公开(公告)号：US5692940A

公开(公告)日：1997-12-02

申请号：US676180

申请日：1996-07-15

Applicant: Hidenori Kinbara ,  Mitsuru Nozaki ,  Masanobu Mizoguchi ,  Koji Kimura ,  Naohiko Shimono

Inventor： Hidenori Kinbara ,  Mitsuru Nozaki ,  Masanobu Mizoguchi ,  Koji Kimura ,  Naohiko Shimono

IPC: C08J5/04 ,  C08J5/24 ,  D04H1/42 ,  D04H1/46 ,  D04H1/48 ,  D04H1/58 ,  D04H1/64 ,  D04H13/00 ,  H05K1/03 ,  B32B5/06 ,  B32B9/00 ,  B32B27/06 ,  B32B31/00

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D04H1/435 ,  D04H1/48 ,  D04H1/49 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31786 ,  Y10T442/689

Abstract: A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.

Abstract translation: PCT No.PCT / JP95 / 02328 Sec。 371日期：1996年7月15日 102（e）日期1996年7月15日PCT提交1995年11月15日PCT公布。 公开号WO96 / 15306 日期：1996年5月23日一种层叠体用基材，其为主要由液晶聚酯纤维构成的无纺布，并进行（1）缠结处理，（2）加热处理以赋予热固性树脂 和（3）表面改性处理，以及含有至少一种通过用热固性树脂浸渍基材而制备的预浸料并进行干燥的层压体。 本发明的基材具有低介电常数，轻质，吸湿性低，并且具有良好的热固性树脂浸渍性能和对热固性树脂的良好粘附性。

公开(公告)号：US5571609A

公开(公告)日：1996-11-05

申请号：US322890

申请日：1994-10-13

Applicant: Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/24 ,  C08K3/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K7/00 ,  C08K7/14 ,  C08L9/00 ,  C08L21/00 ,  C08L53/00 ,  C08L53/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569

Abstract: An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.

Abstract translation: 提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。 ％; 10〜40体积％的编织玻璃织物。 ％; 粒度为5至60体积％的陶瓷填料。 ％; 阻燃剂和过氧化物固化引发剂。 优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。 上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子） 更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

公开(公告)号：US5314742A

公开(公告)日：1994-05-24

申请号：US41417

申请日：1993-03-31

Applicant: Birol Kirayoglu ,  William J. Sillivan ,  Melvin P. Zussman

Inventor： Birol Kirayoglu ,  William J. Sillivan ,  Melvin P. Zussman

IPC: C08J5/24 ,  B32B27/04 ,  D04H1/42 ,  D21H13/26 ,  H05K1/03 ,  B33B17/00

CPC classification number: H05K1/0366 ,  B32B27/04 ,  D04H1/4342 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T442/2902 ,  Y10T442/656

Abstract: Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per .degree. C, a basis weight of from 0.8 to 4.0 oz/yd.sup.2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec.

Abstract translation: 用于印刷线路板应用的尺寸稳定的树脂浸渍层压板用43至57重量％的热膨胀系数小于10ppm /℃，基重为0.8-4.0盎司/ yd2的非织造芳族聚酰胺片材增强， 密度为0.5至1.0g / cc，Gurley Hill孔隙度小于10秒。

公开(公告)号：US5120384A

公开(公告)日：1992-06-09

申请号：US742080

申请日：1991-08-07

Applicant: Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

Inventor： Tokio Yoshimitsu ,  Kouji Sato ,  Yoshihide Sawa

IPC: B29C70/86 ,  B32B15/14 ,  B32B37/00 ,  B32B38/00 ,  H05K1/03 ,  H05K3/38 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC classification number: B32B37/0038 ,  B29C70/865 ,  B32B15/14 ,  H05K3/445 ,  H05K3/4641 ,  B29K2105/0854 ,  B29K2105/16 ,  B29L2031/3425 ,  B32B2311/12 ,  B32B2457/08 ,  B32B38/0012 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0293 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K2203/143 ,  H05K3/385 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer laminate provides in metal plates each forming a substrate apertures at positions where through holes are to be formed, fills the apertures with a synthetic resin including a first filler, and prepares prepregs to be disposed on both sides of each substrate by impregnating nonwoven fabric with a thermosetting synthetic resin containing a second filler. The metal plates forming the substrates are thereby allowed to be thicker for realizing larger capacity power supply with an improvement also in heat dissipation characteristics.

Abstract translation: 制造多层叠层体的方法提供在金属板中，每个在要形成通孔的位置处形成基底孔，在包含第一填料的合成树脂中填充孔，并制备待设置在每个基底两侧的预浸料 通过用含有第二填料的热固性合成树脂浸渍无纺布。 因此，形成基板的金属板可以更厚以实现更大容量的电源，并且散热特性也得到改善。

公开(公告)号：US5049435A

公开(公告)日：1991-09-17

申请号：US415959

申请日：1989-10-02

Applicant: Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

Inventor： Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

IPC: D04H1/42 ,  D04H1/64 ,  H05K1/03

CPC classification number: H05K1/0326 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/27 ,  Y10T428/31681 ,  Y10T428/31736 ,  Y10T442/2861 ,  Y10T442/656

Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2

公开(公告)号：US5047279A

公开(公告)日：1991-09-10

申请号：US433132

申请日：1989-11-08

Applicant: Yoshihiro Nasu ,  Kazuyuki Mitsuhashi

Inventor： Yoshihiro Nasu ,  Kazuyuki Mitsuhashi

IPC: B32B15/08 ,  B29B15/08 ,  B29C70/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: B29B15/08 ,  B29C70/08 ,  H05K3/0052 ,  H05K3/4626 ,  H05K3/4655 ,  B29C2793/0081 ,  B29K2105/0845 ,  B29K2105/0854 ,  B29K2309/08 ,  H05K1/0366 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K3/4611 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/24917

Abstract: A multilayer printed circuit board comprising a laminate of at least one glass fiber nonwoven cloth layer impregnated with thermosetting resin and glass fiber woven cloth layers impregnated with thermosetting resin, the laminate having a pair of V-cut grooves formed therein so that only the glass fiber nonwoven cloth layer remains uncut whereby the multilayer printed circuit board can be divided at the uncut glass fiber nonwoven cloth layer along the V-cut grooves into a plurality of printed circuit board portions which can be mounted having a practical size.

