公开(公告)号：US06967362B2

公开(公告)日：2005-11-22

申请号：US10669428

申请日：2003-09-25

Applicant: Yun-woo Nam ,  Suk-han Lee

Inventor： Yun-woo Nam ,  Suk-han Lee

IPC: H04R17/02 ,  B81B3/00 ,  H01L41/09 ,  H01L41/193 ,  H01L41/45 ,  H04R31/00 ,  H01L27/20 ,  H01L29/84

CPC classification number: H01L41/45 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00182 ,  H01L41/094 ,  H01L41/0973 ,  H04R1/406 ,  H04R17/02 ,  H04R2420/07

Abstract: A flexible wireless MEMS microphone includes a substrate of a flexible polymeric material, a flexible MEMS transducer structure formed on the substrate by PECVD, an antenna printed on the substrate for communicating with an outside source, a wire and interface circuit embedded in the substrate to electrically connect the flexible MEMS transducer and the antenna, a flexible battery layer electrically connected to the substrate for supplying power to the MEMS transducer, and a flexible bluetooth module layer electrically connected to the battery layer. The flexible MEMS transducer includes a flexible substrate, a membrane layer deposited on the substrate, a lower electrode layer formed on the membrane layer, an active layer formed by depositing a piezopolymer on the lower electrode layer, an upper electrode layer formed on the active layer, and a first and a second connecting pad electrically connected to the lower and upper electrode layers, respectively.

Abstract translation: 灵活的无线MEMS麦克风包括柔性聚合物材料的基底，通过PECVD在基底上形成的柔性MEMS换能器结构，印刷在基底上用于与外部源连通的天线，嵌入在基底中的电线和接口电路， 连接柔性MEMS换能器和天线，电连接到基板的用于向MEMS换能器供电的柔性电池层以及电连接到电池层的柔性蓝牙模块层。 柔性MEMS换能器包括柔性基板，沉积在基板上的膜层，形成在膜层上的下电极层，通过在下电极层上沉积压电聚合物形成的有源层，形成在有源层上的上电极层 以及分别电连接到下电极层和上电极层的第一和第二连接焊盘。

公开(公告)号：US20050104478A1

公开(公告)日：2005-05-19

申请号：US11017498

申请日：2004-12-20

Applicant: Baomin Xu ,  William Wong

Inventor： Baomin Xu ,  William Wong

IPC: H01L41/09 ,  H01L41/24 ,  H02N2/04 ,  H01L41/08

CPC classification number: B81B3/0024 ,  B81B2201/032 ,  H01L41/094 ,  H01L41/22 ,  H01L41/313 ,  H01L41/314 ,  H01L41/337 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A micro-electromechanical dimensioned bimorph structure includes a first element layer structure, and a second element layer structure. The element layer structures are provided in various combinations, including piezoelectric/piezoelectric, antiferroelectric/antiferroelectric or antiferroelectric/piezoelectric. The layer thickness of the element structure is less than 100 μm. A bonding layer bonds the first element structure directly to the second element structure and the bonding layer thickness is less than 10 μm. The bimorph structure can be made in various forms including a cantilever or a diaphragm. Microfluidic devices using the bimorph structures may also be constructed.

Abstract translation: 微机电尺寸双压电晶片结构包括第一元件层结构和第二元件层结构。 元件层结构以各种组合提供，包括压电/压电，反铁电/反铁电或反铁电/压电。 元件结构的层厚小于100μm。 结合层将第一元件结构直接结合到第二元件结构，并且结合层厚度小于10μm。 双压电晶片结构可以以各种形式制成，包括悬臂或隔膜。 也可以构造使用双压电晶片结构的微流体装置。

公开(公告)号：US20040114259A1

公开(公告)日：2004-06-17

申请号：US10473532

申请日：2003-09-29

Inventor： Tohru Ishizuya ,  Keiichi Akagawa

IPC: G02B005/08

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/032 ,  B81B2201/045 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/058

Abstract: The mirror device has a mirror 2, and a supporting mechanism which elastically supports the mirror 2 on a substrate 1 in a state in which the mirror floats from the substrate 1, so that the mirror can be inclined in an arbitrary direction. The supporting mechanism has three supporting parts 3A, 3B and 3C that mechanically connect the substrate 1 and mirror 2. Each of the supporting parts 3A, 3B and 3C has one or more plate spring parts 5 that are constructed from a thin film consisting of one or more layers. One end portion of each plate spring part 5 is connected to the substrate 1 via a leg part 9 which has a rising part that rises from the substrate 1. The other end portion of the plate spring part 5 is mechanically connected to the mirror 2 via a connecting part which has a rising part that rises from this other end portion. The mirror 2 is supported on the substrate 1 only via the plate spring part 5 of the respective 3A, 3B and 3C. As a result, compactness and mass production characteristics can be greatly improved while maintaining superior optical characteristics.

