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    THERMOSETTING FILLING RESIN COMPOSITION
    111.
    发明申请
    THERMOSETTING FILLING RESIN COMPOSITION 审中-公开
    热固性填充树脂组合物

    公开(公告)号：US20130192886A1

    公开(公告)日：2013-08-01

    申请号：US13819785

    申请日：2011-09-27

    Applicant: Arata Endo

    Inventor： Arata Endo

    IPC: C08K5/09 ,  H05K1/03

    CPC classification number: C08K5/09 ,  C08K3/013 ,  C08K5/098 ,  C08L63/00 ,  H05K1/032 ,  H05K3/0094 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/122

    Abstract: Provided is a heat-curable resin filler in which the deterioration in thixotropic properties over time can be prevented and which has excellent shape retaining properties after being filled in hole parts in a printed wiring board and being cured and also has excellent abradability. The heat-curable resin filler comprises an epoxy resin, an epoxy resin curing agent, an inorganic filler and a fatty acid represented by the following general formula: (R1COO)n-R2 (wherein the substituent R1 represents a hydrocarbon group having 5 or more carbon atoms; the substituent R2 represents a hydrogen atom, an metal alkoxide group or a metal atom; and n is 1 to 4).

    Abstract translation: 本发明提供可以防止触变性随时间劣化的热固性树脂填料，并且在填充印刷电路板中的孔部分之后具有优异的形状保持性并且具有优异的耐磨性。 热固性树脂填料包括环氧树脂，环氧树脂固化剂，无机填料和由以下通式表示的脂肪酸：（R1COO）n-R2（其中取代基R1表示具有5个或更多个的烃基 碳原子;取代基R 2表示氢原子，金属醇盐基或金属原子; n为1〜4）。

    Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
    113.
    发明授权
    Surface mount adhesive, mounting structure including the same, and method for producing mounting structure 失效
    表面贴装粘合剂，包括其的安装结构以及安装结构的制造方法

    公开(公告)号：US08481629B2

    公开(公告)日：2013-07-09

    申请号：US12431303

    申请日：2009-04-28

    Applicant: Ryo Kuwabara ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

    Inventor： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

    IPC: C04B26/06 ,  C08K3/10 ,  C08K3/34 ,  C08J3/22 ,  H05K1/02

    CPC classification number: H05K3/305 ,  C08K3/34 ,  C09J163/00 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/10689 ,  Y02P70/613

    Abstract: A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.

    Abstract translation: 表面贴装粘合剂包括环氧树脂，固化剂，促进剂，第一填料和第二填料。 第二填料的比重为第一填料的比重为1.1〜3倍，第二填料的硬度比第一填料的硬度高。 第一填料的最大粒度为1-100μm，第二填料的最大粒径为1-100μm，比重为1.7〜4.5，修饰的莫氏硬度为2〜12。重量比 的第一填料与第二填料的比例为1:3至3:1，表面粘合剂的比重为1.2至1.5。 当表面贴装粘合剂被分配时，抑制分配故障，并提高分配稳定性。

    WIRING BOARD AND MOUNTING STRUCTURE THEREOF
    114.
    发明申请
    WIRING BOARD AND MOUNTING STRUCTURE THEREOF 有权
    接线板及其安装结构

    公开(公告)号：US20130153279A1

    公开(公告)日：2013-06-20

    申请号：US13819080

    申请日：2011-08-25

    Applicant: Katsura Hayashi

    Inventor： Katsura Hayashi

    IPC: H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/115 ,  H05K1/18 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09827

    Abstract: A wiring board according to an embodiment includes an inorganic insulating layer provided with a via-hole which is a penetrating hole, and a via-conductor which is a penetrating conductor disposed inside the via-hole. The inorganic insulating layer includes first inorganic insulating particles connected to each other and second inorganic insulating particles that are larger in particle size than the first inorganic insulating particles and are connected to each other via the first inorganic insulating particles, and also has, at an inner wall of the via-hole V, a protrusion including at least part of the second inorganic insulating particle. The protrusion is covered with the via-conductor.

