Modified polyacetals for decorative applications
    1.
    发明申请
    Modified polyacetals for decorative applications 审中-公开
    改性聚缩醛用于装饰应用

    公开(公告)号:US20040228971A1

    公开(公告)日:2004-11-18

    申请号:US10816421

    申请日:2004-04-01

    Abstract: A painted polyacetal article comprises a polyacetal substrate comprising 90-99.5 wt % polyacetal and 0.5-10 wt % of semicrystalline or amorphous thermoplastic non-polyacetal resin of molecular weight 1,000-50,000; and a paint applied to the polyacetal substrate from a solvent-borne, water-borne or powder 1K paint system onto a surface of the polyacetal substrate pretreated to enhance exposure of said semicrystalline or amorphous thermoplastic non-polyacetal resin of the substrate to the applied paint. The paint is a thermoplastic or partly thermoplastic non-thermosetting paint. A layer of thermosetting paint or varnish can be applied over the thermoplastic paint. The painted polyacetal article has improved paint adhesion and good retained physico-mechanical properties.

    Abstract translation: 涂漆的聚缩醛制品包括聚缩醛基材,其包含90-99.5wt%聚缩醛和0.5-10wt%分子量为1,000-50,000的半结晶或无定形热塑性非聚缩醛树脂; 以及从溶剂型水性或粉末状1K涂料体系涂覆在聚缩醛基材表面上预处理以增强基材的所述半结晶或无定形热塑性非缩醛树脂暴露于所涂涂料的表面上的油漆 。 涂料是热塑性或部分热塑性非热固性涂料。 可以在热塑性涂料上涂一层热固性涂料或清漆。 涂漆的聚缩醛制品具有改善的涂料粘附性和良好的保留的物理机械性能。

    Formation of functional coating and functional coated article
    3.
    发明申请
    Formation of functional coating and functional coated article 审中-公开
    功能性涂层和功能涂层制品的形成

    公开(公告)号:US20040214015A1

    公开(公告)日:2004-10-28

    申请号:US10832292

    申请日:2004-04-27

    Abstract: A hydrosilyl radical-bearing organosilicon compound is applied to a substrate which has been coated with an aliphatic unsaturated hydrocarbon radical-bearing material, whereupon reaction takes place between the coating of aliphatic unsaturated hydrocarbon radical-bearing material and the hydrosilyl radical-bearing organosilicon compound. A fully durable functional coating is formed on the substrate surface. The method can modify surfaces of plastics, metals, ceramics, pottery and glass substrates for imparting functions such as water repellent, hydrophilic, anti-staining or electroconductive properties thereto.

    Abstract translation: 将具有含硅烷基自由基的有机硅化合物施加到已经涂覆有脂肪族不饱和烃自由基材料的基材上,随后在具有脂肪族不饱和烃基的材料的涂层和含有支链氢原子的有机硅化合物之间发生反应。 在基板表面上形成完全耐用的功能性涂层。 该方法可以改变塑料,金属,陶瓷,陶瓷和玻璃基材的表面,以赋予其防水性,亲水性,抗污染性或导电性等功能。

    EFAB methods and apparatus including spray metal or powder coating processes
    4.
    发明申请
    EFAB methods and apparatus including spray metal or powder coating processes 审中-公开
    EFAB方法和设备,包括喷涂金属或粉末涂层工艺

    公开(公告)号:US20040146650A1

    公开(公告)日:2004-07-29

    申请号:US10697597

    申请日:2003-10-29

    CPC classification number: C23C4/02 C25D1/00 C25D1/003

    Abstract: Various embodiments of the invention present techniques for forming structures via a combined electrochemical fabrication process and a thermal spraying process or powder deposition processes. In a first set of embodiments, selective deposition occurs via masking processes (e.g. a contact masking process or adhered mask process) and thermal spraying or powder deposition is used in blanket deposition processes to fill in voids left by selective deposition processes. In a second set of embodiments, after selective deposition of a first material, a second material is blanket deposited to fill in the voids, the two depositions are planarized to a common level and then a portion of the first or second materials is removed (e.g. by etching) and a third material is sprayed into the voids left by the etching operation. In both embodiments the resulting depositions are planarized to a desired layer thickness in preparation for adding additional layers.

    Abstract translation: 本发明的各种实施例提出了通过组合的电化学制造工艺和热喷涂工艺或粉末沉积工艺形成结构的技术。 在第一组实施例中,通过掩模工艺(例如接触掩模工艺或粘附的掩模工艺)进行选择性沉积,并且在覆盖沉积工艺中使用热喷涂或粉末沉积来填充通过选择性沉积工艺留下的空隙。 在第二组实施例中,在选择性沉积第一材料之后,第二材料被覆盖沉积以填充空隙,将两个沉积物平坦化到共同的水平,然后去除第一或第二材料的一部分(例如 通过蚀刻),并且通过蚀刻操作将第三材料喷射到留下的空隙中。 在两个实施方案中,将所得沉积物平坦化至所需的层厚度,以准备添加另外的层。

    Aqueous alkaline zincate solutions and methods

    公开(公告)号:US20040067314A1

    公开(公告)日:2004-04-08

    申请号:US10265864

    申请日:2002-10-07

    CPC classification number: C25D5/14 C23C18/1651 C23C18/1653 C23C18/52 C23C18/54

    Abstract: The present invention provides an improved aqueous alkaline zincate solution comprising hydroxide ions, zinc ions, nickel ions and/or cobalt iron ions, copper ions, and at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms provided said nitrogen atoms are not present in an aliphatic amine or hydroxylamine. The present invention also relates to methods for depositing zincate coatings on aluminum and aluminum alloys comprising applying an immersion zincate coating on an aluminum or aluminum alloy substrates, optionally followed by plating the zincate coated aluminum or aluminum alloy substrate using an electroless or electrolytic metal plating solution.

