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公开(公告)号：US11239550B2
公开(公告)日：2022-02-01
申请号：US16849776
申请日：2020-04-15
Applicant: Apple Inc.
Inventor： Aaron J. Cooper , Amin Tayebi , Carlo di Nallo , Ana Papio Toda
Abstract: An electronic device may be provided with an antenna for receiving signals in first and second ultra-wideband communications bands. The antenna may include a shielding ring that runs around first and second arms. The first arm may radiate in the first band and the second arm may radiate in the second band. The first arm may have an end formed from a first segment of the ring and a radiating edge facing the second arm. The second arm may have an end formed from a second segment of the ring and a radiating edge facing the first arm. First and second sets of conductive vias may couple the ring to ground. The first set may form a return path for the first arm. The second set may form a return path for the second arm.
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公开(公告)号：US12126085B2
公开(公告)日：2024-10-22
申请号：US17730039
申请日：2022-04-26
Applicant: Apple Inc.
Inventor： Aaron J Cooper , Amin Tayebi , Ana Papio Toda , Carlo Di Nallo
CPC classification number: H01Q19/005 , H01Q1/241 , H01Q21/065
Abstract: An electronic device may have an antenna module with a triplet of antennas on a substrate. The triplet may include a first antenna with a radiating element formed from a patch on the substrate and second and third antennas having radiating elements formed from patches on that extend across a smaller lateral area than the patch in the first antenna. The patches in the second and third antennas may have extended electrical lengths formed from parasitic patches embedded within the substrate that are coupled to opposing edges of the patches by fences of conductive vias. The antenna module may include phased antenna arrays for conveying centimeter/millimeter wave signals. Signal conductors for the antennas may be distributed across multiple metallization layers of the substrate.
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公开(公告)号：US20240079757A1
公开(公告)日：2024-03-07
申请号：US18458689
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Seyed Mohammad Amjadi , Yuan Tao , Hao Xu , Yiren Wang , Xue Yang , Mattia Pascolini , Hongfei Hu , Enrique Ayala Vazquez , Ming-Ju Tsai , Ana Papio Toda , Yuancheng Xu , Jingni Zhong , Nikolaj P Kammersgaard , Sidharath Jain , Haozhan Tian , Ming Chen , Linqiang Zou
CPC classification number: H01Q1/22 , H01Q1/48 , H01Q9/0421 , H01Q9/0442 , H01Q9/045
Abstract: An electronic device may be provided with peripheral conductive housing structures having first and second segments. A flexible printed circuit may have a first tail that extends along the first and second segments and a second tail that extends along the first segment. A conductive trace on the first tail may be coupled to an antenna feed terminal on the second segment. A conductive trace on the second tail may couple the conductive trace on the first tail to the first segment. A tuner and filters may be disposed on the flexible printed circuit and may be coupled to the conductive traces. The conductive trace on the second tail may have a tapered width. An antenna in the device may have a resonating element that includes both the first and second segments, thereby allowing the antenna to exhibit a wide bandwidth from 1.1-5 GHz.
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公开(公告)号：US20250087890A1
公开(公告)日：2025-03-13
申请号：US18464999
申请日：2023-09-11
Applicant: Apple Inc.
Inventor： Ahmed Ali Abdelhaliem Nafe , Ali Pourghorban Saghati , Ana Papio Toda , Carlo Di Nallo , Enrique Ayala Vazquez , Erdinc Irci , Hao Xu , Hongfei Hu , Jingni Zhong , Mattia Pascolini , Ming Chen , Mohsen Salehi , Nikolaj P Kammersgaard , Orbay Tuncay , Salih Yarga , Seyed Mohammad Amjadi , Tiejun Yu , Yiren Wang , Yuan Tao
Abstract: An electronic device may be provided with wireless circuitry and a housing having peripheral conductive housing structures. The wireless circuitry may include first and second antennas. The first antenna may have a resonating element arm formed from a first segment of the peripheral conductive housing structures. The second antenna may have a resonating element arm formed from a second segment of the peripheral conductive housing structures separated from the first segment by a gap. Switchable short paths may be coupled between the second segment and ground on opposing sides of an antenna feed for the second antenna and/or may be coupled between the first and second segments and ground on opposing sides of the gap. Additionally or alternatively, a switch may be coupled between the first and second segments across the gap and a tuning component may couple the second segment to the ground structures.
