公开(公告)号：US20030153223A1

公开(公告)日：2003-08-14

申请号：US10327092

申请日：2002-12-24

Inventor： Akikazu Matsumoto ,  Tsuyoshi Tanigaki ,  Takami Noda ,  Shogo Izawa

IPC: D03D009/00 ,  D03D019/00 ,  D04B021/00 ,  B32B013/02

CPC classification number: H05K3/321 ,  H01L23/145 ,  H01L23/49883 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/12041 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K2203/1446 ,  H05K2203/1453 ,  Y10T428/249932 ,  Y10T442/10

Abstract: A method for connecting a metal material with an electric conductive resin material including the steps of heating the connecting portion of the electric conductive resin material with the metal material to a temperature equal to or more than a softening point of the connecting portion and depressing the metal material to the heated portion for melting joint.

Abstract translation: 一种金属材料与导电性树脂材料的连接方法，其特征在于，包括以下步骤：将金属材料的导电性树脂材料的连接部分加热到连接部分的软化点以上的温度， 材料加热到熔化接头的部分。

公开(公告)号：US06596094B2

公开(公告)日：2003-07-22

申请号：US09993615

申请日：2001-11-27

Applicant: Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

Inventor： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

IPC: B23K35363

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y10T428/12063 ,  Y10T428/12882

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

公开(公告)号：US20030066681A1

公开(公告)日：2003-04-10

申请号：US10078424

申请日：2002-02-21

Applicant: Fujitsu Limited

Inventor： Hiroki Uchida ,  Masayuki Ochiai

IPC: H05K001/16

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218

Abstract: A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

Abstract translation: 焊膏含有分散在焊剂中的焊料合金粉末和金属粉末。 焊料合金含有Sn和Zn，而金属粉末含有选自Pd，Ti和Ni中的至少一种元素。 优选地，在焊料合金粉末的熔点，金属粉末的含量超过金属粉末相对于焊料合金的溶解度极限的量。 焊膏可以用于形成用于通过在其端子之间插入焊料层来电连接两个物体的结构。

公开(公告)号：US06390355B1

公开(公告)日：2002-05-21

申请号：US09389928

申请日：1999-09-03

Applicant: Richard Hanson Jung

Inventor： Richard Hanson Jung

IPC: B23K3100

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K2101/42 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/0789 ,  Y02P70/611

Abstract: A method for forming a metallic contact and manufacturing a product having an electronic component 101 and a printed circuit board 100 (PCB) includes dispensing a slurry solder paste mixture 104 including a metallic powder 105 and an acidic fluid 106, placing electronic component 101 over solder paste dispensed over a surface area of PCB 100, and applying pressure on at least a section of electronic component 101 such that at least a portion of slurry solder paste mixture 104 dispensed on the surface area and in contact with the section of electronic component 101 consolidates into at least one of an inter-metallic compound of hardened solder and a hardened alloy of solder forming the metallic contact between electronic component 101 and said PCB 100.

Abstract translation: 一种用于形成金属接触并制造具有电子部件101和印刷电路板100（PCB）的产品的方法包括：分配包括金属粉末105和酸性流体106的浆料焊膏混合物104，将电子部件101放置在焊料上 分配在PCB 100的表面区域上的浆料，并且在至少一部分电子部件101上施加压力，使得分散在表面区域上并与电子部件101的部分接触的至少一部分浆料焊膏混合物104固结 进入硬化焊料的金属间化合物和形成电子部件101和所述PCB 100之间的金属接触的焊料的硬化合金中的至少一种。

公开(公告)号：US06383305B1

公开(公告)日：2002-05-07

申请号：US09581224

申请日：2000-06-23

Applicant: Jean Chazelas ,  Olivier Prevotat ,  Jean-François Silvain ,  Sandrine Trombert

Inventor： Jean Chazelas ,  Olivier Prevotat ,  Jean-François Silvain ,  Sandrine Trombert

IPC: B23K3534

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0308

Abstract: To improve the resistance of a solder to strains, especial thermal strains, superelastic particles are incorporated into the solder in a proportion by volume of 10 to 30% approximately. So that this incorporation can be done, the particles are coated with a metal, for example copper, that is wettable by the solder.

