公开(公告)号：US20020145171A1

公开(公告)日：2002-10-10

申请号：US10117614

申请日：2002-04-05

Applicant: Sharp Kabushiki Kaisha

Inventor： Koichi Miyachi ,  Yoshihiro Izumi ,  Hiroshi Gohda

IPC: H01L027/14 ,  H01L031/00

CPC classification number: G02B6/125 ,  G02B6/43 ,  G02B2006/12038 ,  G02B2006/12178 ,  H01L2924/0002 ,  H05K3/403 ,  H05K3/4611 ,  H05K2201/0326 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09836 ,  H01L2924/00

Abstract: The circuit structure of the present invention has a plurality of conductive path layers and at least one interlayer isolating layer formed between the plurality of conductive path layers. Each of the plurality of conductive path layers has at least one conductive path capable of transmitting light or electricity therethrough. Each of a plurality of input/output (I/O) sections is connected to any one of the plurality of conductive paths. Each of the plurality of conductive path layers has a first laminated structure that includes a plurality of first conductive layers and at least one first isolating layer formed therebetween. The interlayer isolating layer has a second laminated structure that includes a plurality of second isolating layers and at least one second conductive layer formed therebetween.

Abstract translation: 本发明的电路结构具有形成在多个导电路径层之间的多个导电路径层和至少一个层间隔离层。 多个导电路径层中的每一个具有能够透过光或电的至少一个导电路径。 多个输入/输出（I / O）部分中的每一个连接到多个导电路径中的任何一个。 多个导电路径层中的每一个具有包括多个第一导电层和在它们之间形成的至少一个第一隔离层的第一层叠结构。 层间绝缘层具有包括多个第二隔离层和在其间形成的至少一个第二导电层的第二层叠结构。

公开(公告)号：US20020089089A1

公开(公告)日：2002-07-11

申请号：US10092186

申请日：2002-03-06

Applicant: Micron Technology, Inc.

Inventor： Refugio C. Morales

IPC: B29C059/02 ,  B29C059/04

CPC classification number: B29C67/0044 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0195 ,  H05K2203/0228

Abstract: The present invention relates to a tool, and method of its use, that puts a pair of bevels onto an edge of a printed circuit board (PCB) so that the PCB can be inserted into an expansion slot of a computer. The tool has a bevel wheel, preferably with a bi-laterally symmetrical angle channel shape, that is connected to a carriage. The bevel wheel rolls along the carriage while the bevel wheel is pressed onto the edge of the PCB so as to form the pair of bevels on the edge of the PCB. No material is removed from the PCB while forming the pair of bevels. The bevel wheel is forced upon the edge using a piston that monitors and regulates the pressure applied to the edge of the PCB in order to achieve a preferred height and angular orientation of the pair of bevels.

Abstract translation: 本发明涉及一种工具及其使用方法，其将一对斜面放置在印刷电路板（PCB）的边缘上，使得PCB可以插入到计算机的扩展槽中。 该工具具有斜盘轮，优选地具有连接到托架的双向对称的角形通道形状。 斜齿轮沿滑架滚动，而斜齿轮被压在PCB的边缘上，以便在PCB的边缘上形成一对斜面。 在形成一对斜面时，没有从PCB上移除材料。 使用活塞来迫使斜齿轮在边缘上，所述活塞监测和调节施加到PCB的边缘的压力，以便实现该对斜面的优选高度和角度定向。

公开(公告)号：US06369336B1

公开(公告)日：2002-04-09

申请号：US09267442

申请日：1999-03-12

Applicant: Hiroyuki Obata

Inventor： Hiroyuki Obata

IPC: H05K111

CPC classification number: H01R12/721 ,  H01R12/714 ,  H01R13/2464 ,  H05K1/117 ,  H05K3/429 ,  H05K2201/09154 ,  H05K2201/09481

Abstract: A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).

Abstract translation: 公开了一种印刷电路板，其具有位于其上表面和下表面上的板主体的边缘附近的导电焊盘，以减小接触滑动方向上的宽度，并提供电连接器的电触点与 导电焊盘，尽管由于导电焊盘和电触头之间的摩擦而产生的粉末状物质。 印刷电路板（1）在主体（2）的边缘（3）附近在板主体（2）的上表面和下表面上具有导电焊盘（14a，14b）。 电触点（20）从电路板主体（2）的边缘（3）滑过导电焊盘（14a，14b）。 导电焊盘（14a，14b）通过位于触点（20）的路径中的通孔（15a）连接在一起。

公开(公告)号：US20010021543A1

公开(公告)日：2001-09-13

申请号：US09771675

申请日：2001-01-29

Inventor： Achim Neu ,  Thies Janczek

IPC: H01L021/44

CPC classification number: H01L24/02 ,  H01L23/49805 ,  H01L23/49861 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/0919 ,  Y02P70/613 ,  H01L2924/00

Abstract: The integrated component has a plurality of contact elements disposed at an edge region of a main surface of the integrated component which contains the functional element. The contact elements project into the edge region of the main surface and have at least one contact surface that is inclined relative to the main surface. The component is configured to be fastened to conductor tracks of a fastening device, such that the conductor tracks are disposed to face the component body and extend parallel to the main surface of the component body.

