公开(公告)号：US20180086947A1

公开(公告)日：2018-03-29

申请号：US15278957

申请日：2016-09-28

Applicant: JOHN BROZ

Inventor： JOHN BROZ

IPC: C09J7/04 ,  A61F13/02 ,  A61F13/10 ,  A61L24/04

CPC classification number: A61F13/0276 ,  A61F13/0253 ,  A61F13/0273 ,  A61F13/08 ,  A61F13/105 ,  A61F13/107 ,  A61F2013/00119 ,  A61L24/04 ,  C09J7/21 ,  C09J201/00 ,  C09J2205/114 ,  C09J2400/263 ,  C09J2407/00 ,  C09J2425/00 ,  C09J2471/006 ,  C09J2475/006 ,  C09J2499/006

Abstract: An adhesive elastomeric tape comprising 90 grade cheesecloth that is knitted with a medium gauge elastic yarn through a stitch bonding machine. The cloth is then coated with a petroleum base adhesive using a unique strike through method that allows a adhesive to pass through while coating both sides. A style of athletic tape that is flexible, durable, and adhesive simultaneously.

公开(公告)号：US20180057719A1

公开(公告)日：2018-03-01

申请号：US15556640

申请日：2015-03-11

Applicant: NAKASHIMA RUBBER INDUSTRY CO., LTD.

Inventor： Mikio NAKASHIMA ,  Yoshikuni TAKATA ,  Takemi YOSHIZUMI ,  Rikito EGUCHI

IPC: C09J123/12 ,  C09J167/02 ,  C09J5/06 ,  C09J7/02 ,  C08G63/183 ,  C08L23/12

CPC classification number: C09J123/12 ,  C08G63/183 ,  C08L23/12 ,  C08L2203/16 ,  C09J5/06 ,  C09J7/00 ,  C09J7/405 ,  C09J167/02 ,  C09J201/00 ,  C09J2417/00 ,  C09J2423/105 ,  C09J2467/005

Abstract: The adhesive sheet for bonding an unvulcanized rubber to a metal, including, a release film, which includes a first film layer made of polypropylene and a second film layer made of polyethylene terephthalate, and which is formed as an integrated film, an upper adhesive layer obtained by applying a solvent dispersed type vulcanization adhesive having reactivity with the unvulcanized rubber to a side of the first film layer of the release film and drying the solvent dispersed type vulcanization adhesive, and a lower adhesive layer obtained by, after drying the upper adhesive layer, applying an adhesive having reactivity with the metal onto the upper adhesive layer, and by drying the adhesive.

公开(公告)号：US20180044559A1

公开(公告)日：2018-02-15

申请号：US15555986

申请日：2016-02-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mary M. Caruso Dailey ,  Ying Lin ,  John C. Hulteen ,  Ibrahim A. El Hedok ,  Hassan Sahouani ,  Yongshang Lu

IPC: C09J11/08 ,  C09J175/08 ,  C09J133/02 ,  C09J163/00 ,  C09J7/02

CPC classification number: C09J11/08 ,  C08L71/02 ,  C09D7/65 ,  C09D7/66 ,  C09D201/00 ,  C09J7/20 ,  C09J7/385 ,  C09J133/02 ,  C09J163/00 ,  C09J175/08 ,  C09J201/00 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2471/00 ,  C09J2475/00 ,  C09J2483/00

Abstract: Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The composition includes an adhesive and porous polymeric particles disposed in the adhesive. Further, a method of coating a substrate is provided including providing a composition, providing a substrate having a surface, and applying the composition on the surface of the substrate. The compositions and adhesive articles can be applied to wet substrates or dry substrates.

公开(公告)号：US20180037272A1

公开(公告)日：2018-02-08

申请号：US15785872

申请日：2017-10-17

Applicant: Zephyros, Inc.

Inventor： Henry E. Richardson ,  Alexander G. Mangiapane

IPC: B62D29/04 ,  B62D21/15 ,  C09J201/00 ,  B29C69/02 ,  B29K105/04 ,  B29K63/00 ,  B29K105/00 ,  B29L31/30

CPC classification number: B62D29/041 ,  B29C69/02 ,  B29K2063/00 ,  B29K2105/0097 ,  B29K2105/04 ,  B29L2031/30 ,  B62D21/15 ,  B62D25/00 ,  B62D29/002 ,  C09J201/00

Abstract: A structural reinforcement comprising a base reinforcing structure including a plurality of ribs and having a first surface and a second surface, an expandable adhesive material located onto a first portion of the first surface, and a sealant material located around an edge of the second surface, the second surface being substantially free of any of the plurality of ribs.

公开(公告)号：US20180026003A1

公开(公告)日：2018-01-25

申请号：US15527232

申请日：2016-04-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoaki MIHARA ,  Noriyuki KIRIKAE ,  Jirou SUGIYAMA

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/02

CPC classification number: H01L24/29 ,  C09J7/00 ,  C09J7/20 ,  C09J7/22 ,  C09J7/30 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J179/04 ,  C09J201/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68377 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, provided is an electrically conductive adhesive film, which includes metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of −0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, the present invention provides a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.