Abstract translation: 为了提高焊料对应变的阻力，特别的热应变，超弹性颗粒以大约10到30％的体积比例掺入焊料中。 为了可以实现这种结合，颗粒被可被焊料润湿的金属（例如铜）涂覆。

公开(公告)号：US06337522B1

公开(公告)日：2002-01-08

申请号：US09106780

申请日：1998-06-30

Applicant: Sung Kwon Kang ,  Sampath Purushothaman

Inventor： Sung Kwon Kang ,  Sampath Purushothaman

IPC: H01L23532

CPC classification number: H01L24/83 ,  B23K35/025 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13109 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/48 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05147

Abstract: A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

Abstract translation: 公开了一种用于磁带自动键合（TAB）封装，倒装芯片封装和有源矩阵液晶显示器（AMLCD）面板的新的互连方案，其中使用导电粘合剂来形成有源电子器件和 其组件。 导电粘合剂可以是包含聚合物树脂，免清洗助焊剂，多个具有导电熔融涂层的导电颗粒的混合物，其在导电颗粒之间以及衬底之间提供冶金结合。 使用导电粘合剂的优点包括键合压力和/或粘合温度的降低，界面反应的控制，稳定的冶金键的促进，接头的可靠性提高等。

公开(公告)号：US6150726A

公开(公告)日：2000-11-21

申请号：US88834

申请日：1998-06-02

Applicant: Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

Inventor： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

IPC: G03F7/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K1/11 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L29/62

CPC classification number: H01L24/16 ,  G03F7/00 ,  G03F7/0035 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K2203/0769 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/3463

Abstract: Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

Abstract translation: 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。

公开(公告)号：US5958590A

公开(公告)日：1999-09-28

申请号：US414070

申请日：1995-03-31

Applicant: Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

Inventor： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

IPC: H05K1/14 ,  H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B5/16

CPC classification number: H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H05K3/321 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83886 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K2201/0218 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K3/3457 ,  H05K3/4007 ,  Y10T428/12181 ,  Y10T428/12229 ,  Y10T428/2991

Abstract: Pastes of dendrite particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste. The paste is disposed between electrical contacts on adjacent surfaces. The paste is heated to fuse the dendrite surfaces to form a network of fused dendrites which are also fused to the electrical contacts. The paste is further heated to cure the polymer to form electrical interconnections between the electrical contacts on the adjacent surfaces.

Abstract translation: 描述了涂覆有导电涂层的枝晶颗粒的浆料。 将表面放置成与电解或化学镀溶液接触。 树皮在表面形成。 将树突暴露于另一种电镀溶液以在树枝状表面上铺上涂层。 将涂覆的枝晶从表面除去以形成涂覆的树枝状粉末。 将粉末加入到聚合物材料中以形成糊状物。 糊料设置在相邻表面上的电触点之间。 加热糊状物以使枝晶表面熔合以形成融合的枝晶网络，其也与电触点融合。 进一步加热糊料以固化聚合物以在相邻表面上的电接触之间形成电互连。

公开(公告)号：US5846366A

公开(公告)日：1998-12-08

申请号：US698284

申请日：1996-08-14

Applicant: Sungho Jin ,  Mark Thomas McCormack

Inventor： Sungho Jin ,  Mark Thomas McCormack

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/104 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: In accordance with the invention, an electronic device having one or more contact pads is placed in contact with a carrier sheet bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 根据本发明，具有一个或多个接触垫的电子设备被放置成与承载有可转移焊料颗粒阵列的载体片接触。 施加热量以将焊料粘附到接触焊盘，并且将焊料选择性地转移到接触焊盘上。 在优选实施例中，焊料载体介质包括弹性材料，焊料颗粒包括焊料涂覆的磁性颗粒。 在弹性体固化时施加磁场产生规则的焊料涂覆颗粒阵列。 使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。

公开(公告)号：US5713508A

公开(公告)日：1998-02-03

申请号：US629178

申请日：1996-04-08

Applicant: Michael Anthony Gaynes ,  Kostas Papathomas ,  Giana M. Phelan ,  Charles Gerard Woychik

Inventor： Michael Anthony Gaynes ,  Kostas Papathomas ,  Giana M. Phelan ,  Charles Gerard Woychik

IPC: B23K1/00 ,  B23K1/20 ,  B23K20/02 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  H01B1/22 ,  H05K3/32

CPC classification number: B23K20/023 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  H05K3/321 ,  B23K2201/32 ,  H01L2224/293 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K2201/0218 ,  H05K2203/0278 ,  H05K2203/0425

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.