    Abstract translation: 根据实施例的布线板包括设置有穿孔的通孔的无机绝缘层和布置在通孔内的穿透导体的通孔导体。 无机绝缘层包括彼此连接的第一无机绝缘颗粒和与第一无机绝缘颗粒相比粒径大的第二无机绝缘颗粒，并且通过第一无机绝缘颗粒彼此连接，并且在内部 通孔V的壁，包括至少部分第二无机绝缘颗粒的突起。 突起被通孔导体覆盖。

    Liquid crystal polyester composition and electronic circuit board using the same
    115.
    发明授权
    Liquid crystal polyester composition and electronic circuit board using the same 有权
    液晶聚酯组合物和电子电路板使用相同

    公开(公告)号：US08465670B2

    公开(公告)日：2013-06-18

    申请号：US13387236

    申请日：2010-07-23

    Applicant: Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

    Inventor： Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

    IPC: C09K19/00 ,  C09K19/06 ,  C09K19/34 ,  C09K19/52 ,  H05K1/00

    CPC classification number: H05K1/056 ,  C08L67/03 ,  C09D167/03 ,  C09K19/3809 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/10 ,  Y10T428/1036

    Abstract: To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.

    Abstract translation: 提供一种液晶聚酯组合物，其适用于形成具有优异导热性的液晶聚酯膜的材料。 此外，通过使用由液晶聚酯组合物获得的绝缘膜提供了优异的电子电路板。 本发明的液晶聚酯组合物由液晶聚酯，溶剂和导热填料组成。 导热性填料的含量相对于液晶聚酯和导热性填料的总量为50〜90体积％，导热性填料含有0〜20体积％的具有 体积平均粒径为0.1μm以上且小于1.0μm，5〜40体积％的体积平均粒径为1.0μm以上且小于5.0μm的第二导热性填料和40〜90体积％的 第三导热填料，其体积平均粒径为5.0μm以上且30.0μm以下。

    PREPREG AND PRINTED CIRCUIT BOARD COMPROMISING THE SAME
    117.
    发明申请
    PREPREG AND PRINTED CIRCUIT BOARD COMPROMISING THE SAME 审中-公开
    PREPREG和印刷电路板相同

    公开(公告)号：US20130143030A1

    公开(公告)日：2013-06-06

    申请号：US13692834

    申请日：2012-12-03

    Applicant: c/o Samsung Electro-Mechanics Co., Ltd.

    Inventor： Yoon Shik KIM

    IPC: C09D163/00

    CPC classification number: C09D163/00 ,  C08J9/42 ,  C08J2363/00 ,  C08J2363/02 ,  C08L63/00 ,  H01B3/40 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/0209 ,  Y10T428/249994

    Abstract: Disclosed herein are a prepreg including an insulating resin composition impregnated into a porous support, and a printed circuit board including the same as an insulating layer. According to the present invention, the porous support used for impregnation of the insulating resin composition has excellent thermal stability and wide surface area, a coefficient of thermal expansion (CTE) of the porous support is not changed according to directivity, and the prepreg has a structure in which fillers included in the insulating resin composition are dispersed between the porous supports, such that the CTE may be efficiently improved. In addition, although damage is generated from the outside, the damage is not enlarged due to adjacent porous supports but is only locally generated and physical properties for pressure load is excellent due to the porous structure, such that damage of the printed circuit board may be reduced.

    Abstract translation: 本文公开了一种预浸料，其包括浸渍到多孔载体中的绝缘树脂组合物，以及包含其作为绝缘层的印刷电路板。 根据本发明，用于浸渍绝缘树脂组合物的多孔载体具有优异的热稳定性和宽的表面积，多孔载体的热膨胀系数（CTE）根据方向性没有改变，并且预浸料具有 包含在绝缘树脂组合物中的填料分散在多孔载体之间的结构，使得可以有效地提高CTE。 此外，虽然从外部产生损伤，但是由于相邻的多孔载体而导致的损伤不会扩大，而是仅局部产生，并且由于多孔结构，压力负载的物理性能优异，使得印刷电路板的损坏可能 减少

    PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE
    120.
    发明申请
    PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
    PREPREG，接线板和半导体器件

    公开(公告)号：US20130105200A1

    公开(公告)日：2013-05-02

    申请号：US13807254

    申请日：2011-06-29

    Applicant: Noriyuki Ohigashi ,  Tadasuke Endo

    Inventor： Noriyuki Ohigashi ,  Tadasuke Endo

    IPC: B32B19/02 ,  H05K1/02

    CPC classification number: B32B19/02 ,  B32B17/04 ,  C08J5/24 ,  C08J2363/00 ,  H01L2224/16227 ,  H05K1/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/2495 ,  Y10T428/252

    Abstract: An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.

    Abstract translation: 本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是 与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层， 形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上 层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。

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