. A flexible printed circuit containing coils of metal signal lines that form a near-field communications loop antenna may be interposed between the ferromagnetic shielding layer and the display pixel layer. A non-near-field antenna such as an inverted-F antenna may have a resonating element mounted on an inner surface of the display cover layer. The resonating element may be interposed between the transparent display member and the display cover layer.
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