公开(公告)号：US20060111065A1

公开(公告)日：2006-05-25

申请号：US11052785

申请日：2005-02-09

Applicant: Yasuhide Kuroda

Inventor： Yasuhide Kuroda

IPC: H04B1/46

CPC classification number: H01G4/38 ,  H01L27/016 ,  H05K1/0231 ,  H05K1/0237 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/0195 ,  H05K2203/041 ,  Y02P70/611

Abstract: In an electronic circuit capable of eliminating a direct current component while suppressing deterioration of frequency characteristics in a wide frequency band, the electronic circuit includes a first capacitor, which eliminates, when the wide frequency band is divided into a low frequency band and a high frequency band, the direct current component of the low frequency band, and a plurality of second capacitors each disposed to each fine band when the high frequency band is further divided into fine bands to eliminate the direct current components of the fine bands, wherein the first capacitor and the second capacitor are connected in parallel with each other. There is also provided a method of manufacturing the electronic circuit.

Abstract translation: 在能够消除直流成分同时抑制宽频带中的频率特性劣化的电子电路中，电子电路包括第一电容器，其将宽频带分为低频带和高频 频带，低频带的直流分量，以及多个第二电容器，每个第二电容器，当高频带进一步被划分为细小频带，以消除精细频带的直流分量时，每个精细频带都设置在其中，其中第一电容器 并且第二电容器彼此并联连接。 还提供了一种制造电子电路的方法。

公开(公告)号：US20060048968A1

公开(公告)日：2006-03-09

申请号：US10933860

申请日：2004-09-03

Applicant: Wei-Kuang Chen

Inventor： Wei-Kuang Chen

IPC: H05K1/09

CPC classification number: H05K1/0263 ,  H02M7/003 ,  H05K3/3447 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A construction for DC to AC power inverter includes a circuit board and at least a conductive member. The soldered surface of the circuit board where larger amount of current passes through is inserted with the conductive member. The conductive member provides a contour can be changed in accordance with the shape of the circuit board and the periphery thereof is joined with several inserting pins so that the conductive member can be inversely hooked to the circuit board. Further, the conductive member can adhesively attached to the circuit board tightly by way of operation of tin soldering with the tin furnace. Hence, the conductive member can facially contact with the circuit board to enhance capability of the copper foil on the circuit board to endure the current with lower fabricating cost and promoted utilization efficiency. Besides, obstruction of other electronic parts can be avoided so as to facilitate fabrication process and strengthen market competitive power.

Abstract translation: 直流到交流电力逆变器的结构包括电路板和至少导电构件。 导电部件插入电路板的焊接表面，其中较大电流通过。 导电构件提供的轮廓可以根据电路板的形状而改变，并且其周边与几个插入接头连接，使得导电构件可以与电路板成反比。 此外，导电构件可以通过锡焊与锡炉的操作而紧密地粘附到电路板上。 因此，导电构件可以与电路板面接触，以提高电路板上铜箔的能力，以较低的制造成本来承受电流并提高利用效率。 此外，可以避免其他电子部件的阻塞，从而促进制造工艺，增强市场竞争力。

公开(公告)号：US20050257956A1

公开(公告)日：2005-11-24

申请号：US10848703

申请日：2004-05-19

Applicant: Joseph Marshall ,  Douglas Weems ,  Richard Bussom ,  David Anderson

Inventor： Joseph Marshall ,  Douglas Weems ,  Richard Bussom ,  David Anderson

IPC: B29C35/02 ,  B29C70/68 ,  B29C70/86 ,  B29C70/88 ,  B64C27/473 ,  H01B7/00 ,  H05K1/03 ,  H05K1/16

CPC classification number: H05K3/103 ,  B29C35/0272 ,  B29C70/86 ,  B29C70/885 ,  B64C27/473 ,  B64C2027/7283 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/10151 ,  H05K2201/1028 ,  Y02T50/34 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T428/24942

Abstract: A composite structural member with an integrated electrical circuit and an associated method of manufacture are provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract translation: 提供具有集成电路和相关联的制造方法的复合结构件。 结构构件包括多层结构增强材料，并且两个或更多个电气装置至少部分地设置在层之间，其中结构增强材料的中间层设置在电气装置之间。 至少一个电气总线设置在结构构件中，并且每个电气装置通过导电电极连接到总线。 因此，电极可以延伸穿过结构增强材料的中间层，以将每个电气设备连接到一个或多个总线。

