公开(公告)号：US20080089032A1

公开(公告)日：2008-04-17

申请号：US11309887

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K7/20

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括电路板，第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔，用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线，另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击，可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US20080011814A1

公开(公告)日：2008-01-17

申请号：US10596349

申请日：2004-11-08

Applicant: Stefano Oggioni ,  Thomas Albrecht ,  Michel Despont ,  Mark Lantz ,  Michele Castriotta

Inventor： Stefano Oggioni ,  Thomas Albrecht ,  Michel Despont ,  Mark Lantz ,  Michele Castriotta

IPC: B23K31/02 ,  B81B7/00

CPC classification number: B81C3/002 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/2036 ,  H05K2203/048 ,  Y02P70/613

Abstract: A method and system for efficiently self-aligning parts of a MEMS during manufacturing, as well as controlling distance between these parts, are disclosed. According to the invention each MEMS part comprises at least one pad that is aligned so as to form a pair of pads. In a preferred embodiment, each part comprises three pads. The pad shape of two pairs of pads is rectangular, one pair being rotated of an angle approximately equal to 90° from the other, and the pad shape of the third pair is annular. Therefore, one of the pair of pads allows alignment according to a first direction, a second pair of pads allows alignment according to a second direction, and the third pair of pads allows rotational alignment.

Abstract translation: 公开了一种用于在制造期间有效地对准MEMS部件的方法和系统，以及控制这些部件之间的距离。 根据本发明，每个MEMS部件包括至少一个对准以形成一对焊盘的焊盘。 在优选实施例中，每个部分包括三个焊盘。 两对焊盘的焊盘形状是矩形的，一对由另一对旋转大约等于90°的角度，第三对的焊盘形状是环形的。 因此，一对衬垫之一允许根据第一方向进行对准，第二对衬垫允许根据第二方向对准，并且第三对衬垫允许旋转对准。

公开(公告)号：US07298629B2

公开(公告)日：2007-11-20

申请号：US11341675

申请日：2006-01-30

Applicant: Yuji Nakajima ,  Kana Onoko

Inventor： Yuji Nakajima ,  Kana Onoko

IPC: H05K7/12

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A circuit board has a plurality of pads arranged as a grid array in a quadrangle region. A surface mount type circuit component is connected to the circuit board through the pads. Each of pads arranged in the outermost side of the quadrangle region is formed in a substantially quadrangle shape in plan view.

Abstract translation: 电路板具有在四边形区域中布置为栅格阵列的多个焊盘。 表面安装型电路部件通过焊盘与电路板连接。 布置在四边形区域的最外侧的每个焊盘在平面图中形成为大致四边形。

公开(公告)号：US07196402B2

公开(公告)日：2007-03-27

申请号：US10937647

申请日：2004-09-08

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495

CPC classification number: H01L24/12 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10825 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。

公开(公告)号：US20060216032A1

公开(公告)日：2006-09-28

申请号：US11088463

申请日：2005-03-23

Applicant: Stuart Millard

Inventor： Stuart Millard

IPC: H04B10/00

CPC classification number: H05K1/0243 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H05K1/181 ,  H05K2201/09236 ,  H05K2201/09418 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An integrated circuit product, for bidirectional communication, has two inputs and two outputs. The first input is located on a first edge of the integrated circuit product. The first output is located on a second edge of the integrated circuit product, the second edge being located adjacent to the first edge. The second input is located on a third edge of the integrated circuit product, the third edge being opposite the first edge. The second output is located on a fourth edge of the integrated circuit product, the fourth edge being opposite the second edge. The integrated circuit product can be mounted diagonally in a transceiver module, allowing straight signals paths from the inputs and outputs of the integrated circuit product to the corresponding inputs and outputs of the transceiver module. The inputs and outputs of the integrated circuit product can be located in the respective centre regions of their respective edges, so that connection pads of the integrated circuit within the integrated circuit product can be connected to the package landings of the integrated circuit product by means of the shortest available bond wires.

Abstract translation: 用于双向通信的集成电路产品具有两个输入和两个输出。 第一输入端位于集成电路产品的第一边。 第一输出位于集成电路产品的第二边缘上，第二边缘位于第一边缘附近。 第二输入位于集成电路产品的第三边缘上，第三边缘与第一边缘相对。 第二输出位于集成电路产品的第四边缘上，第四边缘与第二边缘相对。 集成电路产品可以对角地安装在收发器模块中，允许从集成电路产品的输入和输出到收发器模块的相应输入和输出的直线信号路径。 集成电路产品的输入和输出可以位于其相应边缘的相应中心区域中，使得集成电路产品内的集成电路的连接焊盘可以通过以下方式连接到集成电路产品的封装着陆 最短可用的接合线。

公开(公告)号：US07108526B2

公开(公告)日：2006-09-19

申请号：US11004340

申请日：2004-12-03

Applicant: Josef Loibl ,  Georg Mentzel

Inventor： Josef Loibl ,  Georg Mentzel

IPC: H01R3/00

CPC classification number: H01R4/027 ,  H05K1/117 ,  H05K3/36 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10287

Abstract: A component, equipped for rotational insertion into a circuit module, has at least one contact electrically coupled to a first terminus of a connecting wire. The connection wire has a second terminus electrically coupled to a counter-contact on the circuit module. The contact has an annular extension in the circumferential direction which encloses the counter-contact even when a radial center line of the contact area angular extension lies outside the counter-contact angular extension. The contact may be ring-segment shaped or ring shaped. Numerous contacts may be arranged at different radial distances from the component's axis of rotation.