    Process for applying a coating to untreated metal substrates
    7.
    发明申请
    Process for applying a coating to untreated metal substrates 审中-公开
    向未处理的金属基材施加涂层的方法

    公开(公告)号:US20040067313A1

    公开(公告)日:2004-04-08

    申请号:US10263517

    申请日:2002-10-03

    Inventor: Brian T. Hauser

    CPC classification number: B05D7/51 B05D3/102 B05D7/14 C23C22/34

    Abstract: An improved process for applying a coating by means other than electrodeposition to an untreated ferrous metal substrate is disclosed. The substrate need not be phosphated prior to treatment. The process includes contacting the substrate surface with a Group IIIB and/or IVB metal-containing compound in a medium that is essentially free of accelerators, phosphate, zinc, and polymeric material, and coating the substrate by non-electrolytic means. This composition is then cured by conventional means. Substrates treated by the process of the present invention demonstrate excellent corrosion resistance and are also disclosed herein.

    Abstract translation: 公开了一种通过电沉积方式将涂层施加到未处理的黑色金属基底上的改进方法。 在处理之前,基板不需要磷化。 该方法包括在基本上不含促进剂,磷酸盐,锌和聚合物材料的介质中将基底表面与含IIIB和/或IVB族金属的化合物接触,并通过非电解方式涂覆基底。 然后通过常规方法固化该组合物。 通过本发明的方法处理的基材表现出优异的耐腐蚀性,并且也在本文中公开。

    Method to improve adhesion of primers to substrates
    8.
    发明申请
    Method to improve adhesion of primers to substrates 失效
    改善底漆对底物粘附性的方法

    公开(公告)号:US20040037965A1

    公开(公告)日:2004-02-26

    申请号:US10227144

    申请日:2002-08-23

    Inventor: Keith L. Salter

    CPC classification number: C23C18/1241

    Abstract: A method comprising: providing a composition comprising a zirconium alkoxide and an acid, wherein the composition is not provided in a coating composition; and applying the composition to a substrate.

    Abstract translation: 一种方法,包括:提供包含烷氧基锆和酸的组合物,其中所述组合物不在涂料组合物中; 并将组合物施加到基底上。

    Process for deposition of metal on a surface
    9.
    发明申请
    Process for deposition of metal on a surface 失效
    在表面上沉积金属的工艺

    公开(公告)号:US20040022957A1

    公开(公告)日:2004-02-05

    申请号:US10332922

    申请日:2003-07-07

    CPC classification number: C23C18/42 C23C18/1669 C23C18/31 H05K3/187

    Abstract: The invention relates to a process for depositing a metal on a material. The process comprises the steps of: immersing the material in a deposition solution comprising the metal; inducing a material vibration in the deposition solution having a frequency corresponding to a resonance frequency of the material; inducing a solution vibration in the deposition solution in a direction non-parallel to the material vibration, said solution vibration having a frequency corresponding to the a resonance frequency of the deposition solution, whereby said metal is deposited onto the material. This process results in deposition of metal from the plating bath on the material in a controlled and substantially uniform thickness.

    Abstract translation: 本发明涉及在材料上沉积金属的方法。 该方法包括以下步骤:将材料浸入包括金属的沉积溶液中; 在沉积溶液中引起具有对应于材料的共振频率的频率的材料振动; 在与所述材料振动不平行的方向上引起所述沉积溶液中的溶液振动,所述溶液振动具有与所述沉积溶液的共振频率相对应的频率,由此所述金属沉积到所述材料上。 该过程导致金属从电镀浴中以受控且基本均匀的厚度沉积在材料上。

    PWB manufacture
    10.
    发明申请
    PWB manufacture 有权
    PWB制造

    公开(公告)号:US20040022934A1

    公开(公告)日:2004-02-05

    申请号:US10408422

    申请日:2003-04-07

    Abstract: A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and composition for depositing a final finish that is even and bright. The present invention is particularly suitable for the manufacture of printed circuit boards containing one or more electroless nickel-immersion gold layers.

    Abstract translation: 提供一种用于制造印刷线路板的方法和组合物,其减少或消除了将非电解镍沉积在未设计为金属镀覆的通孔中的问题。 本发明还提供了一种沉积最终光洁度的方法和组合物,其是均匀且明亮的。 本发明特别适用于制造含有一种或多种无电镀镍浸镀金层的印刷电路板。

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