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    Microneedle array device and its fabrication method
    115.
    发明授权
    Microneedle array device and its fabrication method 有权
    微针阵列器件及其制造方法

    公开(公告)号：US07712198B2

    公开(公告)日：2010-05-11

    申请号：US11754368

    申请日：2007-05-29

    Applicant: Shih-Chi Kuo ,  Yu-Kon Chou

    Inventor： Shih-Chi Kuo ,  Yu-Kon Chou

    IPC: B23B37/00

    CPC classification number: B81C1/00111 ,  A61B17/205 ,  A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  Y10T29/302 ,  Y10T29/304 ,  Y10T29/308 ,  Y10T29/49982

    Abstract: A microneedle array device and its fabrication method are provided. The microneedle array device comprises a supporting pad and a plurality of microneedles. Each microneedle has a top portion with a via thereon, thereby the microfluid may flow in or out. The intersection between the top portion and the inner tube of a microneedle forms a convex needle structure, and is almost perpendicular to the upper surface. For each microneedle, a hollow closed tube is formed between the top portion and the supporting pad. The fabrication method uses substrates with high transmittance and a plurality of convex area thereon as upper and lower caps, and applies a photolithography process to fabricate a microneedle array mold. It then sputters or electroplates metal material on the mold. The microneedle array is formed after having taken off the mold.

    Abstract translation: 提供了一种微针阵列器件及其制造方法。 微针阵列装置包括支撑垫和多个微针。 每个微针具有顶部，其上具有通孔，从而微流体可以流入或流出。 微针的顶部和内管之间的交点形成凸针结构，并且几乎垂直于上表面。 对于每个微针，在顶部和支撑垫之间形成中空封闭的管。 该制造方法使用具有高透射率的衬底和其上的多个凸起区域作为上盖和下盖，并且应用光刻工艺来制造微针阵列模具。 然后将模具上的金属材料溅射或电镀。 在脱模后形成微针阵列。

    FABRICATION METHOD FOR HOLLOW MICRONEEDLES FOR DRUG DELIVERY
    116.
    发明申请
    FABRICATION METHOD FOR HOLLOW MICRONEEDLES FOR DRUG DELIVERY 有权
    用于药物输送的中空麦芽糖的制造方法

    公开(公告)号：US20100062142A1

    公开(公告)日：2010-03-11

    申请号：US12348589

    申请日：2009-01-05

    Applicant: Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

    Inventor： Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

    IPC: B05D3/00

    CPC classification number: B81C1/00476 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81B2203/0338 ,  B81B2203/0361 ,  B81C2201/0108

    Abstract: A novel method suitable for commercially mass production of hollow microneedle with high quality for delivery of drugs across or into biological tissue is provided. It typically includes the following processes: (1) coating an elongated template of a first material with a second material to form a cover; (2) removing tips of the template and cover to form an opening in the cover; and (3) removing the template of the first material to obtain hollow microneedles of the second material. This simple, efficient and cost-effective fabrication method can mass produce hollow microneedle arrays involving no complicated and expensive equipments or techniques, which can be used in commercial fabrication of hollow needles for delivering drugs or genes across or into skin or other tissue barriers with advantages of minimal damage, painless, long-term and continuous usages.

    Abstract translation: 提供了一种适用于商业上大规模生产用于将药物跨越或进入生物组织的高品质的中空微针的新方法。 它通常包括以下过程：（1）用第二材料涂覆第一材料的细长模板以形成盖子; （2）去除模板和盖子的尖端以在盖子上形成开口; 和（3）去除第一材料的模板以获得第二材料的中空微针。 这种简单，高效和成本有效的制造方法可以大规模生产中空微针阵列，其不涉及复杂而昂贵的设备或技术，其可用于商业制造用于将药物或基因跨越或进入皮肤或其它组织屏障的中空针 最小的伤害，无痛，长期和持续的使用。

    Methods for Wafer Scale Processing of Needle Array Devices
    117.
    发明申请
    Methods for Wafer Scale Processing of Needle Array Devices 审中-公开
    针阵器件晶圆尺寸加工方法

    公开(公告)号：US20090301994A1

    公开(公告)日：2009-12-10

    申请号：US12464691

    申请日：2009-05-12

    Applicant: Rajmohan Bhandari ,  Sandeep Negi ,  Florian Solzbacher

    Inventor： Rajmohan Bhandari ,  Sandeep Negi ,  Florian Solzbacher

    IPC: C23F1/02

    CPC classification number: B81C1/00111 ,  A61B5/04001 ,  A61B5/685 ,  A61B2562/125 ,  A61M2037/0053 ,  A61N1/0531 ,  A61N1/0543 ,  B81B2201/055 ,  B81B2207/056

    Abstract: Methods of fabricating needle arrays on a wafer scale include etching a wafer of columns and needles and coating the same with an electrically insulating material and exposing electrically conductive tips. This process can benefit from using a slow spin speed to distribute resist material across the wafer before etching and using a carrier wafer to support singulated arrays to allow full coverage of upper array surfaces with electrically insulating materials. These processes allow for efficient high volume production of high count microelectrode arrays with a high repeatability and accuracy.