Abstract translation: 配备用于旋转插入电路模块的部件具有电连接到连接线的第一端的至少一个触头。 连接线具有电耦合到电路模块上的反接触的第二端。 即使当接触区域角延伸部的径向中心线位于反接触角延伸部分的外侧时，接触件也在圆周方向上具有包围反接触的环形延伸部。 触点可以是环形的或环形的。 可以将多个触点布置在与部件的旋转轴线不同的径向距离处。

公开(公告)号：US20060172566A1

公开(公告)日：2006-08-03

申请号：US11341675

申请日：2006-01-30

Applicant: Yuji Nakajima ,  Kana Onoko

Inventor： Yuji Nakajima ,  Kana Onoko

IPC: H05K1/00

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A circuit board has a plurality of pads arranged as a grid array in a quadrangle region. A surface mount type circuit component is connected to the circuit board through the pads. Each of pads arranged in the outermost side of the quadrangle region is formed in a substantially quadrangle shape in plan view.

Abstract translation: 电路板具有在四边形区域中布置为栅格阵列的多个焊盘。 表面安装型电路部件通过焊盘与电路板连接。 布置在四边形区域的最外侧的每个焊盘在平面图中形成为大致四边形。

公开(公告)号：US20060164820A1

公开(公告)日：2006-07-27

申请号：US11328737

申请日：2006-01-10

Applicant: Donald Mecker

Inventor： Donald Mecker

IPC: H05K7/08 ,  H05K7/02 ,  H05K7/06 ,  H05K7/10

CPC classification number: H05K1/181 ,  G11C5/04 ,  G11C5/063 ,  H05K1/144 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10689 ,  Y02P70/611

Abstract: The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board with memory components, such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.

Abstract translation: 本发明涉及具有径向排列的部件的电路板。 一个具体实施例是具有诸如DRAM芯片的存储器组件的存储器电路板，其围绕中心点径向排列。 本发明还涉及堆叠并连接具有径向排列的部件的多个电路板。 本发明的另一实施例涉及在电路板模块上准备径向排列的部件的方法，该组件具有基本上等距离的部件路径。

公开(公告)号：US20060110848A1

公开(公告)日：2006-05-25

申请号：US10991360

申请日：2004-11-19

Applicant: Paul Brown

Inventor： Paul Brown

IPC: H01L21/50

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/114 ,  H05K2201/09227 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Enlarged spacing is provided between rows of vias in a ball grid array (BGA) multilayered printed wiring board land pattern in which the lands in the pattern are connected to the vias by a link connector by rotating, elongating, and/or truncating selected consecutive link connectors and rotating their respective corresponding vias in a row or column or selected consecutive rows or columns to achieve the enlarged spacing between rows or columns of vias in the BGA land pattern. Enhanced spacing between selected grid columns or rows of vias is provided such that some of the grid pitches for the vias are equal to that of the standard BGA and at least some are of a greater grid pitch.

Abstract translation: 在球栅阵列（BGA）多层印刷布线板焊盘图案中的通孔列之间设置放大的间隔，其中图案中的焊盘通过链接连接器通过旋转，延长和/或截断选定的连续链接 连接器，并且将它们各自的对应的通孔以行或列或所选的连续的行或列旋转，以实现BGA焊盘图案中的通孔的行或列间的间隔。 提供所选网格列或通孔列之间的增强间距，使得用于通孔的一些网格间距等于标准BGA的网格间距，并且至少一些具有更大的网格间距。

公开(公告)号：US20060082001A1

公开(公告)日：2006-04-20

申请号：US11241925

申请日：2005-10-04

Applicant: Shigenori Miyagawa

Inventor： Shigenori Miyagawa

IPC: H01L23/48

CPC classification number: H01L23/49838 ,  H01L23/49833 ,  H01L2224/05552 ,  H01L2924/3011 ,  H05K1/114 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/10734

Abstract: A printed wiring board mounted with a BGA package including pads, through holes and leads. The leads are linearly formed with almost the same width as the diameter of each of the pads and through holes and thus have high bonding strength against their peeling against an external force. The pads are provided at an angle of approximately 45 degrees outwardly relative to the through holes and along almost in the direction of application of thermal stress, and thus have high durability against their peeling due to an external force.

Abstract translation: 安装有包括垫，通孔和引线的BGA封装的印刷线路板。 引线线性地形成有与每个焊盘和通孔的直径几乎相同的宽度，因此具有高的抵抗外力的剥离力的结合强度。 焊盘相对于通孔以大致45度的角度设置，并且几乎沿着施加热应力的方向设置，因此由于外力而对其剥离具有高的耐久性。