公开(公告)号：US20050048770A1

公开(公告)日：2005-03-03

申请号：US10914227

申请日：2004-08-10

Applicant: Naohiro Mashino

Inventor： Naohiro Mashino

IPC: H05K3/40 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/42 ,  H05K3/46 ,  H01L21/44 ,  H01L23/053 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate with a through-hole penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots, around a metal-less portion of the plated metal, such as a dimple or seam, at positions corresponding to the openings of the through-hole, so that the a part of the plated metal melts to fill the metal-less portion with the molten metal.

Abstract translation: 一种制造布线板的方法，包括由绝缘材料制成并具有第一和第二表面的基底，分别形成在第一和第二表面上的第一和第二导体图案，以及穿过基板的通孔导体，以将第一导体 图案与第二导体图案; 该方法包括以下步骤：用穿透其的通孔形成基底并分别在第一和第二表面处限定开口; 用金属电镀基板，使得在基板的相应的第一和第二表面上形成具有预定厚度的金属层，并且通孔基本上填充有作为通路导体的金属; 在对应于通孔的开口的位置处，将激光束作为多个点照射在电镀金属的无金属部分（例如凹坑或接缝）周围，使得电镀金属的一部分 熔化以用熔融金属填充无金属部分。

公开(公告)号：US20050047020A1

公开(公告)日：2005-03-03

申请号：US10964188

申请日：2004-10-13

Applicant: Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

Inventor： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34 ,  G11B21/22 ,  G11B5/54 ,  H05K1/11

CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

公开(公告)号：US06843660B2

公开(公告)日：2005-01-18

申请号：US10719937

申请日：2003-11-21

Applicant: Andrew Harvey Barr ,  Jeremy Ian Wilson ,  Irving McKenzie Birmingham

Inventor： Andrew Harvey Barr ,  Jeremy Ian Wilson ,  Irving McKenzie Birmingham

IPC: H01B7/00 ,  H01B7/08 ,  H05K1/00 ,  H05K1/02 ,  H01R12/00

CPC classification number: H05K1/028 ,  H01B7/0009 ,  H01B7/0823 ,  H05K1/0224 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09745

Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

Abstract translation: 电缆系统的实施例包括具有导体，功率层和电介质材料的电缆。 导体可操作地承载信号，电介质材料至少部分地位于导体和功率层之间，功率层作为地面运行。 功率层由导电材料形成并且包括第一区域和相邻的第二区域。 第一区域包括比第二区域更大量的导电材料，使得功率层比沿着第一区域沿着第二区域的弯曲较小。 还提供了方法和其他系统。

公开(公告)号：US20040238940A1

公开(公告)日：2004-12-02

申请号：US10855344

申请日：2004-05-28

Inventor： Hiromichi Ebine ,  Katsuhiko Kikuchi ,  Satoshi Shimada ,  Masahide Hayashi

IPC: H01L023/48

CPC classification number: H05K3/3442 ,  H01L2924/0002 ,  H05K3/202 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.

Abstract translation: 电子设备需要为了静电屏蔽而安装电子部件。 这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。 在各引线的电子部件安装部中，以组合的方式形成定位凹部，接合物质厚度确保凹部，接合物质厚度确保凹部等，由此在接合物质中产生的裂纹的扩散可以 可以提高抑制和可靠性。 填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散，并确保接合物质的可靠性更好。

公开(公告)号：US20040227230A1

公开(公告)日：2004-11-18

申请号：US10436254

申请日：2003-05-13

Inventor： Ming-Ching Chou

IPC: H01L023/34

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/0058 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A heat spreader has an improved geometry which reduces the mechanical stress due to the thermal expansion to enhance the heat transfer performance, and increases the surface area to reduce the thermal resistance between device and surrounding without external cooling assemblies. The heat spreader is able to improve the electrical performance of power modules due to the improved thermal performance.

Abstract translation: 散热器具有改进的几何形状，其减小由于热膨胀引起的机械应力以增强传热性能，并且增加表面积以降低器件与周围之间的热阻而无需外部冷却组件。 由于热性能的改善，散热器能够提高功率模块的电气性能。

公开(公告)号：US06787700B2

公开(公告)日：2004-09-07

申请号：US10270490

申请日：2002-10-16

Applicant: Masashi Nagao ,  Hisafumi Maruo ,  Norihito Suzuki

Inventor： Masashi Nagao ,  Hisafumi Maruo ,  Norihito Suzuki

IPC: H01L2352

CPC classification number: H01R43/0235 ,  H01L2224/26175 ,  H01R4/028 ,  H01R13/6608 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/202 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A chip part (6) is mounted on bus bars (2, 3), and connection portions (6t) of the chip part (6) are soldered to the bus bars (2, 3), respectively. At this time, recesses (10, 11) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.