Abstract translation: 镜装置具有反射镜2和支撑机构，其以反射镜从基板1浮起的状态将基板1上的反射镜2弹性支撑，使得反射镜能够在任意方向上倾斜。 支撑机构具有机械地连接基板1和反射镜2的三个支撑部件3A，3B和3C。每个支撑部件3A，3B和3C具有一个或多个板簧部件5，该板簧部件由由一个 或更多层。 每个板簧部分5的一个端部经由腿部9连接到基板1，腿部9具有从基板1上升的上升部分。板簧部分5的另一端部通过 连接部具有从该另一端部上升的上升部。 反射镜2仅通过相应的3A，3B和3C的板簧部分5支撑在基板1上。 结果，可以在保持优异的光学特性的同时大大提高紧凑性和批量生产特性。

公开(公告)号：US20030189351A1

公开(公告)日：2003-10-09

申请号：US10406845

申请日：2003-04-04

Applicant: Yoshikazu Nakayama ,  Daiken Chemical Co., Ltd.

Inventor： Yoshikazu Nakayama ,  Seiji Akita ,  Akio Harada ,  Takashi Okawa

IPC: B25J007/00

CPC classification number: B25J7/00 ,  B81B2201/032 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C99/002 ,  B82B3/00 ,  G01Q80/00 ,  Y10S977/732 ,  Y10S977/734 ,  Y10S977/742 ,  Y10S977/778 ,  Y10S977/78 ,  Y10S977/837 ,  Y10S977/842 ,  Y10S977/858 ,  Y10S977/863 ,  Y10S977/875 ,  Y10S977/876 ,  Y10S977/89 ,  Y10S977/901 ,  Y10S977/962

Abstract: To provide nanotweezers and a nanomanipulator which allow great miniaturization of the component and are capable of gripping various types of nano-substances such as insulators, semiconductors and conductors and of gripping nano-substances of various shapes. Electrostatic nanotweezers 2 are characterized in that the nanotweezers 2 are comprised of a plurality of nanotubes whose base end portions are fastened to a holder 6 so that the nanotubes protrude from the holder 6, coating films which insulate and cover the surfaces of the nanotubes, and lead wires 10, 10 which are connected to two of the nanotubes 8, 9; and the tip ends of the two nanotubes are freely opened and closed by means of an electrostatic attractive force generated by applying a voltage across these lead wires. Furthermore, by way of forming a piezo-electric film 32 on the surface of the nanotube 9, and the tip ends of the nanotubes are freely opened and closed by expanding and contracting the piezo-electric film, thus allowing any desired nano-substances to be handled regardless of whether the nano-substances are insulators, semiconductors or conductors. Furthermore, if by way of designing three nanotubes so as to be freely opened and closed by an electrostatic system, nano-substances of various shapes such as spherical, rod-form, etc. can be handled. Moreover, a nanomanipulator that is constructed by combining the nanotweezers with a three-dimensional driving mechanism facilitates the gripping, moving and releasing of nano-substances

Abstract translation: 提供纳米管和纳米管操纵器，其允许部件的极小化，并且能够夹持各种类型的纳米物质，例如绝缘体，半导体和导体，并且夹持各种形状的纳米物质。 静电纳米针筒2的特征在于，纳米针筒2由多个纳米管组成，其基端部固定在保持器6上，使得纳米管从支架6突出，绝缘并覆盖纳米管表面的涂膜，以及 引线10,10连接到两个纳米管8,9; 并且通过在这些引线上施加电压而产生的静电吸引力自由地打开和闭合两个纳米管的末端。 此外，通过在纳米管9的表面上形成压电膜32，通过使压电膜膨胀收缩来使纳米管的前端自由地开闭，从而使任何所需的纳米物质 无论纳米物质是绝缘体，半导体还是导体，都要进行处理。 此外，如果通过设计三个纳米管以通过静电系统自由地打开和关闭，则可以处理诸如球形，棒状等各种形状的纳米物质。 此外，通过将纳米针管与三维驱动机构组合而构成的纳米机械手有利于纳米物质的夹持，移动和释放

公开(公告)号：US20030189350A1

公开(公告)日：2003-10-09

申请号：US10406844

申请日：2003-04-04

Applicant: Yoshikazu Nakayama ,  Daiken Chemical Co., Ltd.

