公开(公告)号：US20180084641A1

公开(公告)日：2018-03-22

申请号：US15704222

申请日：2017-09-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyasu NOTO ,  Yoshinori TAKENAKA

IPC: H05K1/03 ,  H01F27/245 ,  H05K3/46 ,  H01F27/28

CPC classification number: H05K1/0306 ,  H01F27/245 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0373 ,  H05K3/46 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0761 ,  H05K2201/0769

Abstract: A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 μm to 10.5 μm. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 μm to 10.5.

公开(公告)号：US20170145213A1

公开(公告)日：2017-05-25

申请号：US15322929

申请日：2015-07-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Kentaro NOMIZU ,  Mitsuru OHTA ,  Masanobu SOGAME ,  Yoshinori MABUCHI

IPC: C08L79/04 ,  H05K1/03 ,  C08J5/24

CPC classification number: C08L79/04 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/04 ,  C08J2479/08 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/06

Abstract: A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

公开(公告)号：US09554464B2

公开(公告)日：2017-01-24

申请号：US14398616

申请日：2013-08-01

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract translation: 高导热性印刷电路板通过抑制铜离子的洗脱来防止电化学迁移。 印刷电路板是依次包括具有绝缘树脂层和铜箔层的金属基板的金属基印刷电路板。 在印刷电路板中，绝缘树脂层包含由平均粒径（D50）为1nm〜300nm的粒径为0.1nm〜600nm的无机粒子构成的第一无机填充材料和由 平均粒径（D50）为500nm〜20μm的粒径为100nm〜100μm的无机粒子，第一无机填充剂和第二无机填料均匀地分散在绝缘树脂层中。

公开(公告)号：US20160088729A1

公开(公告)日：2016-03-24

申请号：US14889385

申请日：2014-05-27

Applicant: EPCOS AG

Inventor： Hisashi KOBUKE ,  Yousuke FUTAMATA ,  Emi NINOMIYA

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C03C12/00 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4617 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract translation: 多层布线基板包括多个绝缘层，每个绝缘层包括玻璃陶瓷。 在绝缘层之间形成多个内部导体层。 通孔导体穿过绝缘层并将内部导体层互相连接在不同的层位置。 在绝缘层的层叠方向的外表面上形成表面导体层。 绝缘层包括外部绝缘层和内部绝缘层。 表示包含在外侧绝缘层中的外部填料的扁平度和球形度的第一长宽比大于表示内侧绝缘层中包含的内部填料的扁平度和球形度的第二纵横比。 外部绝缘层的热膨胀系数小于内部绝缘层的热膨胀系数。

公开(公告)号：US20160053072A1

公开(公告)日：2016-02-25

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/32 ,  H05K1/03 ,  C08K3/30 ,  C08K7/10 ,  C08K3/34 ,  C08K3/40

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

Abstract translation: 提供了包含芳族聚酯，激光可激活添加剂和矿物填料的聚合物组合物。 矿物填料的中值粒径约为35微米或更小，激光活化添加剂的平均粒径约为1000纳米或更小。

公开(公告)号：US20150235122A1

公开(公告)日：2015-08-20

申请号：US14564111

申请日：2014-12-09

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/077 ,  G06K7/10

CPC classification number: G06K19/07794 ,  G06K7/10009 ,  G06K19/07754 ,  G06K19/07769 ,  H01F27/365 ,  H01F38/14 ,  H01F41/16 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/167 ,  H05K1/183 ,  H05K3/1275 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0266 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/086 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10098

Abstract: Card body (CB) for a dual interface smart card (SC) comprising a metal foil (MF) or metallized layer (ML). An opening in the metal layer may be sized so that a coupler coil (CC) of a booster antenna (BA) is exposed. Improving coupling between a contactless reader and a transponder comprising providing a patch booster antenna (PBA) on a substrate disposed on the reader. Various booster antenna designs are disclosed.

Abstract translation: 包括金属箔（MF）或金属化层（ML）的双接口智能卡（SC）的卡体（CB）。 金属层中的开口的尺寸可以使得增强天线（BA）的耦合线圈（CC）暴露。 改善非接触读取器和应答器之间的耦合，包括在布置在读取器上的衬底上提供贴片增强天线（PBA）。 公开了各种增强天线设计。

公开(公告)号：US20140333484A1

公开(公告)日：2014-11-13

申请号：US14117476

申请日：2011-08-04

Applicant: Kouji Muraoka

Inventor： Kouji Muraoka

IPC: H01Q1/38 ,  H01Q1/36

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/364 ,  H05K3/18 ,  H05K3/182 ,  H05K3/245 ,  H05K3/246 ,  H05K2201/0266 ,  H05K2203/0709

Abstract: This antenna (10) has an underlying print layer (2) which is upon the surface of a material (1) to be printed in a predetermined antenna pattern, and an electro-less plating layer (3) applied to the surface of the underlying print layer (2). The underlying print layer (2) is formed from an ink (2a) and a metallic powder (2b). A portion of the particles of the metallic powder (2b) are entrained within the ink layer in which the ink (2a) has been printed in a substantially uniform thickness. Some particles which are of large particle size project from the ink layer, and a portion of the ink (2a) covering the projecting portions is removed.

Abstract translation: 该天线（10）具有下面的印刷层（2），该印刷层（2）位于要以预定天线图案打印的材料（1）的表面上，并且将无电镀层（3）施加到下面的表面 打印层（2）。 下面的印刷层（2）由油墨（2a）和金属粉末（2b）形成。 金属粉末（2b）的一部分颗粒被夹带在其中印刷有大致均匀厚度的油墨（2a）的油墨层中。 一些粒径大的颗粒从油墨层突出，并且去除了覆盖突出部分的油墨（2a）的一部分。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20140087614A1

公开(公告)日：2014-03-27

申请号：US14115306

申请日：2012-04-27

Applicant: PANASONIC CORPRORATION

Inventor： Takashi Matsuda ,  Mitsuyoshi Nishino ,  Kiyotaka Komori

IPC: C08K3/00 ,  C08L63/00 ,  H05K1/03

CPC classification number: C08K3/013 ,  B32B15/092 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2363/00 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K3/26 ,  C08K2003/222 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T442/20 ,  Y10T442/3431 ,  Y10T442/3472

Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

Abstract translation: 本发明提供一种热固性树脂组合物，相对于100体积份的热固性树脂固体和无机填料，含有40〜80体积份的无机填料。 无机填料含有（A）选自三水铝矿型氢氧化铝粒子和平均粒径（D50）为1〜15μm的氢氧化镁粒子中的至少一种粒子; （B）平均粒径（D50）为1.5μm以下的氧化铝粒子; 和（C）钼化合物，组分（A），组分（B）和组分（C）相对于无机填料的总量的100％的共混比（体积比）为组分（A ）：30〜70％，（B）成分：1〜40％，成分（C）：1〜10％。

公开(公告)号：US20130333931A1

公开(公告)日：2013-12-19

申请号：US14002552

申请日：2012-02-22

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  C08G18/0823 ,  C08G18/6659 ,  C08G18/672 ,  C08G18/758 ,  C08J5/18 ,  C08K7/16 ,  C08K2003/026 ,  C08K2003/0812 ,  C08K2201/003 ,  H05K3/287 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0266 ,  C08G18/44

Abstract: The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film.

Abstract translation: 本发明提供一种绝缘膜，包括：（A）粘合剂聚合物; （B）球形有机珠粒; 和（C）含有选自磷，铝和镁中的至少一种元素的细颗粒，（B）球形有机珠和（C）微粒均以预定状态分散在绝缘膜中。