    Abstract translation: 在晶片尺寸上制造针阵列的方法包括蚀刻柱和针的晶片，并用电绝缘材料涂覆其并暴露导电尖端。 该方法可以受益于在蚀刻之前使用缓慢旋转速度来分布抗蚀剂材料，并且使用载体晶片来支持单个阵列以允许用电绝缘材料完全覆盖上部阵列表面。 这些方法允许以高重复性和精度有效地大量生产高计数微电极阵列。

    Microneedle Arrays and Methods of Preparing Same
    118.
    发明申请
    Microneedle Arrays and Methods of Preparing Same 审中-公开
    微针阵列及其制备方法

    公开(公告)号：US20080262416A1

    公开(公告)日：2008-10-23

    申请号：US12089551

    申请日：2006-11-17

    Applicant: Daniel C. Duan ,  Peter R. Johnson

    Inventor： Daniel C. Duan ,  Peter R. Johnson

    IPC: A61M31/00 ,  A61M37/00 ,  B05D5/00

    CPC classification number: B81C1/0038 ,  A61K9/0021 ,  A61K47/26 ,  A61K47/32 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/0053 ,  A61M2037/0061 ,  B81B2201/055

    Abstract: A microneedle array having a substrate and a plurality of microneedles extending out from the substrate with a multi-phase matrix coating on at least a portion of the microneedle surface of the microneedle array. The multi-phase matrix coating comprises an active substance and has a first solid phase and a liquid phase. The first solid phase comprises a water-soluble polymer. Also, a method of providing an active substance- containing matrix coating on a microneedle array in which a water-soluble polymer is applied to the microneedle surface of the array to form a dried coating of water-soluble polymer. A coating solution comprising an active substance, a liquid capable of phase separating from the water-soluble polymer, and a carrier fluid is prepared and applied to the dried coating of water-soluble polymer. At least a portion of the carrier fluid is removed from the array.

    Abstract translation: 一种微针阵列，其具有基底和多个微针，所述微针在所述微针阵列的所述微针表面的至少一部分上以多相基质涂层从所述基底延伸出来。 多相基质涂层包含活性物质并具有第一固相和液相。 第一固相包含水溶性聚合物。 另外，一种在微针阵列上提供含活性物质的基质涂层的方法，其中将水溶性聚合物施加到阵列的微针表面以形成水溶性聚合物的干燥涂层。 制备包含活性物质，能够与水溶性聚合物相分离的液体和载体流体的涂布溶液，并将其涂覆到水溶性聚合物的干燥涂层上。 载体流体的至少一部分从阵列中移除。

    Molded Micro-Needles
    119.
    发明申请
    Molded Micro-Needles 有权
    成型微针

    公开(公告)号：US20070255205A1

    公开(公告)日：2007-11-01

    申请号：US11661113

    申请日：2005-08-30

    Applicant: Patrick Griss ,  Goran Stemme

    Inventor： Patrick Griss ,  Goran Stemme

    IPC: A61M37/00

    CPC classification number: B29C45/2628 ,  A61K9/0021 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B29C2045/0094 ,  B81B2201/055 ,  B81B2203/0361 ,  B81C99/0085 ,  B81C2201/034

    Abstract: Method of hollow micro-projections having side walls and at least one opening in a side wall, by a molding technique. The hollow micro-projections are defined by a first, negative mold defining the exterior shape of the micro-projections and a second, positive mold defining the hollow interior shape of the micro-projections. The method includes injecting a moldable material into the space between the two molds, in a state where they have been brought together. The positive and negative molds each have an essentially cylindrical geometry. In the process of bringing the molds together, the mold halves are laterally off-set with respect to each other, such that the distance between an inner wall of the negative mold and the positive mold in the area, ranges from zero to a finite distance. Micro-projections and arrays of micro-projections are also disclosed.

    Abstract translation: 通过成型技术的具有侧壁和侧壁中的至少一个开口的中空微型突起的方法。 中空微突起由限定微突起的外部形状的第一负模具和限定微突起的中空内部形状的第二正模定义。 该方法包括将可模塑材料注入到两个模具之间的空间中，并将它们合并在一起。 正负模具各自具有基本上圆柱形的几何形状。 在将模具合在一起的过程中，半模相对于彼此横向偏移，使得阴模的内壁和该区域中的正模之间的距离从零到有限距离 。 还公开了微突起和微突起的阵列。

    Microneedle array module and method of fabricating the same
    120.
    发明授权
    Microneedle array module and method of fabricating the same 有权
    微针阵列模块及其制造方法

    公开(公告)号：US07262068B2

    公开(公告)日：2007-08-28

    申请号：US10885402

    申请日：2004-07-06

    Applicant: Shuvo Roy ,  Aaron J. Fleischman

    Inventor： Shuvo Roy ,  Aaron J. Fleischman

    IPC: H01L21/00 ,  B61C1/00

    CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055

    Abstract: A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces. One embodiment of the method includes the steps of: providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness; patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate. A layer of material may be provided to the other surface to enclose the reservoir well and a passageway is provided through the layer to the well region.

    Abstract translation: 公开了一种微针阵列模块，其包括固定到衬底的前表面并从衬底的前表面向外突出的多个微针以形成阵列，阵列的每个微针具有中空部分，该中空部分通过其中心延伸到其尖端中的开口。 还公开了一种制造微针阵列模块的方法，包括以下步骤：将衬底的一个和另一个相对表面的抗蚀刻掩模层提供到预定厚度; 图案化该阵列的微针的外部尺寸的一个表面的耐蚀刻掩模层; 为阵列的微针的内部尺寸构图另一表面的耐蚀刻掩模层; 将衬底的未掩模部分从一个和另一个表面蚀刻到第一和第二预定深度; 以及从一个和另一个表面去除掩模层。 该方法的一个实施例包括以下步骤：向衬底的另一表面提供预定厚度的耐蚀刻掩模层; 图案化另一表面的耐蚀刻掩模层以限定衬底中的储存器区域; 并蚀刻掉衬底的未掩模的储存区域，以在衬底的另一表面中形成储存器孔。 可以将一层材料提供到另一表面以封闭储存器井，并且通过该层将通道提供到井区。

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