公开(公告)号：US20170362472A1

公开(公告)日：2017-12-21

申请号：US15533182

申请日：2015-12-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuyuki Matsumura ,  Koichi Fujimaru ,  Daisuke Kanamori

IPC: C09J11/04 ,  C09J171/12 ,  C09J11/06 ,  H01L23/544 ,  H01L23/00 ,  C09J163/00 ,  C09J193/04

CPC classification number: C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J171/12 ,  C09J193/04 ,  C09J201/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/16501 ,  H01L2224/8113 ,  H01L2224/81855 ,  H01L2924/3512 ,  C08K3/36 ,  C08L93/04

Abstract: The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

公开(公告)号：US20170349790A1

公开(公告)日：2017-12-07

申请号：US15541131

申请日：2015-07-17

Applicant: LINTEC Corporation

Inventor： Masaya TODAKA ,  Baku KATAGIRI ,  Kenta TOMIOKA ,  Tomoo ORUI

IPC: C09J7/02 ,  G06F3/044

CPC classification number: G06F3/044 ,  C09J7/22 ,  C09J7/38 ,  C09J201/00 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2451/00 ,  G06F2203/04103

Abstract: Provided are a surface protection film which would stably display an image, and would stably attain a mirror state, and which would be stably operated without inhibiting display operability.Disclosed is a surface protection film including a resin film and a pressure-sensitive adhesive layer, in which the relative permittivity of the resin film is of 1.0 to 5.0, the reflectance is set to a value within the range of 20% to 80%, and the transmittance for light is of 20% to 80%.

公开(公告)号：US20170327616A1

公开(公告)日：2017-11-16

申请号：US15533942

申请日：2015-12-01

Applicant: TOAGOSEI CO., LTD.

Inventor： Kenichi ISHIZAKI ,  Yushi ANDO

IPC: C08F222/32 ,  C08L101/12 ,  C08K5/315 ,  C08L101/10 ,  C09J201/00 ,  C08F2/44

CPC classification number: C08F222/32 ,  C08F2/44 ,  C08F2222/328 ,  C08K5/057 ,  C08K5/315 ,  C08K5/5425 ,  C08L101/10 ,  C08L101/12 ,  C09J4/06 ,  C09J201/00 ,  C08F255/06 ,  C08F283/06

Abstract: The two-part curable composition has excellent curability, and exhibits flexibility and adhesion durability. The two-part curable composition includes a first reagent containing at least a 2-cyanoacrylic acid ester and a second reagent containing at least a polymer having a hydrolyzable silyl group, in which an elastomer and a curing catalyst for the above polymer are each contained in at least one of the first and second reagents in predetermined amounts. A preferable curing catalyst is a compound having a metal element and an organic group bonded to the metal element via oxygen, or an acid having a pKa of 4 or lower at 25° C. Preferably, a curing accelerator for 2-cyanoacrylic acid ester is contained in at least one of the first and second reagents.

公开(公告)号：US20170275385A1

公开(公告)日：2017-09-28

申请号：US15511183

申请日：2015-09-25

Applicant: RENMATIX, INC.

Inventor： Ewellyn A. CAPANEMA ,  Mikhail Y. BALAKSHIN ,  Patrick David FITZGIBBON ,  Matyas KOSA ,  Todd Michael MCLARTY ,  Charles Sebastian SANDERSON

IPC: C08B15/08 ,  C08L1/02 ,  C08L97/00 ,  C08B37/00

CPC classification number: C08B15/08 ,  C07G1/00 ,  C08B11/18 ,  C08B15/00 ,  C08B15/02 ,  C08B15/06 ,  C08B37/0057 ,  C08H6/00 ,  C08L1/02 ,  C08L97/005 ,  C08L97/02 ,  C09J11/06 ,  C09J101/02 ,  C09J161/06 ,  C09J175/04 ,  C09J201/00 ,  G01N23/20

Abstract: Cellulose-containing compositions and method of making same are disclosed. The compositions comprise a cellulose product comprising a type-I cellulose, a type-II cellulose, amorphous cellulose, or a combination thereof. Further, methods are disclosed for making these compositions and for further hydrolyzing these compositions. Additionally, uses for the cellulose-containing compositions are disclosed.

公开(公告)号：US09735099B2

公开(公告)日：2017-08-15

申请号：US15384966

申请日：2016-12-20

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Akane Kobayashi ,  Yoshito Akutagawa

IPC: H01L23/48 ,  H01L23/498 ,  C09J7/02 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L23/49838 ,  C09J7/22 ,  C09J201/00 ,  C09J2203/326 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68386 ,  H01L2224/1146 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/16104 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/00 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01322 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/56 ,  H01L2221/68381

Abstract: A wiring substrate used for improvement in manufacturing efficiency of a semiconductor device includes a support body having transparency; an adhesive layer disposed on a main surface of the support body, the adhesive layer including a peeling layer which contains a third resin which is decomposed by light irradiation and a protective layer which is disposed on the peeling layer and contains a fourth resin; and a laminate disposed on the adhesive layer, the laminate including a first resin layer, a second resin layer disposed on the first resin layer, and a wiring pattern disposed at least between the first resin layer and the second resin layer. Accordingly, the semiconductor chip and the wiring substrate which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device.