Inventor： Yoshikazu Nakayama ,  Seiji Akita ,  Akio Harada ,  Takashi Okawa

IPC: B25J007/00

CPC classification number: B25J7/00 ,  B81B2201/032 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C99/002 ,  B82B3/00 ,  G01Q80/00 ,  Y10S977/732 ,  Y10S977/734 ,  Y10S977/742 ,  Y10S977/778 ,  Y10S977/78 ,  Y10S977/837 ,  Y10S977/842 ,  Y10S977/858 ,  Y10S977/863 ,  Y10S977/875 ,  Y10S977/876 ,  Y10S977/89 ,  Y10S977/901 ,  Y10S977/962

Abstract: To provide nanotweezers and a nanomanipulator which allow great miniaturization of the component and are capable of gripping various types of nano-substances such as insulators, semiconductors and conductors and of gripping nano-substances of various shapes. Electrostatic nanotweezers 2 are characterized in that the nanotweezers 2 are comprised of a plurality of nanotubes whose base end portions are fastened to a holder 6 so that the nanotubes protrude from the holder 6, coating films which insulate and cover the surfaces of the nanotubes, and lead wires 10, 10 which are connected to two of the nanotubes 8, 9; and the tip ends of the two nanotubes are freely opened and closed by means of an electrostatic attractive force generated by applying a voltage across these lead wires. Furthermore, by way of forming a piezo-electric film 32 on the surface of the nanotube 9, and the tip ends of the nanotubes are freely opened and closed by expanding and contracting the piezo-electric film, thus allowing any desired nano-substances to be handled regardless of whether the nano-substances are insulators, semiconductors or conductors. Furthermore, if by way of designing three nanotubes so as to be freely opened and closed by an electrostatic system, nano-substances of various shapes such as spherical, rod-form, etc. can be handled. Moreover, a nanomanipulator that is constructed by combining the nanotweezers with a three-dimensional driving mechanism facilitates the gripping, moving and releasing of nano-substances

公开(公告)号：US06566725B1

公开(公告)日：2003-05-20

申请号：US09628201

申请日：2000-07-28

Applicant: Kyle Lebouitz

Inventor： Kyle Lebouitz

IPC: H01L31058

CPC classification number: G01J5/40 ,  B81B3/0081 ,  B81B2201/0278 ,  B81B2201/032 ,  B81B2203/0118 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/06

Abstract: This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

公开(公告)号：US5709802A

公开(公告)日：1998-01-20

申请号：US415821

申请日：1995-04-03

Applicant: Tomotake Furuhata ,  Toshiki Hirano

Inventor： Tomotake Furuhata ,  Toshiki Hirano

IPC: B23Q1/34 ,  B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  B23Q16/00 ,  H02N2/00

CPC classification number: B81B3/0054 ,  B23Q1/34 ,  B81C1/0019 ,  B81C1/00198 ,  H02N1/002 ,  H02N2/0025 ,  H02N2/026 ,  B81B2201/032 ,  B81B2201/11 ,  B81B2203/0315 ,  B81B2207/053 ,  B81C2203/032 ,  Y10T29/42

Abstract: A method of fabricating a semiconductor integrated microactuator device that includes the steps of: bonding or laminating a driving element to a substrate for generating a vertical motion, and coupling a conversion element to the driving element for converting the vertical motion into rotational motion. The method can be effectively used for micro-actuators that utilize Coulomb's force, vibration, and fluid pressure as their driving force.

