公开(公告)号：US20140326483A1

公开(公告)日：2014-11-06

申请号：US13887807

申请日：2013-05-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Craig N. DeVarney

IPC: H05K3/04 ,  H05K1/00

CPC classification number: H05K3/045 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2203/025

Abstract: Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.

Abstract translation: 制造印刷电路板的方法，用于制造印刷电路板的装置以及用于印刷电路板的结构。 模具可以形成为包括对应于用于印刷电路板的多个导体的布局的多个特征（例如凹部）的装置。 由导电材料构成的片材可以变形以匹配模具的特征。 然后可以添加衬底以支撑片材，并且可以用机械工艺选择性地去除片材以限定印刷电路板的导体。

公开(公告)号：US20140304977A1

公开(公告)日：2014-10-16

申请号：US14356209

申请日：2012-08-31

Applicant: SHENZHEN SUNTAK MULTILAYER PCB CO., LTD.

Inventor： Jianyuan Song ,  Weihong Peng ,  Pingping Xie ,  Dong Liu

IPC: H05K3/00

CPC classification number: H05K3/00 ,  H05K1/0269 ,  H05K3/0017 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/12 ,  H05K3/188 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/425 ,  H05K3/428 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2203/0315 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49179

Abstract: A fabrication process of a stepped circuit board, comprises the following steps of: A) cutting a circuit board substrate, printing patterns on an inner layer thereof, performing etching, stepped groove grinding, washer milling, brownification and lamination processing on the inner layer, and then drilling holes on an outer layer thereof; B) depositing copper on the outer layer of the circuit board substrate with drilled holes, and then electroplating the entire circuit board substrate; C) performing pattern transfer; D) performing pattern copper plating on the circuit board substrate, and grinding the shape of a connecting piece (SET) on the circuit board substrate, and then etching the outer layer; E) printing a solder mask and texts in a silk-screen manner; F) depositing nickel immersion gold on the entire substrate, then printing characters in a silk-screen manner; and G) testing and inspecting the electrical performance and appearance of a finished board.

Abstract translation: 步进电路板的制造工艺包括以下步骤：A）切割电路板基板，在其内层上印刷图案，对内层进行蚀刻，阶梯槽研磨，垫片研磨，褐化和层压处理， 然后在其外层上钻孔; B）在钻孔的电路板基板的外层上沉积铜，然后电镀整个电路板基板; C）执行模式转移; D）在电路板基板上进行图案镀铜，并研磨电路板基板上的连接件（SET）的形状，然后蚀刻外层; E）以丝网印刷方式印刷焊接面罩和文字; F）在整个基板上沉积镍浸金，然后以丝网印刷方式印刷字符; 和G）测试和检查成品板的电气性能和外观。

公开(公告)号：US20140292192A1

公开(公告)日：2014-10-02

申请号：US14152928

申请日：2014-01-10

Applicant: Tomas RODINGER ,  Gimmy CHU ,  Christian YAN

Inventor： Tomas RODINGER ,  Gimmy CHU ,  Christian YAN

IPC: H05B33/08

CPC classification number: H05B33/0806 ,  F21K9/232 ,  F21V29/004 ,  F21V29/50 ,  F21Y2101/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0815 ,  H05K1/0278 ,  H05K2201/047 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/0228 ,  Y02B20/348 ,  H01L2924/00

Abstract: An LED bulb comprises a structural shell formed by folding a flat PCB into a three-dimensional polyhedron shape and a fitting for removably coupling the bulb to a light socket. The PCB comprises a plurality of LEDs, at least one LED mounted electronically on a plurality of faces of the polyhedron, and a driver circuit for driving each LED. The perimeter of the PCB is shaped to join adjacent faces. Each LED produces minimal excess heat, which is partially conducted by a metallic heat sink bridge to the PCB and dissipated to the air through the PCB and through a plurality of spaces in the shell.

