公开(公告)号：US20090078747A1

公开(公告)日：2009-03-26

申请号：US12232552

申请日：2008-09-19

Applicant: Kyoung Soo Park ,  Hyun Hee Namkung ,  Kyoung Hun Shin ,  Byeong Hwan Jeon ,  Kang Bae Yoon ,  Cheon Seok Lee

Inventor： Kyoung Soo Park ,  Hyun Hee Namkung ,  Kyoung Hun Shin ,  Byeong Hwan Jeon ,  Kang Bae Yoon ,  Cheon Seok Lee

IPC: B23K35/24

CPC classification number: C09J4/00 ,  H05K3/323 ,  H05K2201/0133

Abstract: An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Abstract translation: 各向异性导电粘合剂组合物包括重均分子量为约100,000至约1,000,000的丙烯酸橡胶粘合剂，包含单（甲基）丙烯酸酯化合物和二（甲基）丙烯酸酯化合物中的至少一种的第一组分，第二组分 包括三（甲基）丙烯酸酯化合物和具有多于三个（甲基）丙烯酸酯基团的化合物中的至少一种，有机过氧化物酶和导电颗粒。 基于丙烯酸橡胶，第一组分，第二组分，有机过氧化物和导电颗粒的总重量，第二组分的存在量为约1至约10重量％。

公开(公告)号：US20090075515A1

公开(公告)日：2009-03-19

申请号：US12211300

申请日：2008-09-16

Applicant: Akira KUWAHARA ,  Takuya Takahashi ,  Seiya Takahashi ,  Hiroshi Akimoto ,  Hiroshi Endo ,  Yoshiaki Ishiyama

Inventor： Akira KUWAHARA ,  Takuya Takahashi ,  Seiya Takahashi ,  Hiroshi Akimoto ,  Hiroshi Endo ,  Yoshiaki Ishiyama

IPC: H05K7/20 ,  H01R13/02

CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21V29/70 ,  F21V29/74 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/433 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/0133 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed.

Abstract translation: 能够提高散热效率的传热构件和包括传热构件的连接器。 在布置在LED和散热器之间的弹性体的表面上，形成将LED中产生的热量传递到散热器的导热金属薄膜。

公开(公告)号：US20090046469A1

公开(公告)日：2009-02-19

申请号：US12191406

申请日：2008-08-14

Applicant: Ching-Fu Yang ,  Chich-Hua Shen ,  Lei-Wei Tseng

Inventor： Ching-Fu Yang ,  Chich-Hua Shen ,  Lei-Wei Tseng

IPC: F21V7/00

CPC classification number: F21V19/0035 ,  F21K9/00 ,  F21V19/0055 ,  F21V29/71 ,  F21V29/717 ,  F21V29/76 ,  F21V29/85 ,  F21Y2115/10 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10651

Abstract: A light emitting diode (LED) module is disclosed. The LED module includes a base, a LED component, a pressing piece, and a plurality of screws. The base has a top surface and a positioning hole on the top surface. The LED component has a bottom surface and includes a positioning protrusion on the bottom surface. Wherein after the LED component is disposed on the base, the positioning protrusion is coupled with the positioning hole to position the LED component at the base. A pin of the LED component is located between the pressing piece and the base. The screws are used to screw the pressing member on the base.

公开(公告)号：US07491068B2

公开(公告)日：2009-02-17

申请号：US11865436

申请日：2007-10-01

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

Abstract translation: 包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。 插入件在横截面中具有半环形结构，并由介电弹性体材料构成。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机 还提供了一种制造焊盘栅格阵列中介层结构的方法。

公开(公告)号：US20090032292A1

公开(公告)日：2009-02-05

申请号：US12183463

申请日：2008-07-31

Applicant: Se Ho PARK ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

Inventor： Se Ho PARK ,  Young-Min Lee ,  Ki-Hyun Kim ,  Seok-Myong Kang

IPC: H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/0133 ,  H05K2203/063

Abstract: A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

Abstract translation: 一种用于印刷电路板的印刷电路板加强结构，其接收多个表面安装装置，以及使用该电路板的集成电路封装。 该结构包括具有一个或多个开口的硬层，所述开口形成在与一个或多个厚度超过预定厚度的一个或多个表面安装装置相对应的区域处; 以及粘结到硬质层的一侧的软层，使得软层可以容纳表面安装装置的突起。 该结构通过将加强结构施加到薄的印刷电路板上而大大减小了封装的尺寸，从而防止了印刷电路板的缺陷，例如变形，断裂等，从而增强了薄的印刷电路板的刚度（机械强度） 印刷电路板。

