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    Method for soldering electronic component and soldering structure of electronic component
    111.
    发明授权
    Method for soldering electronic component and soldering structure of electronic component 有权
    焊接电子部件的方法和电子部件的焊接结构

    公开(公告)号：US07632710B2

    公开(公告)日：2009-12-15

    申请号：US11817522

    申请日：2006-11-10

    Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488

    CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT
    112.
    发明申请
    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT 有权
    焊接电子元件的方法和电子元器件的焊接结构

    公开(公告)号：US20090233117A1

    公开(公告)日：2009-09-17

    申请号：US11817522

    申请日：2006-11-10

    Applicant: Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    Inventor： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC: B32B15/04 ,  B23K31/02 ,  B23K1/20

    CPC classification number: H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    Abstract: In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    Abstract translation: 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

    CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD
    113.
    发明申请
    CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD 审中-公开
    电路板模块和制造方法

    公开(公告)号：US20090175019A1

    公开(公告)日：2009-07-09

    申请号：US12299561

    申请日：2008-02-08

    Applicant: Keiji Koyama ,  Masamichi Yamamoto ,  Katsunari Mikage ,  Jin-Joo Park

    Inventor： Keiji Koyama ,  Masamichi Yamamoto ,  Katsunari Mikage ,  Jin-Joo Park

    IPC: H05K1/14 ,  H01L21/98

    CPC classification number: H05K3/323 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/07811 ,  H05K1/147 ,  H05K1/181 ,  H05K3/361 ,  H05K2201/0248 ,  H05K2201/10378 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: [Problem]To enable mounting a part on the rear surface at the back of a connection part on a PCB to be connected with a FPC.[Means for Solving the Problem]Connection parts are provided such that a conductor wiring of a first circuit board and a conductor wiring of a second circuit board are connected with an anisotropic conductive adhesive which is made of an insulative resin including needle-shaped or linear chain-shaped metal powders oriented in a thickness direction, i.e., adhesion direction, and a part is mounted on at least either one of the first and the second circuit boards, the part being mounted on the rear surface at the back opposed to the surface where the connection part is formed.

    Abstract translation: [问题]能够将要连接到FPC的PCB上的连接部分的背面的部件安装在背面。 [解决问题的方法]连接部件设置成使得第一电路板的导体布线和第二电路板的导体布线与各向异性导电粘合剂连接，所述各向异性导电粘合剂由包括针状或线性的绝缘树脂制成 在厚度方向上取向的链状金属粉末，即粘附方向，一部分安装在第一和第二电路板中的至少一个中，该部分安装在与表面相对的背面的背面上 其中连接部分形成。

    Morphological forms of fillers for electrical insulation
    119.
    发明申请
    Morphological forms of fillers for electrical insulation 审中-公开
    电绝缘填料的形态形式

    公开(公告)号：US20070026221A1

    公开(公告)日：2007-02-01

    申请号：US11529181

    申请日：2006-09-28

    Applicant: Gary Stevens ,  James Smith ,  John Wood

    Inventor： Gary Stevens ,  James Smith ,  John Wood

    IPC: B32B5/14 ,  B32B18/00 ,  G11B11/105

    CPC classification number: C09K5/14 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249959 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/2916

    Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.

    Abstract translation: 具有主体树脂基体和高导热性填料的高导热性树脂。 高导热性填料（30）与主体树脂基体形成连续的有机 - 无机复合材料。 填料的长度为1-1000nm，平均纵横比在3-100之间。 高导热性填料的至少一部分包含选自六方晶系，立方晶型，正交型，菱方晶型，四方晶系，晶须和管中的一种或多种的形态（31）。 特别地，一些填料将聚集成二级结构。

    Seeding of HTC fillers to form dendritic structures
    120.
    发明申请
    Seeding of HTC fillers to form dendritic structures 失效
    种植HTC填料以形成树枝状结构

    公开(公告)号：US20060280873A1

    公开(公告)日：2006-12-14

    申请号：US11397000

    申请日：2006-04-03

    Applicant: James Smith ,  Gary Stevens ,  John Wood

    Inventor： James Smith ,  Gary Stevens ,  John Wood

    IPC: B05D3/02 ,  B05D1/18

    CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

    Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

    Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，其包括将HTC种子42加入到主体树脂基质中。 HTC种子已经被表面官能化以基本上不相互反应。 然后，种子积聚HTC构件块42，并且HTC构建块也被表面功能化以基本上不相互反应。 然后将HTC构建块与HTC种子组装，以在主体树脂基质内产生HTC树枝状填料40。

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