Abstract translation: LED灯泡包括通过将平板PCB折叠成三维多面体形状而形成的结构壳体和用于将灯泡可拆卸地耦合到灯座的配件。 PCB包括多个LED，至少一个LED电子地安装在多面体的多个面上，以及用于驱动每个LED的驱动电路。 PCB的周边成形为连接相邻的面。 每个LED产生最小的过剩热量，其部分地由金属散热桥连接到PCB并且通过PCB消散到空气中并通过壳体中的多个空间散发。

公开(公告)号：US08816381B2

公开(公告)日：2014-08-26

申请号：US12912434

申请日：2010-10-26

Applicant: Nobuhiko Betsuda ,  Kozo Ogawa ,  Koyoshi Nishimura ,  Soichi Shibusawa

Inventor： Nobuhiko Betsuda ,  Kozo Ogawa ,  Koyoshi Nishimura ,  Soichi Shibusawa

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0066 ,  H05K3/242 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.

Abstract translation: 根据一个实施例，发光器件包括衬底，多个焊盘和多个发光元件。 焊盘具有导电性，并且布置在基板上。 通过电镀形成的反射层设置在每个焊盘的表面上。 发光元件安装在焊盘上。 凹陷部分留在基板上。 凹陷部分通过去除衬底上的图案而形成在衬底上，衬垫被电连接。

公开(公告)号：US08815333B2

公开(公告)日：2014-08-26

申请号：US13447326

申请日：2012-04-16

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: B05D5/12 ,  C23C18/16 ,  C23C18/31 ,  H05K3/24 ,  H01L21/288 ,  G03F7/09

CPC classification number: B05D5/12 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/31 ,  G03F7/091 ,  H01L21/288 ,  H05K3/048 ,  H05K3/107 ,  H05K3/244 ,  H05K2201/09036

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a dielectric layer; exposing the photoresist dielectric layer to define a predetermined position of the metal structure; removing the photoresist layer at the predetermined position to undercut an edge of the photoresist layer adjacent to the predetermined position by a horizontal distance of at least 0.1 μm between a top and a bottom of the edge; forming the metal structure at the predetermined position; and forming at least one top-cover metal layer to cover a top surface and two side surfaces of the metal structure. The present invention can form a cover metal layer covering the top surface and the two side surfaces by one single photomask.

Abstract translation: 公开了多层基板中的金属结构体的制造方法。 该制造方法包括以下步骤：在电介质层的表面上涂覆至少一层光致抗蚀剂层; 暴露所述光致抗蚀剂介电层以限定所述金属结构的预定位置; 在预定位置移除光致抗蚀剂层，以使邻近预定位置的光致抗蚀剂层的边缘在边缘的顶部和底部之间的水平距离为至少0.1μm; 在预定位置形成金属结构; 以及形成至少一个顶盖金属层以覆盖金属结构的顶表面和两个侧表面。 本发明可以通过单个光掩模形成覆盖顶表面和两个侧表面的覆盖金属层。

公开(公告)号：US20140220257A1

公开(公告)日：2014-08-07

申请号：US14247282

申请日：2014-04-08

Applicant: Infineon Technologies AG

Inventor： Joerg Ortner ,  Michael Sorger

IPC: H01L21/02

CPC classification number: B22D19/0072 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/02 ,  H01L21/311 ,  H01L21/486 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02371 ,  H01L2224/0346 ,  H01L2224/03472 ,  H01L2224/0502 ,  H01L2224/06182 ,  H01L2224/06188 ,  H01L2224/94 ,  H01L2924/181 ,  H05K1/02 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/308 ,  Y10S977/887 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench.

Abstract translation: 在根据实施例的处理衬底的方法中，沟槽可以形成在衬底中，压印材料可以至少沉积到沟槽中，沟槽中的压印材料可以使用压印装置压印，并且印模 器件可以从沟槽中移除。

公开(公告)号：US20140216784A1

公开(公告)日：2014-08-07

申请号：US13757913

申请日：2013-02-04

Applicant: Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

Inventor： Yongcai Wang ,  Paul Matthew Hoderlein ,  John Andrew Lebens ,  Hwei-Ling Yau ,  David Paul Trauernicht

IPC: H05K1/02

CPC classification number: C09D11/52 ,  C09D11/322 ,  H05K1/097 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2203/1361

Abstract: A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.

