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    Low cost charger connections manufactured from conductive loaded resin-based material
    112.
    发明申请
    Low cost charger connections manufactured from conductive loaded resin-based material 审中-公开
    由导电负载的树脂基材料制成的低成本充电器连接

    公开(公告)号：US20050162133A1

    公开(公告)日：2005-07-28

    申请号：US11089292

    申请日：2005-03-24

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01M2/00

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0005 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Battery charger terminals formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non- metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

    Abstract translation: 电池充电器端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

    Method for producing metal plated plastic article
    116.
    发明申请
    Method for producing metal plated plastic article 审中-公开
    金属电镀塑料制品的制造方法

    公开(公告)号：US20040197478A1

    公开(公告)日：2004-10-07

    申请号：US10484492

    申请日：2004-01-22

    Inventor： Tatsuaki Takagi

    IPC: B05D003/10 ,  C25D005/56

    CPC classification number: C23C18/22 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/025

    Abstract: The invention provides a process for producing a plated plastic article, which requires no chemical etching and can ensure high quality of plating without addition of a large amount of any inorganic filler in order to form a physically rough surface for an effective plating adhesion. After molding thermoplastic materials having a shear strength of 50 MPa or more, the surfaces of the molded articles are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz (average roughness of ten points) is 10 nullm or more, and subsequently addition of catalyst, activation treatment, and electroless plating are carried out.

    Abstract translation: 本发明提供了一种生产电镀塑料制品的方法，其不需要化学蚀刻，并且可以确保高质量的镀层，而不加入大量的任何无机填料以形成物理上粗糙的表面用于有效的电镀粘合。 剪切强度为50MPa以上的热塑性材料成型后，用铝磨料进行珩磨处理，使表面粗糙度Rz（10点平均粗糙度）为10μm以上， 随后加入催化剂，活化处理和无电镀。

    Low cost lighting circuits manufactured from conductive loaded resin-based materials
    117.
    发明申请
    Low cost lighting circuits manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本照明电路

    公开(公告)号：US20040189170A1

    公开(公告)日：2004-09-30

    申请号：US10819809

    申请日：2004-04-07

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01J001/88

    CPC classification number: G06K19/07749 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  C09K11/08 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/095 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based lighting devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the lighting devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 照明装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基照明装置可以使用诸如注射成型压缩成型或挤出的方法来形成。 用于形成照明装置的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials
    118.
    发明申请
    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials 失效
    使用导电负载树脂基材料的电子电路封装或收发器中的低成本天线和电磁（EMF）吸收

    公开(公告)号：US20040160377A1

    公开(公告)日：2004-08-19

    申请号：US10780214

    申请日：2004-02-17

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01Q013/10 ,  H01Q001/42

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01B1/22 ,  H01Q1/1271 ,  H01Q1/364 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Low cost antennas and electromagnetic absorbing parts formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductive fibers, conductive powders, or in combination thereof in a resin base host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination of conductor fibers and conductor powders to the weight of the base resin host is between about 0.20 and 0.40. The conductive fibers or conductive powders can be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna, ground planes, or shielding packages fabricated by conventional means of metal can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements, EMF absorbing elements, or ground planes can be in the form of a thin flexible material, which can be readily cut to the desired shape.

    Abstract translation: 由导电负载的树脂基材料形成的低成本天线和电磁吸收部件。 导电负载的树脂基材料包括导电纤维，导电粉末或其组合在树脂基质主体中，其中导体纤维，导体粉末或导体纤维和导体粉末的组合的重量比与 基础树脂主体在约0.20和0.40之间。 导电纤维或导电粉末可以是不锈钢，镍，铜，银，碳，石墨，电镀纤维或颗粒等。 可以使用诸如注射成型或挤出的方法来形成天线元件。 实际上，任何通过常规金属制造的天线，接地平面或屏蔽封装均可使用导电负载的树脂基材料制造。 用于形成天线元件，EMF吸收元件或接地平面的导电负载树脂基材料可以是薄的柔性材料的形式，其可以容易地切割成所需的形状。

    Method of making of electronic parts mounting board
    119.
    发明授权
    Method of making of electronic parts mounting board 失效
    电子零件安装板的制作方法

    公开(公告)号：US06751860B2

    公开(公告)日：2004-06-22

    申请号：US10229288

    申请日：2002-08-28

    Applicant: Yuichi Watanabe ,  Hisashi Ohtsuki

    Inventor： Yuichi Watanabe ,  Hisashi Ohtsuki

    IPC: H05K300

    CPC classification number: H05K3/041 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09118 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153

    Abstract: The present invention provides a method of making an electronic parts mounting board, comprising the steps of: punching a conductive sheet to form a circuit pattern portion and through-holes in which electronic parts are to be mounted by use of a progressive die device while at the same time partially folding said circuit pattern portion to form connection terminal portions by use of said same progressive die device; and molding an insulative resin over the whole opposite sides of said circuit pattern portion and the base ends of the terminal portions including the folded parts thereof to form an integral covering portion having openings for electrically connecting said circuit pattern portion to electronic parts to be mounted thereon.

    Abstract translation: 本发明提供一种制造电子部件安装板的方法，包括以下步骤：在导电片上冲压导电片以形成电路图案部分和通过使用渐进式模具装置安装电子部件的通孔，同时在 同时部分地折叠所述电路图形部分以通过使用所述相同的渐进式模具装置形成连接端子部分; 以及在所述电路图形部分的整个相对侧和包括其折叠部分的端子部分的基端部上模制绝缘树脂以形成具有用于将所述电路图案部分电连接到要安装在其上的电子部件的开口的整体覆盖部分。

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