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公开(公告)号：US20240080976A1
公开(公告)日：2024-03-07
申请号：US18458747
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Peter A. Dvorak , Eric W. Bates , Ana Papio Toda , Yiren Wang , Hao Xu , Yuan Tao , Han Wang , Jack R Lanzi , Ronald Lam
CPC classification number: H05K1/11 , H05K1/028 , H05K1/181 , H05K5/0217 , H05K7/1427 , H04R1/02 , H05K2201/0141 , H05K2201/10098 , H05K2201/10128
Abstract: An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.
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Patent Agency Ranking
公开(公告)号：US20240079790A1
公开(公告)日：2024-03-07
申请号：US18458726
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Peter A Dvorak , Eric W Bates , McKinley McQuaide , Ronald Lam , Ana Papio Toda , Yiren Wang , Hao Xu , Han Wang , Yuan Tao , Jack R Lanzi , Jingni Zhong
Abstract: An electronic device may be provided with peripheral conductive housing structures having a segment that forms a resonating element for an antenna. A speaker may be mounted to a mid-chassis of the electronic device. A printed circuit may be mounted to the speaker and may have a ground trace for the antenna. A conductive spring may extend through the printed circuit and the speaker to couple the ground trace to the mid-chassis. A conductive contact pad may be welded to an aluminum layer such as an aluminum layer used to form the mid-chassis. A conductive spring such as the conductive spring coupled to the ground traces may press against the contact pad. The contact pad may include gold or nickel-plated stainless steel. The contact pad may provide a strong electrical connection between the conductive spring and the aluminum layer.
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公开(公告)号：US20240079779A1
公开(公告)日：2024-03-07
申请号：US18458779
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Yuan Tao , Yiren Wang , Ana Papio Toda , Jingni Zhong , Han Wang , Hao Xu , Hongfei Hu , Mattia Pascolini , Eric W. Bates , Peter A. Dvorak , Allegra Shum
CPC classification number: H01Q5/328 , H01Q9/0442
Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.
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公开(公告)号：US20250015511A1
公开(公告)日：2025-01-09
申请号：US18890412
申请日：2024-09-19
Applicant: Apple Inc.
Inventor： Aaron J Cooper , Amin Tayebi , Ana Papio Toda , Carlo Di Nallo
Abstract: An electronic device may have an antenna module with a triplet of antennas on a substrate. The triplet may include a first antenna with a radiating element formed from a patch on the substrate and second and third antennas having radiating elements formed from patches on that extend across a smaller lateral area than the patch in the first antenna. The patches in the second and third antennas may have extended electrical lengths formed from parasitic patches embedded within the substrate that are coupled to opposing edges of the patches by fences of conductive vias. The antenna module may include phased antenna arrays for conveying centimeter/millimeter wave signals. Signal conductors for the antennas may be distributed across multiple metallization layers of the substrate.
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公开(公告)号：US11984661B2
公开(公告)日：2024-05-14
申请号：US17026974
申请日：2020-09-21
Applicant: Apple Inc.
Inventor： Yi Jiang , Jiangfeng Wu , Siwen Yong , Hao Xu , Ana Papio Toda , Carlo di Nallo , Michael D. Quinones , Mattia Pascolini , Amin Tayebi , Aaron J. Cooper , Per Jakob Helander , Johan Avendal
CPC classification number: H01Q3/30 , H01Q1/24 , H01Q9/0414 , H01Q9/0421
Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.
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公开(公告)号：US20230084310A1
公开(公告)日：2023-03-16
申请号：US17730039
申请日：2022-04-26
Applicant: Apple Inc.
Inventor： Aaron J Cooper , Amin Tayebi , Ana Papio Toda , Carlo Di Nallo
Abstract: An electronic device may have an antenna module with a triplet of antennas on a substrate. The triplet may include a first antenna with a radiating element formed from a patch on the substrate and second and third antennas having radiating elements formed from patches on that extend across a smaller lateral area than the patch in the first antenna. The patches in the second and third antennas may have extended electrical lengths formed from parasitic patches embedded within the substrate that are coupled to opposing edges of the patches by fences of conductive vias. The antenna module may include phased antenna arrays for conveying centimeter/millimeter wave signals. Signal conductors for the antennas may be distributed across multiple metallization layers of the substrate.
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