公开(公告)号：US20090017316A1

公开(公告)日：2009-01-15

申请号：US12216818

申请日：2008-07-11

Applicant: Yoshihiro Kato ,  Takeshi Nobukuni ,  Masayoshi Ueno

Inventor： Yoshihiro Kato ,  Takeshi Nobukuni ,  Masayoshi Ueno

IPC: B32B9/04

CPC classification number: H05K1/0373 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/0207 ,  B32B2264/10 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2457/08 ,  C08K3/36 ,  C08L19/00 ,  C08L63/00 ,  C08L79/04 ,  C08L2205/03 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  C08L2666/02 ,  C08L2666/22 ,  C08L2666/04

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract translation: 一种用于印刷线路板的预浸料，其包含具有特定结构的氰酸酯树脂，非卤素环氧树脂，作为橡胶弹性粉末的硅橡胶粉末，无机填料和基材，预浸料由于 硬树脂骨架结构，在不使用卤素化合物或磷化合物作为阻燃剂的情况下具有高度阻燃性，并且在不使用大量无机填料的情况下在平面方向上具有小的热膨胀系数，并且层压 包括上述预浸料。

公开(公告)号：US20090013528A1

公开(公告)日：2009-01-15

申请号：US12212927

申请日：2008-09-18

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R43/16

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cros s-section and is constituted of a dielectric elastomeric material. At least one sidewall of the interposer is slitted to facilitate the venting of gases and pressure therethrough. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract translation: 一种制造包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入件的方法。 插入件在横向横截面中具有半环形结构，并由介电弹性体材料构成。 插入器的至少一个侧壁被切割以便于气体的排出和通过其中的压力。 多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触 飞机

公开(公告)号：US20090007427A1

公开(公告)日：2009-01-08

申请号：US12207713

申请日：2008-09-10

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01R43/20

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

公开(公告)号：US07452923B2

公开(公告)日：2008-11-18

申请号：US10958825

申请日：2004-10-05

Applicant: Young Mi Jeon ,  Yoon Jae Chung ,  Jong Yoon Jang ,  Woo Young Ahn ,  Yong Seok Han

Inventor： Young Mi Jeon ,  Yoon Jae Chung ,  Jong Yoon Jang ,  Woo Young Ahn ,  Yong Seok Han

IPC: C08F2/50 ,  H01B1/00 ,  H01B1/20 ,  H01B1/22

CPC classification number: H05K3/323 ,  C08F283/00 ,  C08K2201/001 ,  C08L21/00 ,  C08L23/16 ,  C08L33/20 ,  C08L35/06 ,  C08L2205/22 ,  C08L2666/02 ,  C08L2666/24 ,  C09J9/02 ,  C09J121/00 ,  C09J133/08 ,  C09J135/06 ,  C09J151/003 ,  C09J151/04 ,  C09J151/06 ,  C09J155/02 ,  H05K2201/0133

Abstract: The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.

Abstract translation: 本发明公开了一种各向异性导电粘合剂，其包含绝缘粘合剂组分和分散在绝缘粘合剂组分中的多个导电颗粒，其中绝缘粘合剂组分含有交联橡胶树脂。 本发明的各向异性导电粘合剂通过在连接微电路时使其在聚合或硬化反应过程中发生的热收缩最小化来防止粘合剂的剥离或降低粘合强度，由此在相邻的 在连接电路时可以防止电极，并且实现根据长期使用的良好的连接可靠性。

公开(公告)号：US20080257589A1

公开(公告)日：2008-10-23

申请号：US11940640

申请日：2007-11-15

Applicant: Andreas Ostmann ,  Manuel Seckel ,  Thomas Loher ,  Dionysios Manessis ,  Rainer Patzelt

Inventor： Andreas Ostmann ,  Manuel Seckel ,  Thomas Loher ,  Dionysios Manessis ,  Rainer Patzelt

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/02

CPC classification number: H05K1/0271 ,  H05K1/0283 ,  H05K1/188 ,  H05K1/189 ,  H05K3/284 ,  H05K3/303 ,  H05K3/382 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/2009 ,  H05K2203/0271

Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

Abstract translation: 本发明涉及一种制造可扩展电路载体的方法，其中将可扩展基底的原材料施加在导电箔上，该导电箔形成连接到箔的可发射基底层，然后将箔结构化 使得其形成具有至少一个可扩展带状导体的导体结构。 本发明还涉及可通过该方法制造的可扩展电路载体。