公开(公告)号：US20110051224A1

公开(公告)日：2011-03-03

申请号：US12939909

申请日：2010-11-04

Applicant: James Randolph Webster ,  Thanh Nghia Tu ,  Xiaoming Yan ,  Wonsuk Chung

Inventor： James Randolph Webster ,  Thanh Nghia Tu ,  Xiaoming Yan ,  Wonsuk Chung

IPC: G02B26/00

CPC classification number: B81B3/0008 ,  B81B2201/042 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/24917

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Abstract translation: 提供了减轻设备的可移动部件的永久性粘附或静电的机电系统装置的制造方法。 该方法提供了具有改进和可再现的表面粗糙度的非晶硅牺牲层。 非晶硅牺牲层对于机电系统器件中常用的材料进一步表现出优异的附着性。

公开(公告)号：US20100320555A1

公开(公告)日：2010-12-23

申请号：US12861778

申请日：2010-08-23

Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: H01L31/0224 ,  H01L31/18

CPC classification number: B81B3/0086 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053 ,  G02B26/001

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上的电荷积累来修改所述第一层的特征机电响应。

公开(公告)号：US20100317137A1

公开(公告)日：2010-12-16

申请号：US12793156

申请日：2010-06-03

Applicant: Cécilia DUPRE ,  Philippe Robert

Inventor： Cécilia DUPRE ,  Philippe Robert

IPC: H01L21/302

CPC classification number: B81C1/00476 ,  B81B2203/0109 ,  B81C1/00246 ,  B81C2201/0109 ,  B81C2201/056 ,  B81C2203/0728 ,  H01L21/84 ,  H03H3/0073 ,  H03H9/2463 ,  H03H2009/02314

Abstract: A method for making a microelectronic device comprising at least one electromechanical component provided with a mobile structure, the method comprising the steps of: forming in at least one fine semiconducting thin layer lying on a supporting layer, at least one bar bound to a block, said bar being intended to form a mobile structure of an electromechanical component, withdrawing a portion of the supporting layer under said bar, forming at least one passivation layer based on dielectric material around said bar, forming an encapsulation layer around the bar and covering said passivation layer, the method further comprising steps of: making metal contact and/or interconnection areas, and then suppressing the encapsulation layer around said bar.

Abstract translation: 一种用于制造微电子器件的方法，所述微电子器件包括至少一个提供有移动结构的机电元件，所述方法包括以下步骤：在位于支撑层上的至少一个精细半导体薄层中形成至少一个与块结合的条， 所述杆旨在形成机电部件的移动结构，在所述杆下方撤回支撑层的一部分，基于围绕所述杆的电介质材料形成至少一个钝化层，围绕所述棒形成包封层并覆盖所述钝化 该方法还包括以下步骤：制造金属接触和/或互连区域，然后抑制围绕所述条的封装层。

公开(公告)号：USRE41889E1

公开(公告)日：2010-10-26

申请号：US10360367

申请日：2003-02-05

Applicant: Paolo Ferrari ,  Benedetto Vigna ,  Pietro Montanini ,  Marco Ferrera

Inventor： Paolo Ferrari ,  Benedetto Vigna ,  Pietro Montanini ,  Marco Ferrera

IPC: H01L21/00

CPC classification number: H01L21/764 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00246 ,  B81C2201/0109 ,  B81C2201/0177 ,  B81C2203/0735 ,  B81C2203/0778 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  H01L21/76202

Abstract: A movable mass forming a seismic mass is formed starting from an epitaxial layer and is covered by a weighting region of tungsten which has high density. To manufacture the mass, buried conductive regions are formed in the substrate. Then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions are formed on the buried conductive regions so as to partially cover them. An epitaxial layer is then grown, using a nucleus region. A tungsten layer is deposited and defined and, using a silicon carbide layer as mask, the suspended structure is defined. Finally, the sacrificial region is removed, forming an air gap.

Abstract translation: 从外延层开始形成形成地震质量块的移动体，并且由具有高密度的钨的加权区域覆盖。 为了制造质量，在衬底中形成掩埋的导电区域。 然后，同时，在要形成可移动物体的区域中形成牺牲区域，并且在掩埋的导电区域上形成氧化物绝缘区域，以便部分地覆盖它们。 然后使用核区域生长外延层。 沉积和限定钨层，并且使用碳化硅层作为掩模，限定悬浮结构。 最后，去除牺牲区域，形成气隙。

公开(公告)号：US20100165442A1

公开(公告)日：2010-07-01

申请号：US12719751

申请日：2010-03-08

Applicant: Ming-Hau Tung ,  Lior Kogut

Inventor： Ming-Hau Tung ,  Lior Kogut

IPC: G02B26/00 ,  B32B9/04 ,  B32B19/00 ,  B32B15/04 ,  B32B27/30

CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

公开(公告)号：US20090305010A1

公开(公告)日：2009-12-10

申请号：US12133813

申请日：2008-06-05

Applicant: James Randolph Webster ,  Thanh Nghia Tu ,  Xiaoming Yan ,  Wonsuk Chung

Inventor： James Randolph Webster ,  Thanh Nghia Tu ,  Xiaoming Yan ,  Wonsuk Chung

IPC: B05D5/06 ,  H05H1/24 ,  B32B3/00

CPC classification number: B81B3/0008 ,  B81B2201/042 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/24917

Abstract: Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.

