公开(公告)号：US20240292522A1

公开(公告)日：2024-08-29

申请号：US18424681

申请日：2024-01-26

Applicant: Micron Technology, Inc.

Inventor： Prasad Nagavenkata Nune ,  Christopher Glancey ,  Yeow Chon Ong ,  Hong Wan Ng

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/09418 ,  H05K2201/10159

Abstract: A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one or more damper device. The upper stiffener is above the first side of the package board and has a die side and a package side. The lower stiffener is interposed between the upper stiffener and the package board and has a damper side and a board side. The lower stiffener includes through-package anchors extending from the board side and through the package board. The one or more damper devices are interposed between and are in contact with each of the upper stiffener and the lower stiffener. Microelectronic devices and electronic systems are also described.

公开(公告)号：US20240284594A1

公开(公告)日：2024-08-22

申请号：US18653496

申请日：2024-05-02

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung BAE ,  Wonkyu KWAK ,  Cheolgeun AN

IPC: H05K1/11 ,  G02F1/1345 ,  H01L23/00 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L24/06 ,  H05K1/111 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/50

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US20240196584A1

公开(公告)日：2024-06-13

申请号：US18530278

申请日：2023-12-06

Applicant: Airbus SAS ,  Airbus Defence and Space GmbH

Inventor： Alois FRIEDBERGER ,  Patrice LEFEBURE ,  Caroline PETIOT

IPC: H05K13/04 ,  H05K1/02 ,  H05K13/08

CPC classification number: H05K13/0486 ,  H05K1/0292 ,  H05K13/083 ,  H05K2201/09418

Abstract: A part comprising a body and a film bonded to a surface of the body and incorporating an electronic circuit. This electronic circuit comprises at least one electronic component, conductive lines connected to the electronic component and at least two connection terminals positioned on at least one of the conductive lines, each connection terminal having a cross-section, in a plane parallel to the surface of the body, greater than twice the cross-section of a conductive line. By virtue of the connection terminals, which are distributed over the electronic circuit, it is possible to replace a faulty circuit segment with a repair circuit segment.

公开(公告)号：US11991825B2

公开(公告)日：2024-05-21

申请号：US16392112

申请日：2019-04-23

Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yuanda Lu ,  Junjie Ma ,  Shipeng Wang ,  Ming Zhai ,  Jian Sang ,  Haiwei Sun ,  Dongjia Hao

IPC: F21V8/00 ,  H01R12/65 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/118 ,  H01R12/65 ,  H05K1/028 ,  H05K1/111 ,  H05K2201/09372 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10378

Abstract: The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.

公开(公告)号：US11979987B2

公开(公告)日：2024-05-07

申请号：US18326426

申请日：2023-05-31

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung Bae ,  Wonkyu Kwak ,  Cheolgeun An

IPC: H05K1/18 ,  G02F1/1345 ,  H01L23/00 ,  H05K1/11 ,  H01L23/495 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L24/06 ,  H05K1/111 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/50

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US11910529B2

公开(公告)日：2024-02-20

申请号：US18088383

申请日：2022-12-23

Applicant: Samsung Display Co., LTD.

Inventor： Sehui Jang ,  Chongguk Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01L25/18 ,  G02F1/1345 ,  H10K59/131

CPC classification number: H05K1/118 ,  H05K1/0268 ,  H05K1/189 ,  G02F1/13452 ,  H01L25/18 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K59/131

Abstract: A display device is provided and includes a display panel including a display area that displays an image and a pad area disposed at least at a side of the display area, and a flexible circuit film electrically connected to the pad area. The flexible circuit film includes connection pads, a first measurement pad, and a second measurement pad. The connection pads are arrayed in a first direction and inclined with respect to a reference line extending in a second direction different from the first direction, the first measurement pad is disposed adjacent to a first side of the connection pads, and the second measurement pad is disposed adjacent to a second side of the connection pads. The connection pads are between the first measurement pad and the second measurement pad.

公开(公告)号：US20230422398A1

公开(公告)日：2023-12-28

申请号：US17818722

申请日：2022-08-10

Applicant: GLOBAL UNICHIP CORPORATION ,  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chih-Chieh LIAO ,  Yu-Min SUN ,  Chih-Feng CHENG

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K1/181 ,  H01L23/3128 ,  H05K3/0005 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09418 ,  H01L23/13

Abstract: An electric device includes a semiconductor assembly, a circuit board, first conductive pads and second conductive pads. The circuit board has a chip-mounted area with a rectangular shape. The first conductive pads are arranged in a center zone or all corner zones of the chip-mounted area, and the second conductive pads are arranged within the rest in the chip-mounted area. The first conductive pads are respectively soldered to one part of solder joints of the semiconductor assembly through first solder-ball portions, and the second conductive pads are respectively soldered to another part of the solder joints of the semiconductor assembly through second solder-ball portions. Each of the second conductive pads is sized smaller than one of the first conductive pads, and a maximum width of each of the second solder-ball portions is greater than a maximum width of each of the first solder-ball portions.

公开(公告)号：US20230209713A1

公开(公告)日：2023-06-29

申请号：US17672330

申请日：2022-02-15

Applicant: KINPO ELECTRONICS, INC.

Inventor： Chuan-Wang CHANG ,  Yu-Ta LIN ,  Chen-Jung CHEN

IPC: H05K1/11 ,  H01L23/49 ,  H01L23/00

CPC classification number: H05K1/119 ,  H01L23/49 ,  H01L24/49 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2224/49173 ,  H05K2201/09027 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/0939 ,  H05K2201/094

Abstract: A pad arranging method and a pad arrangement structure for a wire bonding of a chip is provided. The method includes following steps. A soldered component and a circuit board are provided. A plurality of pads is arranged on the circuit board. a number of the pads is corresponding to a number of a plurality pins of the soldered component. The pads are disposed in a plurality of rows toward or away from the soldered component according to a predetermined arranging position, and the number of the pads on one of the rows at outer side is equal to that on one of the rows at inner side, or greater than that on one of the rows at inner side by one or more than one

公开(公告)号：US20190254158A1

公开(公告)日：2019-08-15

申请号：US16276140

申请日：2019-02-14

Applicant: EMC IP Holding Company, LLC

Inventor： Mickey S. Felton ,  Bhyrav M. Mutnury ,  Vijendera Kumar

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/025 ,  H05K1/0243 ,  H05K1/111 ,  H05K2201/09418

Abstract: An electrical connector element, for use on a printed circuit board assembly, includes a soldering pad having a longitudinal length and a cross-sectional width. The soldering pad is configured to be electrically-coupleable to a PCB device conductor. At least one impedance inducing feature is positioned along the longitudinal length of the soldering pad.

公开(公告)号：US20190021167A1

公开(公告)日：2019-01-17

申请号：US16029936

申请日：2018-07-09

Applicant: FUJITSU LIMITED

Inventor： KEIICHI YAMAMOTO

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/34 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/02

CPC classification number: H05K1/111 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/81815 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/0271 ,  H05K1/119 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4007 ,  H05K2201/09136 ,  H05K2201/09418 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/10734

Abstract: A wiring board includes a substrate, an electrode on a surface of the substrate, a wall surface in a ring shape surrounding an outer circumference of the electrode, an upper end of the wall surface is located at a position higher than a surface of the electrode, and a protrusion at the upper end of the wall surface, the protrusion protruding with respect to the wall surface inward of a ring shape defined by the wall surface.