公开(公告)号：US20050116013A1

公开(公告)日：2005-06-02

申请号：US10722432

申请日：2003-11-28

Applicant: Young Kwark ,  Christian Schuster

Inventor： Young Kwark ,  Christian Schuster

IPC: H01L23/66 ,  H05K1/02 ,  B23K31/02

CPC classification number: H01L24/46 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/43 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49174 ,  H01L2224/8502 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1903 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0219 ,  H05K1/0243 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/1028 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract translation: 制造电子互连的方法（和结构）包括用于要互连的信号线，使用被配置为提供受控阻抗效应的多个接合线。

公开(公告)号：US20030233134A1

公开(公告)日：2003-12-18

申请号：US10236396

申请日：2002-09-06

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N001/375

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 电气密封的电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US06641407B2

公开(公告)日：2003-11-04

申请号：US09955302

申请日：2001-09-19

Applicant: Yoshinori Murakami

Inventor： Yoshinori Murakami

IPC: H01R1200

CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.

Abstract translation: 互连结构具有多个平面互连（1,2），它们之间以规定距离相互重叠并且用作两个电路板（A，B）之间的互连，每个平面互连（1,2）具有至少两个连接 电路板（1,2）上的端子（1A，1B，2A，2B）。 不像以前那样使用刚性的电线互连来做互连，而是使用具有相对大的表面积的平面互连来增加线对线电容，从而增强降低高频噪声的滤波功能。

公开(公告)号：US06632734B2

公开(公告)日：2003-10-14

申请号：US10371256

申请日：2003-02-21

Applicant: Robert L. Sankman

Inventor： Robert L. Sankman

IPC: H01L214763

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2203/0235 ,  H01L2224/05599

Abstract: A microelectronic substrate having a plurality of alternating substantially planar layers of dielectric material and conductive material, and further having a first surface and a second surface, wherein the dielectric material and the conductive material layers extend substantially perpendicularly between the first and second surfaces.

Abstract translation: 一种微电子衬底，具有多个交替的基本平坦的电介质材料和导电材料层，并且还具有第一表面和第二表面，其中介电材料和导电材料层在第一表面和第二表面之间基本垂直地延伸。 PTEXT>

公开(公告)号：US06531662B1

公开(公告)日：2003-03-11

申请号：US09959362

申请日：2001-10-19

Applicant: Satoshi Nakamura

Inventor： Satoshi Nakamura

IPC: H05K102

CPC classification number: H01M10/4257 ,  H01R12/52 ,  H05K1/148 ,  H05K3/202 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/09727 ,  H05K2201/1028

Abstract: A circuit substrate (10) comprises a first substrate split (11) formed with a predetermined wiring pattern (16) and a second substrate split (12) formed with a predetermined wiring pattern (17). The substrate splits are electrically and/or mechanically joined together, and the circuit substrate is bent at the joint. The joint is provided by a bendable joint member (13) including a plurality of leads (14) disposed in parallel and held by a thin piece of base film (20) integrally therewith. The joint member is attached to interconnect the first and the second substrate splits (11, 12).

Abstract translation: 电路基板（10）包括形成有预定布线图案（16）的第一基板分割（11）和形成有预定布线图案（17）的第二基板分割（12）。 电路和/或机械地接合在一起，并且电路基板在接头处弯曲。 接头由可弯曲的接头构件（13）提供，该可弯曲接头构件（13）包括平行布置并与其一体的薄膜（20）一体地保持的多个引线（14）。 连接构件被连接以互连第一和第二衬底分割件（11,12）。

公开(公告)号：US20020056571A1

公开(公告)日：2002-05-16

申请号：US10043002

申请日：2002-01-09

Inventor： Antonio Canova

IPC: H05K001/00 ,  H05K001/16

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.

Abstract translation: 描述了一种用于生产印刷电路的方法，该印刷电路包括层状载体，层状载体上的导电轨道和焊接到导电轨道的辅助导电元件。 通过用于施加SMD部件的装置来施加辅助导电元件。

公开(公告)号：US20020037656A1

公开(公告)日：2002-03-28

申请号：US09955302

申请日：2001-09-19

Inventor： Yoshinori Murakami

IPC: H05K001/00

CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.

Abstract translation: 互连结构具有多个平面互连（1,2），它们之间以规定距离相互重叠并且用作两个电路板（A，B）之间的互连，每个平面互连（1,2）具有至少两个连接 电路板（1,2）上的端子（1A，1B，2A，2B）。 不像以前那样使用刚性的电线互连来做互连，而是使用具有相对大的表面积的平面互连来增加线对线电容，从而增强降低高频噪声的滤波功能。