Abstract translation: 一种多层印刷电路板，其包括浸渍有热固性树脂的至少一层玻璃纤维无纺布层和浸渍有热固性树脂的玻璃纤维织布层的层压体，所述层压体具有形成在其中的一对V形切槽，使得仅玻璃纤维 非织造布层保持未切割，由此可以将多层印刷电路板沿未切割的玻璃纤维无纺布层沿着V形切割槽划分成多个能够安装具有实际尺寸的印刷电路板部分。

公开(公告)号：US4897301A

公开(公告)日：1990-01-30

申请号：US821304

申请日：1986-01-22

Applicant: Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

Inventor： Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

IPC: D04H1/42 ,  D04H1/64 ,  H05K1/03

CPC classification number: H05K1/0326 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/27 ,  Y10T428/31681 ,  Y10T428/31736 ,  Y10T442/2861 ,  Y10T442/656

Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2

Abstract translation: 一种柔性片材，其包含主要由浸渍有热和/或光可固化树脂的聚（芳香族酰胺）成分制成的无纺织物，其中所述无纺布满足以下条件：5g / m 2 单位面积重量<35g / m 2，0.15g / cm 3密度<0.8g / cm 3，具有良好的平衡性，例如优异的热尺寸稳定性，耐热性（耐焊接性），耐水性 ，耐溶剂性，电绝缘性能和机械性能，并且可用于制备柔性印刷电路板，以及其用于柔性覆金属层压板和柔性印刷电路板的用途。

公开(公告)号：US4876120A

公开(公告)日：1989-10-24

申请号：US40981

申请日：1987-04-21

Applicant: Robert E. Belke ,  Louis Zakraysek ,  Walter O. Pillar

Inventor： Robert E. Belke ,  Louis Zakraysek ,  Walter O. Pillar

IPC: B32B27/06 ,  C09K19/38 ,  H05K1/03 ,  H05K3/46

CPC classification number: B32B27/06 ,  C09K19/3823 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/036 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K3/4611 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/1077 ,  Y10T428/2481 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/.degree. C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.

Abstract translation: 公开了可用于制造多层印刷线路板（MLPWB）和层压板的改进的层压板。 这种改进的复合材料包含至少一层，其由选自聚（对亚苯基苯并噻唑），聚（对苯撑苯并异恶唑），聚（2,5-苯并噻唑），聚（2,5） 苯并恶唑）及其混合物。 目前优选的液晶聚合物包括聚（对亚苯基苯并噻唑）。 液晶聚合物的负膨胀系数和高弹性模量使得能够制造层压板和MLPWB，其具有大致为约0至15ppm /℃的约定热膨胀系数。由聚合物芯构成的MLPWB 利用本发明的优选液晶聚合物也可以使用层。

公开(公告)号：US4729921A

公开(公告)日：1988-03-08

申请号：US775577

申请日：1985-09-17

Applicant: Edward W. Tokarsky

Inventor： Edward W. Tokarsky

IPC: D21H13/26 ,  D01F6/60 ,  D21H20060101 ,  D21H17/46 ,  H05K20060101 ,  H05K1/03 ,  D21H5/12

CPC classification number: H05K1/0366 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/253 ,  Y10T428/268

Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

Abstract translation: 包含5至25重量％的粘合剂和选自对位芳族聚酰胺纸浆，对位芳族聚酰胺絮凝物及其混合物的对位芳族聚酰胺纤维的高密度对位芳族聚酰胺纸，压制成提供体积百分比的对位芳族聚酰胺纸 纸的体积百分比絮体的至少53减去0.13倍的芳纶纤维可用于制备具有低热膨胀系数的电路板基材。

公开(公告)号：US4578308A

公开(公告)日：1986-03-25

申请号：US647638

申请日：1984-09-06

Applicant: Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

Inventor： Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

IPC: B32B15/092 ,  B32B5/28 ,  B32B15/08 ,  D21H13/02 ,  D21H13/10 ,  D21H13/46 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K1/03 ,  B32B5/22 ,  B32B15/12

CPC classification number: H05K1/0366 ,  B32B15/08 ,  D21H13/46 ,  D21H13/02 ,  D21H13/10 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/903 ,  Y10S428/904 ,  Y10T428/31703 ,  Y10T442/616 ,  Y10T442/693

Abstract: A laminated board lined with thermally and electrically conductive material, which comprises:(a) a prepreg sheet formed of an alumina paper made from a mixture of alumina fibril, as the principal component, having a fiber diameter of 100 microns or smaller and a fiber length which is ten times or more as long as the fiber diameter, and microfibrillar organic fiber as a binding agent, and a thermosetting resin; and(b) an electrically conductive material in foil such as copper or aluminum bonded to said prepreg sheet.

Abstract translation: 一种衬有导热材料的层压板，包括：（a）由氧化铝纸制成的预浸薄板，该氧化铝纸由氧化铝原纤维作为主要成分的混合物制成，纤维直径为100微米或更小，纤维 长度为纤维直径的十倍以上的长度，作为粘合剂的微原纤维有机纤维，以及热固性树脂; 和（b）结合到所述预浸料片上的诸如铜或铝的箔中的导电材料。