Abstract translation: 提供了减轻设备的可移动部件的永久性粘附或静电的机电系统装置的制造方法。 该方法提供了具有改进和可再现的表面粗糙度的非晶硅牺牲层。 非晶硅牺牲层对于机电系统器件中常用的材料进一步表现出优异的附着性。

公开(公告)号：US20090134522A1

公开(公告)日：2009-05-28

申请号：US12085506

申请日：2006-11-22

Applicant: Charles Gordon Smith ,  Robert Kazinczi ,  Robertus P. Van Kampen

Inventor： Charles Gordon Smith ,  Robert Kazinczi ,  Robertus P. Van Kampen

IPC: H01L29/45 ,  H01L21/441

CPC classification number: B81C1/00666 ,  B81B3/001 ,  B81B2203/0118 ,  B81C2201/0109 ,  G11C23/00

Abstract: A method of manufacturing a non-volatile memory bitcell comprises the steps of depositing a first layer of conductive material on a substrate and patterning and etching the first layer of conductive material to form three non-linearly disposed electrodes. The method also comprises the steps of depositing a first layer of sacrificial material on the electrodes and the substrate and providing an elongate cantilever structure on the first layer of sacrificial material such that the cantilever structure and at least a portion of each electrode overlap each other. The method also includes the steps of depositing a second layer of sacrificial material on the cantilever structure and the first layer of sacrificial material and providing a capping layer on the second layer of sacrificial material and providing holes in the capping layer such that at least a portion of the second layer of sacrificial material is exposed. Finally, the method provides the step of removing the first and second layers of sacrificial material through the holes provided in the capping layer, thereby defining a cavity in which the cantilever structure is suspended.

Abstract translation: 一种制造非易失性存储器位单元的方法包括以下步骤：将第一层导电材料沉积在衬底上，并对第一层导电材料进行图案化和蚀刻以形成三个非线性布置的电极。 该方法还包括以下步骤：在电极和衬底上沉积牺牲材料的第一层，并在第一牺牲材料层上提供细长的悬臂结构，使得悬臂结构和每个电极的至少一部分彼此重叠。 该方法还包括以下步骤：将第二层牺牲材料沉积在悬臂结构和第一牺牲材料层上，并在牺牲材料的第二层上提供覆盖层，并在封盖层中提供孔，使得至少一部分 的第二层牺牲材料被暴露。 最后，该方法提供了通过设置在覆盖层中的孔去除第一层和第二层牺牲材料的步骤，从而限定悬臂悬臂结构的空腔。

公开(公告)号：US20090059345A1

公开(公告)日：2009-03-05

申请号：US12263752

申请日：2008-11-03

Applicant: Ming-Hau Tung ,  Lior Kogut

Inventor： Ming-Hau Tung ,  Lior Kogut

IPC: G02F1/21

CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: A microelectromechanical devices with protective coatings on one or more surfaces of the micromechanical device is disclosed. The micromechanical device includes a substrate. The micromechanical device further includes a mirror positioned over the substrate. The mirror can be at least partially reflective to incident light. The micromechanical device further includes an optical layer positioned over the substrate and spaced from the mirror. The optical layer can be at least partially transmissive to incident light. The micromechanical device can further include a protective coating. The optical layer and the mirror define a cavity and the protective coating overlies surfaces of the microelectromechanical device exposed to the cavity.

Abstract translation: 公开了一种在微机械装置的一个或多个表面上具有保护涂层的微机电装置。 微机械装置包括基板。 微机械装置还包括位于衬底上方的反射镜。 镜子可以至少部分反射入射光。 微机械装置还包括位于基板上并与反射镜隔开的光学层。 光学层可以至少部分地透射入射光。 微机械装置还可以包括保护涂层。 光学层和反射镜限定空腔，保护涂层覆盖暴露于空腔的微机电装置的表面。

公开(公告)号：US07495302B2

公开(公告)日：2009-02-24

申请号：US11072859

申请日：2005-03-03

Applicant: Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

Inventor： Frank Fischer ,  Hans Artmann ,  Lars Metzger ,  Arnim Hoechst ,  Julian Gonska

IPC: H01L27/00

CPC classification number: B81B7/0029 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0109

Abstract: A micromechanical component having a diaphragm is provided, the structure of which effectively prevents the penetration of dirt particles into the cavity. A method for manufacturing such a component is also provided. The structure of the component is implemented in a layer structure which includes at least one first sacrificial layer and a layer system over the first sacrificial layer. A cavity is formed in the first sacrificial layer underneath the diaphragm. In the region of the diaphragm between the upper layer and the lower layer of the layer system situated directly above the first sacrificial layer, at least one access channel to the cavity is formed which has at least one opening in the upper layer and at least one opening in the lower layer, the opening in the upper layer and the opening in the lower layer being offset with respect to each other.

Abstract translation: 提供了具有隔膜的微机械部件，其结构有效地防止了灰尘颗粒进入空腔。 还提供了制造这种部件的方法。 组件的结构以包括至少一个第一牺牲层和第一牺牲层上的层系统的层结构来实现。 在隔膜下方的第一牺牲层中形成空腔。 在位于第一牺牲层正上方的层系统的上层和下层之间的隔膜区域中，形成至少一个到空腔的通道，其在上层中具有至少一个开口，并且至少一个开口 在下层中开口，上层中的开口和下层中的开口相对于彼此偏移。

公开(公告)号：US07450295B2

公开(公告)日：2008-11-11

申请号：US11367098

申请日：2006-03-02

Applicant: Ming-Hau Tung ,  Lior Kogut

Inventor： Ming-Hau Tung ,  Lior Kogut

IPC: G02B26/00 ,  H01L21/00

CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。