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    Ball Grid Array Rework
    4.
    发明申请
    Ball Grid Array Rework 有权
    球栅阵列返工

    公开(公告)号：US20160007457A1

    公开(公告)日：2016-01-07

    申请号：US14324647

    申请日：2014-07-07

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Eric V. Kline ,  Arvind K. Sinha

    IPC: H05K1/11 ,  B23K1/018 ,  H05K13/04

    CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K1/018 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/16227 ,  H01L2224/1713 ,  H05K1/11 ,  H05K3/225 ,  H05K13/0486 ,  H05K2201/0308 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K2203/1115 ,  H05K2203/176

    Abstract: Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

    Abstract translation: 本发明的实施例涉及一种用于返修BGA封装的方法和装置。 存储器形状材料被放置在与封装的多个焊接点相邻的位置。 对材料施加刺激，刺激导致材料从非刺激形状变成刺激形状。 这种刺激导致材料的膨胀。 随着材料膨胀，它在BGA封装和相邻定位的载体上施加张力，导致两个部件分离，同时减轻相邻定位部件的侧向热量。

    Circuit protection element and a circuit board with the circuit protection element
    5.
    发明申请
    Circuit protection element and a circuit board with the circuit protection element 失效
    电路保护元件和电路板与电路保护元件

    公开(公告)号：US20090002962A1

    公开(公告)日：2009-01-01

    申请号：US11898221

    申请日：2007-09-11

    Applicant: Jung-Hui Hsu

    Inventor： Jung-Hui Hsu

    IPC: H05K7/00

    CPC classification number: H05K1/0201 ,  H01H37/52 ,  H01H37/74 ,  H01H37/76 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2203/176

    Abstract: A circuit protection element and a circuit board with the circuit protection element are disclosed. The circuit protection element includes a metal base, and at least one opening slot located at the metal base. The metal base forms a positioning portion. One end of the metal base is fastened onto a circuit board. The bottom of the free end of the metal base contacts a conducting point located on the circuit board to make the circuit be in a conducting status. When the current is overloaded or the circuit is over-heated, the bottom of the free end of the metal base is heated so that the bottom of the free end of the metal base separates from the conducting point and the positioning portion is wedged with the circuit board. Thereby, the circuit becomes a broken circuit. The circuit protection element can prevent the electronic components from being burnt down.

    Abstract translation: 公开了具有电路保护元件的电路保护元件和电路板。 电路保护元件包括金属基座和位于金属基座处的至少一个开口槽。 金属底座形成定位部。 金属基座的一端固定在电路板上。 金属基座的自由端的底部接触位于电路板上的导电点，以使电路处于导通状态。 当电流过载或电路过热时，金属基座的自由端的底部被加热，使得金属基座的自由端的底部与导电点分离，并且定位部分楔入 电路板。 由此，电路成为断路。 电路保护元件可以防止电子元件烧毁。

    Circuit protection element and a circuit board with the circuit protection element
    9.
    发明授权
    Circuit protection element and a circuit board with the circuit protection element 失效
    电路保护元件和电路板与电路保护元件

    公开(公告)号：US08031488B2

    公开(公告)日：2011-10-04

    申请号：US11898221

    申请日：2007-09-11

    Applicant: Jung-Hui Hsu

    Inventor： Jung-Hui Hsu

    IPC: H01H85/20 ,  H02B1/18

    CPC classification number: H05K1/0201 ,  H01H37/52 ,  H01H37/74 ,  H01H37/76 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2203/176

    Abstract: A circuit protection element and a circuit board with the circuit protection element are disclosed. The circuit protection element includes a metal base, and at least one opening slot located at the metal base. The metal base forms a positioning portion. One end of the metal base is fastened onto a circuit board. The bottom of the free end of the metal base contacts a conducting point located on the circuit board to make the circuit be in a conducting status. When the current is overloaded or the circuit is over-heated, the bottom of the free end of the metal base is heated so that the bottom of the free end of the metal base separates from the conducting point and the positioning portion is wedged with the circuit board. Thereby, the circuit becomes a broken circuit. The circuit protection element can prevent the electronic components from being burnt down.

    Abstract translation: 公开了具有电路保护元件的电路保护元件和电路板。 电路保护元件包括金属基座和位于金属基座处的至少一个开口槽。 金属底座形成定位部。 金属基座的一端固定在电路板上。 金属基座的自由端的底部接触位于电路板上的导电点，以使电路处于导通状态。 当电流过载或电路过热时，金属基座的自由端的底部被加热，使得金属基座的自由端的底部与导电点分离，并且定位部分楔入 电路板。 由此，电路成为断路。 电路保护元件可以防止电子元件烧毁。

    Flat Substrate Having an Electrically Conductive Structure
    10.
    发明申请
    Flat Substrate Having an Electrically Conductive Structure 有权
    具有导电结构的平面基板

    公开(公告)号：US20080315941A1

    公开(公告)日：2008-12-25

    申请号：US12083916

    申请日：2006-10-13

    Applicant: Heinz Kaufmann ,  Tobias Melz ,  Ralf Sindelar

    Inventor： Heinz Kaufmann ,  Tobias Melz ,  Ralf Sindelar

    IPC: H01L41/00

    CPC classification number: B81B3/0072 ,  B81B2201/042 ,  H01L27/20 ,  H01L41/0825 ,  H05K1/0271 ,  H05K2201/0308 ,  H05K2201/10083 ,  H05K2201/10151

    Abstract: The description is of a flat substrate with an electrically conductive structure integrated inside the flat substrate or applied to a surface of the flat substrate and/or with a technically improved surface.The invention is characterised in that at least one sensor is integrated inside the flat substrate or applied to a surface of the flat substrate, which generates sensor signals according to deformations occurring inside the flat substrate, at least one actuator is integrated inside the flat substrate or applied to the surface of the flat substrate, which enables the flat substrate to mechanically deform when activated, and a signal unit connected to the at least one sensor and to the at least one actuator is provided, which, on the basis of the sensor signals, generates actuator signals for activating the actuator, so that deformations occurring inside the flat substrate are reduced.

    Abstract translation: 描述是具有整体在平坦基板内部或施加到平坦基板的表面和/或技术上改进的表面的导电结构的平坦基板。 本发明的特征在于，至少一个传感器集成在平面基板的内部或应用于平面基板的表面，该平面基板的表面根据在平坦基板内部发生的变形产生传感器信号，至少一个致动器集成在平面基板的内部或 施加到平坦基板的表面，这使得平面基板能够在被激活时机械地变形，并且提供连接到至少一个传感器和至少一个致动器的信号单元，其基于传感器信号 产生用于启动致动器的致动器信号，使得在平坦基板内发生的变形减小。

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