Abstract translation: 集成部件具有设置在包含功能元件的集成部件的主表面的边缘区域处的多个接触元件。 接触元件突出到主表面的边缘区域中并且具有相对于主表面倾斜的至少一个接触表面。 该部件被配置为紧固到紧固装置的导体轨道，使得导体轨道设置成面向组件主体并且平行于部件主体的主表面延伸。

公开(公告)号：US6142726A

公开(公告)日：2000-11-07

申请号：US250464

申请日：1999-02-16

Applicant: Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

Inventor： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

IPC: B23C3/12 ,  H01L21/00 ,  H01L21/68 ,  H05K3/00 ,  B65G65/00

CPC classification number: H01L21/67092 ,  B23C3/12 ,  H01L21/68 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

Abstract: An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

Abstract translation: 用于加载，倒角和卸载用于电子部件的陶瓷或陶瓷/聚合物基板的装置。 自动装载装载机将基板作为一个单元移动，使用易碎的销来推动零件。 部件装载机将第一基板与其余部分分开，并且负载基座将第一基板向上推入装载/卸载嵌套。 负载基座安装在杆上，使得基板可以横向移动以使其自身居中。 然后，巢旋转以将基底装载到可移动的过程基座上。 倒角装置包括一对间隔开的可旋转切割主轴，用于在基板上倒角边缘和拐角。 切割锭子包括：i）分离的顶部和底部边缘切割器，用于同时倒角固定在载体上的基底的边缘的顶部和底部，当基底通过心轴之间时，以及ii）角部切割器，用于同时倒角固定在基底上的基底的角部 载体作为基板接触心轴。 基座使基板围绕垂直于基板平面的轴线旋转，并使基板沿垂直于基板平面的方向移动，以将切割主轴的未被引导的边缘和拐角呈现。 可以启动过程基座上的盘式制动器，以防止倒角期间基底的旋转。 外壳围绕基板，在倒角期间倒角切割器和工艺基座，并且利用由旋转切割器提供的空气流将芯片推进到颗粒收集器中。

公开(公告)号：US5752797A

公开(公告)日：1998-05-19

申请号：US629300

申请日：1996-04-08

Applicant: Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

Inventor： Robert Peter Westerfield, Jr. ,  Thomas Gerard Jantz ,  Robert Paul Kuder, II ,  David Clyde Linnell ,  Robert Albert Meyen

IPC: B23C3/12 ,  H01L21/00 ,  H01L21/68 ,  H05K3/00

CPC classification number: H01L21/67092 ,  B23C3/12 ,  H01L21/68 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228

Abstract: An apparatus for loading, chamfering and unloading a ceramic or ceramic/polymer substrate for electronic components. An automatic part loader moves substrates in a row as a unit, using a frangible pin to push the parts. The part loader separates the first of the substrates from the rest, and a load pedestal pushes the first substrate up into a loading/unloading nest. The load pedestal is mounted on rods so that the substrate may move laterally to center itself in the nest. The nest then rotates to load the substrate onto a movable process pedestal. The chamfering apparatus includes a pair of spaced, rotatable cutting spindles for chamfering edges and corners on the substrate. The cutting spindles include: i) separate top and bottom edge cutters for simultaneously chamfering top and bottom of edges of a substrate secured on the carrier as the substrate passes between the spindles and ii) corner cutters for simultaneously chamfering corners of a substrate secured on the carrier as the substrate contacts the spindles. The pedestal rotates the substrate about an axis normal to the plane of the substrate and moves the substrate in a direction normal to the plane of the substrate to present unchamfered edges and corners to the cutting spindles. A disc brake on the process pedestal may be actuated to prevent rotation of the substrate during chamfering. An enclosure surrounds the substrate, chamfering cutters and process pedestal during chamfering and utilizes the air flow supplied by the rotating cutters to propel chips into a particle collector.

公开(公告)号：US5012388A

公开(公告)日：1991-04-30

申请号：US425840

申请日：1989-10-20

Applicant: Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

Inventor： Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

IPC: H01G4/12 ,  H01C1/012 ,  H01C7/00 ,  H01C17/00 ,  H01G2/06 ,  H01G4/252 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01G2/065 ,  H01C17/006 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10636 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: A chip type electronic component includes a main body having opposite first and second end surfaces and a lower surface defining a first plane. First and second electrode portions are respectively connected to the first and second end surfaces of the main body. Each of the first and second electrode portions includes a lower surface. Each lower surface of the first and second electrode portions includes a first planar face extending adjacent the main body in a second plane which is parallel to the first plane defined by the main body, and a second planar face extending adjacent the first planar face in a third plane which extends upwardly at an angle relative the second plane away from the main body. Accordingly, upon mounting of the chip type electronic component to a planar circuit board, a space is provided between the second planar face of each of the first and second electrode portions for accommodating solder materials.

