公开(公告)号：US20140003016A1

公开(公告)日：2014-01-02

申请号：US13928641

申请日：2013-06-27

Applicant: AEES, INC.

Inventor： Patrick McCabe ,  Sandra Nedzlek

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01M2/206 ,  H01M2/34 ,  H01M10/4257 ,  H01M2010/4271 ,  H05K1/0263 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2201/10272 ,  H05K2201/1034

Abstract: A battery monitoring system for monitoring a state of a battery assembly that includes a connection assembly for electrically coupling a controller to the battery assembly. The connection assembly includes a circuit board having an edge extending from a top surface to a bottom surface. The connection assembly also includes a plurality of terminals each having a first end electrically coupled to the circuit board and a second end electrically coupled to the battery assembly with the second end extending beyond the edge of the circuit board with the plurality of terminals each being resiliently biased against the battery assembly for accommodating relative movement between the battery assembly and said circuit board.

Abstract translation: 一种用于监测电池组件的状态的电池监视系统，其包括用于将控制器电耦合到电池组件的连接组件。 连接组件包括具有从顶表面延伸到底表面的边缘的电路板。 连接组件还包括多个端子，每个端子具有电耦合到电路板的第一端和电耦合到电池组件的第二端，第二端延伸超过电路板的边缘，多个端子各自弹性地 偏压电池组件以容纳电池组件和所述电路板之间的相对运动。

公开(公告)号：US20130286594A1

公开(公告)日：2013-10-31

申请号：US13882952

申请日：2011-10-12

Applicant: Nobuhisa Onai ,  Masami Motegi

Inventor： Nobuhisa Onai ,  Masami Motegi

IPC: H05K13/04 ,  H05K1/02

CPC classification number: H05K13/0465 ,  H01L21/563 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0298 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10969 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2076

Abstract: Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

Abstract translation: 提供：通过抑制焊料凹陷的发生，提高焊接部的连接可靠性的电路装置; 以及电路装置的制造方法。 在本发明的电路装置的制造方法中，首先在焊盘（18A）的上表面上形成有彼此分离的多个焊料（19），芯片部件（14B）和 同时固定晶体管（14C）。 之后，使用注射器（30）将焊膏（31）供给到焊盘（18A）的上表面，将散热器（14D）安装在焊膏（31）的顶部，并且由 回流过程。 由于焊料（19）离散地布置在焊盘（18A）的上表面上，所以在本发明中几乎没有焊接（19）的风险。

公开(公告)号：US20130141878A1

公开(公告)日：2013-06-06

申请号：US13692556

申请日：2012-12-03

Applicant: Hongyang Wu ,  Bin Wang ,  Liping Sun ,  Jianping Ying

Inventor： Hongyang Wu ,  Bin Wang ,  Liping Sun ,  Jianping Ying

IPC: H01F27/28 ,  H05K1/18

CPC classification number: H01F27/2852 ,  H01F27/2866 ,  H01F2027/065 ,  H05K1/0263 ,  H05K1/165 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/086 ,  H05K2201/10166 ,  H05K2201/1034

Abstract: The present application discloses a transformer conductive structure, which comprises a primary coiling, a printed circuit board and a secondary coiling unit comprising a plurality of conductive sheets; wherein each conductive sheet comprises an annular body and an output terminal arranged at the edge of the annular body and protruded to the outside; the annular bodies of the conductive sheets and the primary coiling are staggered arrangement together; and the output terminal of the conductive sheet directly clamps on the printed circuit board. The present application further discloses a transformer, which can effectively reduces the output path of the transformer, the AC and DC loss and the volume of the transformer device, so as to increase the power density and efficiency of power supply.

Abstract translation: 本申请公开了一种变压器导电结构，其包括初级绕线，印刷电路板和包括多个导电片的次级绕组单元; 其中每个导电片包括环形体和布置在环形体的边缘处并突出到外部的输出端; 导电片和主卷轴的环形体交错布置在一起; 并且导电片的输出端直接夹在印刷电路板上。 本申请还公开了一种变压器，其可以有效地减小变压器的输出路径，交流和直流损耗以及变压器装置的体积，从而提高功率密度和供电效率。

公开(公告)号：US20130121652A1

公开(公告)日：2013-05-16

申请号：US13673225

申请日：2012-11-09

Applicant: Honda Tsushin Kogyo Co., Ltd.

Inventor： Teruyuki Taniguchi ,  Yuushi Miki ,  Koichiro Yoshimura ,  Shigehiro Oi

IPC: G02B6/42 ,  H05K3/30

CPC classification number: G02B6/42 ,  G02B6/4204 ,  G02B6/422 ,  G02B6/428 ,  H05K1/141 ,  H05K1/18 ,  H05K3/30 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10121 ,  H05K2201/1034 ,  Y10T29/4913

Abstract: An optical device board 2 is set to be a printed circuit board in which an optical device 6 is bonded into a predetermined position of a printed wiring board 5. The optical device board 2 is bonded to a base board 3 provided with a plurality of wiring terminals 7. A lens barrel 4 is bonded to the optical device board 2. The optical device 6 is bonded into a position calculated from an actual measured dimension of the printed wiring board 5, and the calculated position is held and positioning is carried out in such a manner that a central axis of the lens barrel 4 is coincident with the calculated position when the lens barrel 4 is to be bonded to the optical device board 2.