Abstract translation: 一种制造半导体集成微致动器装置的方法，包括以下步骤：将驱动元件接合或层压到用于产生垂直运动的基板，以及将转换元件耦合到用于将垂直运动转换成旋转运动的驱动元件。 该方法可以有效地用于利用库仑力，振动和流体压力作为驱动力的微型致动器。

公开(公告)号：US5489812A

公开(公告)日：1996-02-06

申请号：US233486

申请日：1994-04-26

Applicant: Tomotake Furuhata ,  Toshiki Hirano

Inventor： Tomotake Furuhata ,  Toshiki Hirano

IPC: B23Q1/34 ,  B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  H02N2/00 ,  B23Q16/00

CPC classification number: B81B3/0054 ,  B23Q1/34 ,  B81C1/0019 ,  B81C1/00198 ,  H02N1/002 ,  H02N2/0025 ,  H02N2/026 ,  B81B2201/032 ,  B81B2201/11 ,  B81B2203/0315 ,  B81B2207/053 ,  B81C2203/032 ,  Y10T29/42

Abstract: A device for providing micro positioning having an operating range in the submicron order in the X and Y directions, respectively. Positioning is achieved by a device which includes a driving section bonded to a silicon wafer for applying a driving force to excite vertical motion, and a mechanism for converting this vertical motion into rotational motion. Three types of micro actuators are described herein: one, that uses vibration as its driving force; a second, that uses Coulomb's force; and a third, that utilizes fluid pressure, such as air.

Abstract translation: 一种用于提供微定位的装置，其分别在X和Y方向上具有亚微米级的工作范围。 定位是通过一种装置实现的，该装置包括结合到硅晶片的驱动部分，用于施加驱动力以激发垂直运动，以及用于将该垂直运动转换成旋转运动的机构。 这里描述了三种微型致动器：一种是使用振动作为其驱动力; 一秒钟，使用库仑的力量; 第三个，利用流体压力，如空气。

公开(公告)号：US5351412A

公开(公告)日：1994-10-04

申请号：US890455

申请日：1992-05-29

Applicant: Tomotake Furuhata ,  Toshiki Hirano

Inventor： Tomotake Furuhata ,  Toshiki Hirano

IPC: B23Q1/34 ,  B81B3/00 ,  B81C1/00 ,  H01L41/09 ,  B23Q16/00

CPC classification number: B81B3/0054 ,  B23Q1/34 ,  B81C1/0019 ,  B81C1/00198 ,  H02N1/002 ,  H02N2/0025 ,  H02N2/026 ,  B81B2201/032 ,  B81B2201/11 ,  B81B2203/0315 ,  B81B2207/053 ,  B81C2203/032 ,  Y10T29/42

Abstract: A device for providing micro positioning having an operating range in the submicron order in the X and Y directions, respectively. Positioning is achieved by depositing a pair of aluminum electrodes on a piezoelectric element bonded on a silicon wafer, vertically moving the piezoelectric element, arranging a plurality of micro actuators whose contact pin ends, formed on the aluminum electrodes, rotate on a surface as an array, and displacing in the horizontal direction a moving member arranged on the micro actuator array.

Abstract translation: 一种用于提供微定位的装置，其分别在X和Y方向上具有亚微米级的工作范围。 通过在键合在硅晶片上的压电元件上沉积一对铝电极，垂直移动压电元件来实现定位，将形成在铝电极上的接触针端部的多个微致动器布置成在阵列的表面上旋转 并且在水平方向上移动布置在微致动器阵列上的移动构件。

公开(公告)号：US20240158223A1

公开(公告)日：2024-05-16

申请号：US18421596

申请日：2024-01-24

Applicant: Government of the United States, as represented by the Secretary of the Air Force

Inventor： John PK Walton ,  LaVern A. Starman ,  David Torres Reyes

IPC: B81B3/00 ,  G02B26/08

CPC classification number: B81B3/0043 ,  G02B26/0833 ,  G02B26/0841 ,  G02B26/0866 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/053 ,  B81B2203/058

Abstract: An actuator element of a MEMS device on a substrate able to create large, out-of-plane deflection includes two separated metallic layers contacting the substrate. The second metallic layer has a first portion contacting the substrate and a second portion having cantilevered over the substrate and first metallic layer. A first insulating layer contacts the cantilevered metallic layer on a bottom contacting surface and a second insulating layer contacting the cantilevered metallic layer on a portion of a top contacting surface. The second, cantilevered portion of the metallic layer is prestressed causing the distal end to deform away from the substrate. Applying a voltage potential between the first and second metallic layers creates an electrostatic field drawing the distal end toward the substrate.