Dielectric materials
    116.
    发明授权
    Dielectric materials 失效
    介电材料

    公开(公告)号:US4747897A

    公开(公告)日:1988-05-31

    申请号:US34285

    申请日:1987-04-02

    Abstract: Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.

    Abstract translation: 提供具有低介电常数的介电材料,所述材料包括浸渍有热固性树脂的织物,所述织物中至少一部分纤维是氟碳纤维。 还提供了这些电介质材料的制造方法。 电介质材料可用于制造多层印刷电路板。

    High density para-aramid papers
    117.
    发明授权
    High density para-aramid papers 失效
    高密度对位芳族聚酰胺纸

    公开(公告)号:US4729921A

    公开(公告)日:1988-03-08

    申请号:US775577

    申请日:1985-09-17

    Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

    Abstract translation: 包含5至25重量%的粘合剂和选自对位芳族聚酰胺纸浆,对位芳族聚酰胺絮凝物及其混合物的对位芳族聚酰胺纤维的高密度对位芳族聚酰胺纸,压制成提供体积百分比的对位芳族聚酰胺纸 纸的体积百分比絮体的至少53减去0.13倍的芳纶纤维可用于制备具有低热膨胀系数的电路板基材。

    Controlled thermal expansion composite and printed circuit board
embodying same
    119.
    发明授权
    Controlled thermal expansion composite and printed circuit board embodying same 失效
    控制热膨胀复合材料和印制电路板体现

    公开(公告)号:US4513055A

    公开(公告)日:1985-04-23

    申请号:US325810

    申请日:1981-11-30

    Abstract: A composite characterized by a controlled coefficient of thermal expansion and comprising a thermal coefficient control fabric embedded in a resin matrix and composed of yarns with positive and negative coefficients of thermal expansion. A composite circuit board constructed of the composite and having a coefficient of thermal expansion matched to a particular integrated chip carrier material, such as aluminum oxide.

    Abstract translation: 一种复合材料,其特征在于受控的热膨胀系数,并且包括嵌入树脂基体中并由具有正和负热膨胀系数的纱线组成的热系数控制织物。 复合电路板,由复合材料构成,具有与特定的集成芯片载体材料(例如氧化铝)匹配的热膨胀系数。

    Glass cloth and prepreg containing same
    120.
    发明授权
    Glass cloth and prepreg containing same 失效
    玻璃布和含有它的预浸料

    公开(公告)号:US4428995A

    公开(公告)日:1984-01-31

    申请号:US427582

    申请日:1982-09-29

    Abstract: At both ends of glass cloth comprising warp yarns consisting of a number of glass monofilaments and weft yarns consisting of a number of glass monofilaments, the weft yarns being cut at the ends of the glass cloth, glass monofilament-fixing portions are formed by fusing the ends of the weft yarns, by substituting a synthetic resin yarn for the warp yarn at the end of the glass cloth and melting the synthetic resin yarn or by attaching an adhesive tape to the ends of the glass cloth. The glass cloth having the glass monofilament-fixing portions at both ends thereof is advantageous in that no broken pieces of glass monofilament were formed when preparing prepreg or laminate using the glass cloth, and the laminate has excellent accuracy of thickness.

    Abstract translation: 在玻璃布的两端,包括由多根玻璃单丝组成的经纱和由多根玻璃单丝组成的纬纱,纬纱在玻璃布的端部被切割,玻璃单丝固定部分通过将 通过在玻璃布的末端代替合成树脂纱用于经纱并熔化合成树脂纱线或者通过将粘合带粘附到玻璃布的端部来使纬纱的端部。 在其两端具有玻璃单丝固定部分的玻璃布的优点在于,当使用玻璃布制备预浸料或层压体时,不形成玻璃单丝的破碎片,并且层压板具有优异的厚度精度。

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