公开(公告)号：US10932727B2

公开(公告)日：2021-03-02

申请号：US15404117

申请日：2017-01-11

Applicant: Sanmina Corporation

Inventor： Robert Steven Newberry

IPC: A61B5/1455 ,  A61B5/00 ,  A61B5/01 ,  A61B5/145 ,  A61B5/0205 ,  A61B5/11 ,  A61B5/024 ,  A61M5/172 ,  A61M5/142 ,  G16H40/63 ,  G16H40/67

Abstract: User equipment is configured to collect biosensor data from an integrated biosensor or by receiving biosensor data from one or more external biosensors. The user equipment includes a Health Monitoring (HM) application. The HM application is configured to receive the biosensor data and display the biosensor data on the display of the user equipment. The user equipment may also communicate biosensor data over a local or wide area network to a third party, such as a pharmacy or health care provider.

公开(公告)号：US10926875B2

公开(公告)日：2021-02-23

申请号：US15841223

申请日：2017-12-13

Applicant: Sanmina Corporation

Inventor： Max Edward Klein

IPC: B64C39/02 ,  F41B11/80 ,  F41H11/02 ,  F41H13/00 ,  G05D1/00 ,  F41H11/04 ,  G05D1/12 ,  B64D1/02 ,  B64D3/00

Abstract: Unmanned aerial vehicle (UAV) capture devices and methods of operation are disclosed. A UAV capture device may include a netting system including a net launch device and a net, a propulsion system including a plurality of propellers coupled to one or more motors, a positioning system, a camera system, and a processing system coupled to the netting system, the propulsion system, the positioning system, and the camera system. The processing system may include logic to operate the propulsion system to autonomously navigate to a general location of a target UAV, to operate the propulsion system to pursue the target UAV, to deploy the netting system to propel the net at the target UAV, and to confirm if the target UAV is captured in the net. Other aspects, embodiments, and features are also included.

公开(公告)号：US10888280B2

公开(公告)日：2021-01-12

申请号：US15898580

申请日：2018-02-17

Applicant: Sanmina Corporation

Inventor： Robert Steven Newberry

IPC: A61B5/00 ,  A61B5/024 ,  A61B5/1455 ,  A61B5/145 ,  A61B5/08

Abstract: A photoplethysmography (PPG) circuit or non-contact camera obtains PPG signals at a plurality of wavelengths. A signal processing module obtains at least a first spectral response around a first wavelength and a second spectral response around a second wavelength. The signal processing device generates PPG input data using the PPG signals, wherein the PPG input data includes one or more parameters obtained from each of the first spectral response and the second spectral response. A neural network processing device generates an input vector including the PPG input data and determines an output vector including health data, wherein the health data includes for example, an oxygen saturation level, a glucose level or a blood alcohol level.

公开(公告)号：US20200345312A1

公开(公告)日：2020-11-05

申请号：US16930133

申请日：2020-07-15

Applicant: Sanmina Corporation

Inventor： Robert Steven Newberry

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/01 ,  G16H40/63 ,  A61B5/1455 ,  A61B5/024

Abstract: An optical circuit detects optical signals reflected from skin tissue at one or more different wavelengths. A processing circuit integrated with the optical circuit or in communication with the optical circuit identifies an insulin release event using at least one optical signal at a first wavelength. A frequency of insulin release events is determined and in response to the frequency of the insulin release events, vascular imaging or a vascular test is delayed or performed.

公开(公告)号：US10820427B2

公开(公告)日：2020-10-27

申请号：US16518967

申请日：2019-07-22

Applicant: SANMINA CORPORATION

Inventor： Shinichi Iketani ,  Drew Doblar

IPC: H05K3/42 ,  H05K1/11 ,  H05K1/02

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

公开(公告)号：US10744262B2

公开(公告)日：2020-08-18

申请号：US16183354

申请日：2018-11-07

Applicant: Sanmina Corporation

Inventor： Robert Steven Newberry ,  Matthew Rodencal

IPC: A61M5/172 ,  A61M5/142 ,  A61M5/32 ,  A61M5/145

Abstract: A biosensor is implemented in an earpiece and includes an activity monitoring circuit that detects an activity level of a user and an optical circuit that detects a plurality of spectral responses at a plurality of wavelengths from light reflected from skin of the user. The biosensor determines a heart rate and an oxygen saturation level using the plurality of spectral responses and determines whether the heart rate or the oxygen saturation level reaches a predetermined threshold for the activity level of the user. The biosensor generates an alert and transmits the alert wirelessly to a remote device.

公开(公告)号：US20200043690A1

公开(公告)日：2020-02-06

申请号：US16601068

申请日：2019-10-14

Applicant: SANMINA CORPORATION

Inventor： Shinichi Iketani ,  Douglas Ward Thomas

IPC: H01H85/12 ,  H05K3/46 ,  H05K3/40 ,  H05K3/10 ,  H05K3/00 ,  H05K1/14 ,  H05K1/11 ,  H01H85/56 ,  H01H85/30 ,  H01H85/20 ,  H01H85/055 ,  H01H85/143 ,  H01H85/00

Abstract: A method of making printed circuit board vias using a double drilling and plating method is disclosed. A first hole is drilled in a core, the first hole having a first diameter. The first hole is filled and/or plated with an electrically conductive material. A circuit pattern may be formed on one or two conductive layers of the core. A multilayer structure may then be formed including a plurality of cores that also include pre-drilled and plated via holes, wherein at least some of the pre-drilled and plated via holes are aligned with the first hole. A second hole is then drilled within the first hole and the aligned pre-drilled and plated holes, the second hole having a second diameter where the second diameter is smaller than the first diameter. A conductive material is then plated to an inner surface of the second hole.

公开(公告)号：US20200015364A1

公开(公告)日：2020-01-09

申请号：US16518967

申请日：2019-07-22

Applicant: SANMINA CORPORATION

Inventor： Shinichi Iketani ,  Drew Doblar

IPC: H05K3/42 ,  H05K1/11

Abstract: A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

公开(公告)号：US20190246514A1

公开(公告)日：2019-08-08

申请号：US16265656

申请日：2019-02-01

Applicant: Sanmina Corporation

Inventor： Charles C. Hill ,  Franz Michael Schuette

IPC: H05K7/14 ,  G11B33/04

CPC classification number: H05K7/1489 ,  G11B33/0433

Abstract: One feature pertains to a scissor-based carrier assembly for a mass storage device used in a storage computer system. The carrier assembly has fixed and moving parts allowing the carrier to change from a retracted state to insert or remove the mass storage device into or from a storage enclosure to an extended state to couple the mass storage device with a connector of the storage computer system.

公开(公告)号：US20190208645A1

公开(公告)日：2019-07-04

申请号：US16298896

申请日：2019-03-11

Applicant: Sanmina Corporation

Inventor： Shinichi Iketani ,  Dale Kersten

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/116 ,  H05K3/0094 ,  Y10T29/49165

Abstract: Laminate structures including hole plugs, and methods for forming a hole plug in a laminate structure are provided. A laminate structure may be formed with at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. A blind hole may be formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the blind hole including a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). Via fill ink may be disposed in the blind hole, and the via fill ink may be dried and/or cured to form a hole plug.