Abstract translation: 制造导电制品的方法包括提供具有一个或多个宽度小于12μm的微通道的表面的基底。 组合物提供在衬底上和在一个或多个微通道中。 组合物包括分散在水中的水和银纳米颗粒，组合物中银的重量百分数大于70％，组合物的粘度在10至10,000厘泊的范围内。 从基材的表面除去组合物。 提供在微通道中的组合物被干燥并转化成一个或多个导电微细线。

公开(公告)号：US20140144689A1

公开(公告)日：2014-05-29

申请号：US14064183

申请日：2013-10-27

Applicant: TPK Touch Solutions (Xiamen) Inc.

Inventor： Qiong Yuan ,  Jing Yu ,  Hongyan Lian ,  Pingping Huang

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0289 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/09036 ,  Y10T29/49155

Abstract: A touch-sensor structure includes a substrate having a plurality of grooves formed thereon. A plurality of first axial electrode strips are disposed in the grooves individually. A plurality of second axial electrode strips are disposed on the substrate and intersect with the first axial electrode strips. An insulating layer fills in the grooves and is disposed at the intersections of the first and second axial electrode strips. Furthermore, the manufacturing method of the touch-sensor structure is provided. The insulating layer is disposed in the grooves of the substrate without a protuberant height on the substrate. Therefore, it can overcome a breakage issue in conventional conductive bridges.

Abstract translation: 触摸传感器结构包括其上形成有多个凹槽的基板。 多个第一轴向电极条分别设置在槽中。 多个第二轴向电极条设置在基板上并与第一轴向电极条相交。 绝缘层填充在凹槽中并且设置在第一和第二轴向电极条的相交处。 此外，提供了触摸传感器结构的制造方法。 绝缘层设置在基板的凹槽中，而在基板上没有突出的高度。 因此，它可以克服常规导电桥中的断裂问题。

公开(公告)号：US08735739B2

公开(公告)日：2014-05-27

申请号：US13249507

申请日：2011-09-30

Applicant: Teruyuki Ishihara ,  Hidetoshi Noguchi

Inventor： Teruyuki Ishihara ,  Hidetoshi Noguchi

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K3/46 ,  H05K1/183 ,  H05K3/3452 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.

Abstract translation: 具有绝缘层的布线板和形成在绝缘层上并包括绝缘层的堆积结构。 绝缘层和积层结构形成板结构，其中形成在绝缘层相对侧上的积层结构的表面上具有开口的空腔部分。 空腔部分延伸穿过积聚结构中的一个或多个绝缘层，并且具有沿着空腔部分的壁表面形成在空腔部分的底表面上的凹槽部分。 由绝缘层和积层结构构成的板结构具有在空腔部的底面上形成有比凹槽部更远离空腔部的壁面的位置的垫。

公开(公告)号：US08729426B2

公开(公告)日：2014-05-20

申请号：US13139136

申请日：2009-05-27

Applicant: Philip Thomas Rumsby

Inventor： Philip Thomas Rumsby

IPC: B23K26/06 ,  B23K26/067 ,  H01K3/10 ,  H05K3/06

CPC classification number: H05K3/0032 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/364 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2203/108 ,  Y10T29/49155

Abstract: The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern.

Abstract translation: 该方法使用普通的光学系统，并且通过不同的激光工艺在聚合物衬底中顺序地产生不同尺寸的结构。 一种方法使用紧密聚焦在基底表面上的激光束，并用于通过半连续直写式光束移动来产生细槽结构。 第二种方法使用第二激光束，其用于在衬底表面上形成更大尺寸的图像，并且用于在步骤和钻孔模式中在衬底中产生盲垫和接触孔。 第三可选工艺使用以直接写入模式操作的第二激光束，以在更大的连续区域上以网格型图案去除衬底层。