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    MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC)
    101.
    发明申请
    MIXED-METAL SYSTEM CONDUCTORS FOR LTCC (LOW-TEMPERATURE CO-FIRED CERAMIC) 有权
    用于LTCC（低温共烧陶瓷）的混合金属系统导体

    公开(公告)号：US20110155431A1

    公开(公告)日：2011-06-30

    申请号：US12981196

    申请日：2010-12-29

    Applicant: Kumaran Manikantan Nair ,  Scott E. Gordon ,  Mark Frederick McCombs

    Inventor： Kumaran Manikantan Nair ,  Scott E. Gordon ,  Mark Frederick McCombs

    IPC: H05K1/09 ,  H01B1/22

    CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

    Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

    Abstract translation: 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。

    PACKAGE STRUCTURE
    103.
    发明公开
    PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20240215202A1

    公开(公告)日：2024-06-27

    申请号：US18513650

    申请日：2023-11-20

    Applicant: TMY Technology Inc.

    Inventor： Pei-Hung Kuo

    IPC: H05K7/20 ,  H05K1/02 ,  H05K3/28

    CPC classification number: H05K7/20436 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/032

    Abstract: A package structure includes a substrate having a bearing surface, an electronic component disposed on the bearing surface and having a first height, at least one heat conductor disposed on the bearing surface and having a second height, an encapsulant disposed on the bearing surface and having a side covering the electronic component and the at least one heat conductor and a third height, and a heat dissipation structure disposed on the encapsulant. The third height is greater than or equal to the first height and the second height. A surrounding area where the substrate is in contact with the electronic component is a heat-generating area, and the at least one heat conductor is disposed in the heat-generating area.

    WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR PACKAGE
    106.
    发明公开
    WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230209725A1

    公开(公告)日：2023-06-29

    申请号：US17926710

    申请日：2021-06-23

    Applicant: Showa Denko Materials Co., Ltd.

    Inventor： Masaya TOBA ,  Kazuyuki MITSUKURA

    IPC: H05K3/38 ,  H05K3/46 ,  H05K3/18 ,  H01L23/498 ,  H01L21/48 ,  H05K1/09

    CPC classification number: H05K3/381 ,  H05K3/4644 ,  H05K3/18 ,  H01L23/49838 ,  H01L21/486 ,  H05K1/09 ,  H05K2203/0723 ,  H05K2201/032

    Abstract: Disclosed is a method for manufacturing a wiring structure including a step of forming a wiring on an insulating resin layer. The step of forming the wiring includes: forming a modified region including pores in a surface layer of the insulating resin layer by treating a surface of the insulating resin layer with a treatment method including surface modification; forming a seed layer on the surface of the insulating resin layer by sputtering; and forming the wiring on the seed layer by electrolytic copper plating. The disclosed method may include, in this order: a step of forming a surface treatment agent layer that covers a surface of the wiring by treating the surface of the wiring with a surface treatment agent for improving adhesion; and a step of forming a modified region including pores in a surface layer of a first layer of the insulating resin layer by treating the surface of the first layer of the insulating resin layer with a treatment method including surface modification.

    PCB ELECTROPLATING AND ELECTRICAL CONNECTION BOX STRUCTURE AND MODULAR LUMINAIRE
    109.
    发明申请
    PCB ELECTROPLATING AND ELECTRICAL CONNECTION BOX STRUCTURE AND MODULAR LUMINAIRE 审中-公开

    公开(公告)号：US20180156397A1

    公开(公告)日：2018-06-07

    申请号：US15539883

    申请日：2016-07-22

    Applicant: Chi Wai Patrick POON

    Inventor： Chi Wai (Zhiwei) Patrick Poon (Pan)

    IPC: F21S2/00 ,  F21V19/00 ,  F21V23/06 ,  F21V23/04 ,  F21S9/02 ,  F21V17/12 ,  F21V21/096 ,  H05K1/18

    CPC classification number: F21S2/005 ,  F21S9/02 ,  F21V15/01 ,  F21V17/12 ,  F21V19/0025 ,  F21V19/003 ,  F21V21/005 ,  F21V21/096 ,  F21V23/04 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/18 ,  H05K2201/032 ,  H05K2201/10106 ,  H05K2201/10113

    Abstract: The present invention relates to an electrical connection structure for a PCB and an electroplating frame, and a modular lamp. The modular lamp comprises a plurality of light-emitting modules. Each light-emitting module comprises a housing and a lamp plate arranged within the housing, a light source and conductive connectors electrically connected to the light source being arranged on the lamp plate, an outer side wall of the housing being provided with two sets of conductive strips surrounding the outer side wall and protruding from the outer side wall, the two sets of conductive strips being respectively electrically connected to two electrodes of the lamp plate via the conductive connectors. After the plurality of light-emitting modules have been assembled and joined together, adjacent light-emitting modules are in contact and electrically connected via the conductive strips. The modular lamp is provided with the plurality of light-emitting modules, the shapes of the light-emitting modules are flexible and variable, each module is designed independently, and after the light-emitting modules have been joined together, adjacent light-emitting modules are electrically connected via the conductive strips on the outer side walls and may be combined to form a variety of shapes. The present invention is simple in operation, and strong in combination operability.

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