Abstract translation: 芯片型电子部件包括具有相对的第一和第二端面的主体和限定第一平面的下表面。 第一电极部分和第二电极部分分别连接到主体的第一和第二端面。 第一电极部分和第二电极部分中的每一个包括下表面。 第一电极部分和第二电极部分的每个下表面包括在平行于由主体限定的第一平面的第二平面中相对于主体延伸的第一平面和与第一平面相邻延伸的第二平面， 第三平面，其以相对于第二平面离开主体的一角度向上延伸。 因此，在芯片型电子部件安装在平面电路基板上时，在第一和第二电极部分的第二平面之间设置有容纳焊料的空间。

公开(公告)号：US4383495A

公开(公告)日：1983-05-17

申请号：US390579

申请日：1982-06-21

Applicant: George J. Plichta ,  Thomas E. Unger

Inventor： George J. Plichta ,  Thomas E. Unger

IPC: H05K1/05 ,  H05K1/09 ,  H05K3/12 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4053 ,  H05K3/403 ,  H05K1/056 ,  H05K1/095 ,  H05K2201/09154 ,  H05K2201/09981 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0709 ,  H05K2203/0763 ,  H05K3/1216

Abstract: The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a length no greater than the thickness of the substrate 12. After ink 24 has been applied to the top surface of the substrate, the inserted fingers 22 are withdrawn, thereby drawing the ink down into the thru holes and coating the walls 41. In another embodiment, fingers 62 are aligned with selected portions 52 of an edge 55 of the substrate 50 to coat the portions of the edge as the fingers are moved by the edge after the heads of the fingers have been coated with the ink 24.

Abstract translation: 印刷线路板基板12中的通孔11的壁41（图4）通过将指状物22插入通孔中而涂覆有液体24。 每个指状物的直径略小于相关通孔的直径，并且具有不大于基底12的厚度的长度。在将墨24施加到基底的顶表面之后，插入的指状物22是 抽出，从而将墨水向下拉入通孔并涂覆壁41.在另一个实施例中，指状物62与衬底50的边缘55的选定部分52对齐，以在手指移动时涂覆边缘的部分 在手指的头部之后的边缘已经涂覆有墨水24。

公开(公告)号：US3973817A

公开(公告)日：1976-08-10

申请号：US583384

申请日：1975-06-03

Applicant: Anthony Donald Stalley ,  Michael Anthony Richard Young

Inventor： Anthony Donald Stalley ,  Michael Anthony Richard Young

IPC: H01R12/50 ,  H05K1/11 ,  H05K3/24 ,  H05K10/00 ,  H01R3/06

CPC classification number: H01R23/70 ,  H01R12/722 ,  H01R12/73 ,  H05K1/117 ,  H05K10/00 ,  H05K2201/0746 ,  H05K2201/09154 ,  H05K2201/094 ,  H05K3/242

Abstract: A circuit board having a multiway connector disposed along one edge thereof. The multiway connector includes a plurality of contacts. Earth path contacts of the connector are offset in relation to the remaining contacts so as to be the first to make connection with the corresponding connector upon insertion of the board into the connector and conversely the last to break connection upon extraction of the board from the corresponding connector.

Abstract translation: 具有沿着其一个边缘设置的多路连接器的电路板。 多路连接器包括多个触点。 连接器的接地路径触点相对于剩余的触点偏移，以便在将电路板插入连接器中时首先与相应的连接器连接，相反地，当从相应的电路板提取电路板时，最后断开连接 连接器。

公开(公告)号：US3605060A

公开(公告)日：1971-09-14

申请号：US3605060D

申请日：1968-08-05

Applicant: HONEYWELL INC

Inventor： PRAEGER EBERHARDT P ,  WOLFSET BRIAN A

IPC: H01R12/77 ,  H05K1/11 ,  H05K3/34 ,  H01R13/50 ,  H05K1/04

CPC classification number: H05K1/117 ,  H01R12/777 ,  H05K3/3405 ,  H05K2201/09154 ,  H05K2201/10356 ,  Y10T29/49179 ,  Y10T29/49213

Abstract: A new termination, with which a miniature ribbon cable can be connected readily to other electrical devices, has adjacent cable conductors connected without fan-out to a connector plate having contacts on opposite sides of a boardlike insulator. The cable insulation is removed from the conductors, prior to assembly of the cable with the connector plate, preferably along the entire conductor length that overlies the insulator.

Abstract translation: 微型带状电缆可以容易地连接到其他电气设备的新端接件具有相邻的电缆导体连接而没有扇出连接到在板状绝缘体的相对侧上具有触点的连接器板。 在将电缆与连接器板组装之前，优选地沿着覆盖在绝缘体上的整个导体长度，电缆绝缘层从导体上移除。