公开(公告)号：US08403684B2

公开(公告)日：2013-03-26

申请号：US13131047

申请日：2009-12-17

Applicant: Norikazu Tateishi ,  Masaru Kibi

Inventor： Norikazu Tateishi ,  Masaru Kibi

IPC: H01R12/00

CPC classification number: H01R13/03 ,  H01R12/58 ,  H01R13/2421 ,  H05K3/247 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.

Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。

公开(公告)号：US20110235348A1

公开(公告)日：2011-09-29

申请号：US13131047

申请日：2009-12-17

Applicant: Norikazu Tateishi ,  Masaru Kibi

Inventor： Norikazu Tateishi ,  Masaru Kibi

IPC: B60Q1/00 ,  H05K1/02

CPC classification number: H01R13/03 ,  H01R12/58 ,  H01R13/2421 ,  H05K3/247 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10295 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.

Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。

公开(公告)号：US2352454A

公开(公告)日：1944-06-27

申请号：US40926641

申请日：1941-09-02

Applicant: CHICAGO TELEPHONE SUPPLY CO

Inventor： SCHELLENGER NEWTON C ,  BUDD WILBERT H

IPC: H01C1/014 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01C1/014 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09418 ,  H05K2201/10196 ,  H05K2201/10787 ,  H05K2201/10825 ,  H05K2201/10878 ,  H05K2203/1446 ,  Y10T29/49922 ,  Y10T403/49

公开(公告)号：US07578675B2

公开(公告)日：2009-08-25

申请号：US12001575

申请日：2007-12-12

Applicant: Igor Polnyl ,  David Gregory Howell

Inventor： Igor Polnyl ,  David Gregory Howell

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10189 ,  H05K2201/10825 ,  Y02P70/613

Abstract: An electrical connector includes an insulative housing defining a number of passageways and a plurality of electrical contacts received in corresponding passageways of the insulative housing. Each contact is formed with a base portion, a solder portion bended from a bottom edge of the base portion, a spring portion and a connecting portion linking the base portion and the spring portion. The spring portion has a tip portion at a top end thereof, which is twisted and protrudes out of the insulative housing.

Abstract translation: 电连接器包括限定多个通道的绝缘壳体和容纳在绝缘壳体的相应通道中的多个电触头。 每个触点形成有基部，焊接部分从基部的底部边缘弯曲，弹簧部分和连接基部和弹簧部分的连接部分。 弹簧部分在其顶端具有尖端部分，其被扭曲并从绝缘壳体突出。

公开(公告)号：US20090156021A1

公开(公告)日：2009-06-18

申请号：US12001575

申请日：2007-12-12

Applicant: Igor Polnyi ,  David Gregory Howell

Inventor： Igor Polnyi ,  David Gregory Howell

IPC: H01R12/14 ,  H01R13/62

CPC classification number: H01R12/52 ,  H01R12/57 ,  H01R12/7076 ,  H01R12/714 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10189 ,  H05K2201/10825 ,  Y02P70/613

Abstract: An electrical connector includes an insulative housing defining a number of passageways and a plurality of electrical contacts received in corresponding passageways of the insulative housing. Each contact is formed with a base portion, a solder portion bended from a bottom edge of the base portion, a spring portion and a connecting portion linking the base portion and the spring portion. The spring portion has a tip portion at a top end thereof, which is twisted and protrudes out of the insulative housing.

公开(公告)号：US07196402B2

公开(公告)日：2007-03-27

申请号：US10937647

申请日：2004-09-08

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495

CPC classification number: H01L24/12 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10825 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。

公开(公告)号：US5112232A

公开(公告)日：1992-05-12

申请号：US657653

申请日：1991-02-15

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01R12/58 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection aperture located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical interconnection of, and mechanical coupling between the printed circuit boards.This application is a division of co pending patent application Her. No. 07/347,507, filed May 4, 1989, now U.S. Pat. No. 5,014,419, issued May 14, 1991, U.S. Pat. application Ser. No. 07/347,507 was a continuation-in-part of application Ser. No. 07/053,142, filed May 21, 1989, now U.S. Pat. No. 5,054,192, issued Oct. 8, 1991. All of these applications and patents are assigned to the same assignee.

Abstract translation: 一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。 引脚穿过电路板堆叠以将网格定位成与位于印刷电路板中的互连孔接触。 保持架在孔中的摩擦接合提供印刷电路板之间的电互连和机械耦合。 这个应用是她的共同未决专利申请的一个部门。 1989年5月4日提交的现在的美国专利No.07 / 347,507。 1991年5月14日授权的美国专利5,014,419。 应用程序 第07 / 347,507号是应用程序Ser的部分延续。 1989年5月21日提交的现在的美国专利No.07 / 053,142。 1991年10月8日授权的第5,054,192号。所有这些申请和专利都转让给同一受让人。

公开(公告)号：US5014419A

公开(公告)日：1991-05-14

申请号：US347507

申请日：1989-05-04

Applicant: Seymour R. Cray ,  Nicholas J. Krajewski

Inventor： Seymour R. Cray ,  Nicholas J. Krajewski

IPC: H01L21/48 ,  H01L21/607 ,  H01R11/01 ,  H01R12/52 ,  H01R43/16 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49153

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.

Abstract translation: 一种用于通过使用由多丝线形成并且具有沿着销形成的扩大的鸟笼的双绞线跳线来互连电子电路板的方法和装置。 引脚穿过电路板堆叠，以将网格定位成与位于印刷电路板中的互连孔接触。 保持架在孔中的摩擦接合提供印刷电路板之间的电连接和机械耦合。

公开(公告)号：US08259460B2

公开(公告)日：2012-09-04

申请号：US12303572

申请日：2007-06-05

Applicant: Rabin Bhattacharya ,  Pieter Jacob Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger ,  Martijn Krans ,  Sima Asvadi ,  Alexander Ulrich Douglas ,  Jacqueline Van Driel ,  Martinus Jacobus Johannes Hack

Inventor： Rabin Bhattacharya ,  Pieter Jacob Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger ,  Martijn Krans ,  Sima Asvadi ,  Alexander Ulrich Douglas ,  Jacqueline Van Driel ,  Martinus Jacobus Johannes Hack

IPC: H05K7/02 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

公开(公告)号：US20120012365A1

公开(公告)日：2012-01-19

申请号：US13107911

申请日：2011-05-14

Applicant: GABE CHERIAN ,  Don Ellison Saunders

Inventor： GABE CHERIAN ,  Don Ellison Saunders

IPC: H05K1/00

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling and thermal fluctuations. The invention more specifically shows certain improvements related to its mother patent application, called Thermal Flex Contact Carrier (TFCC), where the improvements allow the height of the contact elements to be now not restricted anymore by the size of the spaces or distances between the contact pads of the devices to be attached together. Certain improvements to the carrier wafer are also shown.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环和热波动的不期望的影响的手段和方法。 本发明更具体地示出了与其母版专利申请（称为热弹性接触载体（TFCC））相关的某些改进，其中改进使得接触元件的高度现在不再受限于接触的空间或距离之间的距离 要连接在一起的设备的垫。 还示出了对载体晶片的某些改进。