Abstract translation: 芯片部分（6）安装在母线（2,3）上，并且芯片部分（6）的连接部分（6t）分别焊接到汇流条（2,3）。 此时，预先分别在两个间隔开的汇流条的焊接区中分别形成凹槽（10,11），每个母线对应于预定的焊料润湿区域。 芯片部分以这样的方式焊接到母线上，使得连接部分分别与这些凹部的内边缘间隔开，从而在每个凹部的至少一部分和相应的连接部分之间形成焊接圆角 芯片部分。

公开(公告)号：US20040170019A1

公开(公告)日：2004-09-02

申请号：US10789089

申请日：2004-02-27

Inventor： Masayuki Tamai

IPC: F21V007/00

CPC classification number: H04N1/02815 ,  F21K9/00 ,  F21V23/003 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/3011 ,  H04N1/02865 ,  H04N2201/0404 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode (LED) light source unit includes a printed circuit board mounting LED elements thereon. The LED elements are arranged in the form of an array and mounted on a bottom face of a straight groove defined in the printed circuit board by a groove forming technique. A lateral face of the groove acts as a reflecting face for reflecting beam from the LED elements toward an object to be illuminated.

Abstract translation: 发光二极管（LED）光源单元包括在其上安装LED元件的印刷电路板。 LED元件以阵列的形式布置，并通过沟槽形成技术安装在印刷电路板中限定的直槽的底面上。 凹槽的侧面用作反射面，用于将来自LED元件的光束反射向被照射物体。

公开(公告)号：US06775141B2

公开(公告)日：2004-08-10

申请号：US10368399

申请日：2003-02-20

Applicant: Ryuji Yoshida ,  Masato Watanabe

Inventor： Ryuji Yoshida ,  Masato Watanabe

IPC: H05K0720

CPC classification number: H05K1/021 ,  H01L23/42 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0209 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1056 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: To provide a heat dissipation structure for an electronic circuit board, a recessed portion is formed in a surface of a heat dissipation board to extend to at least one side surface thereof. A gel-like resin having a high thermal conductivity is coated over the recessed portion. The electronic circuit board is brought into facial contact with the heat dissipation board with the electrical insulation sheet interposed therebetween so that at least one electronic component is buried in the gel-like resin. The gel-like resin coated in the recessed portion is such an amount that a gap between the electronic component and side surfaces and bottom surface of the recessed portion is filled with the gel-like resin and an excess amount of the gel-like resin is expelled out of the side surface of the heat dissipation board The gel-like resin protruded from the side surfaces of the heat dissipation board is removed.

Abstract translation: 为了提供一种用于电子电路板的散热结构，在散热板的表面上形成一个凹进部分，以延伸至至少一个侧表面。 具有高导热性的凝胶状树脂涂覆在凹部上。 将电子电路板与散热板进行面接触，其间插入有电绝缘片，使得至少一个电子部件埋设在凝胶状树脂中。 涂布在凹部中的凝胶状树脂的量使得电子部件与侧面之间的间隙和凹部的底面的间隙被凝胶状树脂填充，过量的凝胶状树脂为 从散热板的侧面排出从散热板的侧面突出的凝胶状树脂被除去。

公开(公告)号：US20040094324A1

公开(公告)日：2004-05-20

申请号：US10298876

申请日：2002-11-18

Inventor： Andrew Harvey Barr ,  Jeremy Ian Wilson ,  Irving McKenzie Birmingham

IPC: H01B007/08

CPC classification number: H05K1/028 ,  H01B7/0009 ,  H01B7/0823 ,  H05K1/0224 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09745

Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.

Abstract translation: 电缆系统的实施例包括具有导体，功率层和电介质材料的电缆。 导体可操作地承载信号，电介质材料至少部分地位于导体和功率层之间，功率层作为地面运行。 功率层由导电材料形成并且包括第一区域和相邻的第二区域。 第一区域包括比第二区域更大量的导电材料，使得功率层比沿着第一区域沿着第二区域的弯曲较小。 还提供了方法和其他系统。

公开(公告)号：US20040069839A1

公开(公告)日：2004-04-15

申请号：US10630051

申请日：2003-07-30

Inventor： Warren M. Farnworth

IPC: B23K031/00

CPC classification number: H05K3/3484 ,  B22F9/08 ,  B22F2009/0808 ,  B23K35/0244 ,  H05K3/1216 ,  H05K3/3478 ,  H05K2201/09745 ,  H05K2201/2081 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557

Abstract: Methods and apparatus for forming a plurality of uniformly sized solder balls utilize a stencil having a plurality of holes of uniform volume disposed on a substrate. Solder is disposed in the holes of the stencil on the substrate. Typically, the solder is in the form of solder paste which is distributed into the holes using a squeegee. While within the holes of the stencil on the substrate, the solder is melted to form solder balls. The stencil may then be removed to leave the solder balls on the substrate, or the solder balls may be removed while the stencil remains on the substrate.

Abstract translation: 用于形成多个均匀尺寸的焊球的方法和设备利用具有设置在基板上的具有均匀体积的多个孔的模版。 焊料设置在基板上的模板的孔中。 通常，焊料是焊膏的形式，其使用刮刀分配到孔中。 在衬底上的模板的孔内，焊料熔化形成焊球。 然后可以去除模板以将焊球留在衬底上，或者当模板保留在衬底上时可以去除焊球。