Abstract translation: 光学器件基板2被设置为印刷电路板，其中将光学器件6接合到印刷线路板5的预定位置。光学器件基板2接合到设置有多个布线的基板3 端子7.镜筒4接合到光学装置基板2上。光学装置6被结合到根据印刷电路板5的实际测量尺寸计算的位置，并且保持所计算的位置并定位在 使透镜筒4的中心轴与透镜镜筒4要结合到光学装置基板2时的计算位置一致。

公开(公告)号：US20130068978A1

公开(公告)日：2013-03-21

申请号：US13639179

申请日：2011-04-07

Applicant: Daisuke Hiranuma ,  Michimori Watanabe

Inventor： Daisuke Hiranuma ,  Michimori Watanabe

IPC: F16K31/02 ,  G01B7/30

CPC classification number: F02D11/106 ,  F02D2200/0404 ,  G01B7/30 ,  G01D5/2053 ,  G01D5/2225 ,  G01D5/2451 ,  H05K3/202 ,  H05K3/284 ,  H05K2201/09118 ,  H05K2201/1034 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An inductive non-contact rotation angle sensor used in a motor-driven throttle valve unit is such that a circuit substrate to which a stationary conductor and an electronic circuit are attached is secured to a resin cover without the use of an adhesive. A TPS substrate as the circuit substrate and an electric conductor are electrically connected to each other by pressure welding (press fit). The circuit substrate and the electric conductor can be formed of the same molding resin as a single molded body. Thus, it is not necessary to prepare another metallic conductor (a bonding wire) and also welding and soldering are eliminated. Further, since the TPS substrate is covered by the same material as cover resin, a process of bonding the substrate to the cover can be omitted, which allows for a reduction in manufacturing cost.

Abstract translation: 在电动节气门单元中使用的电感式非接触式旋转角度传感器使得固定导体和电子电路所连接的电路基板不用粘合剂固定在树脂盖上。 作为电路基板的TPS基板和电导体通过压焊（压配合）彼此电连接。 电路基板和电导体可以由与单个成型体相同的成型树脂形成。 因此，不必制备另一种金属导体（接合线），并且消除了焊接和焊接。 此外，由于TPS基板被与树脂相同的材料覆盖，所以可以省略将基板接合到盖的工艺，这允许降低制造成本。

公开(公告)号：US20130005163A1

公开(公告)日：2013-01-03

申请号：US13579687

申请日：2011-03-03

Applicant: Dieter Holste ,  Ulrich Rosemeyer

Inventor： Dieter Holste ,  Ulrich Rosemeyer

IPC: H01R12/00

CPC classification number: H05K3/3405 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/1034 ,  H05K2201/2072 ,  H05K2203/0455 ,  H05K2203/1178 ,  Y02P70/611

Abstract: The invention relates to an electrical contact arrangement of a spring contact element (10) on a printed circuit board (12) with a soldering area (16) arranged on a surface of the printed circuit board (12) and a planar contact area (18) arranged on the soldering area (16), wherein the spring contact element (10) can be arranged on the contact area (18).

Abstract translation: 本发明涉及一种弹性接触元件（10）在印刷电路板（12）上的电接触布置，其中布置在印刷电路板（12）的表面上的焊接区域（16）和平面接触区域（18） ）布置在焊接区域（16）上，其中弹簧接触元件（10）可以布置在接触区域（18）上。

公开(公告)号：US20130003322A1

公开(公告)日：2013-01-03

申请号：US13407612

申请日：2012-02-28

Applicant: Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

Inventor： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC: H05K1/00

CPC classification number: H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

Abstract translation: 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US08329493B2

公开(公告)日：2012-12-11

申请号：US12728814

申请日：2010-03-22

Applicant: Stephen Mascaro ,  Debra Mascaro ,  Jumana Abu-Khalaf ,  Jungwoo Park

Inventor： Stephen Mascaro ,  Debra Mascaro ,  Jumana Abu-Khalaf ,  Jungwoo Park

IPC: H01L21/00

CPC classification number: H05K1/0283 ,  A61B5/0261 ,  A61B5/0295 ,  A61B5/14552 ,  B29C45/14639 ,  H05K1/183 ,  H05K3/143 ,  H05K3/284 ,  H05K3/3463 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/2072 ,  H05K2203/0271 ,  H05K2203/128 ,  H05K2203/1327

Abstract: A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and conductors being bendable together about two orthogonal axes. The stretchable circuit also includes a stretchable sensor layer attached to the base substrate with a cavity formed therein which has a contact point exposing one of the plurality of stretchable conductors. The stretchable electronic circuit further includes a surface mount device (SMD) package with a conductor contact protrusion installed into the cavity, and wherein a substantially constant electrical connection is established between the conductor contact protrusion and the stretchable conductor at the contact point by tensile forces interacting between the stretchable base substrate and the stretchable sensor layer.

Abstract translation: 一种可拉伸电子电路，其包括具有形成在其表面上的多个可拉伸导体的可拉伸基底基板，所述可拉伸基底基板和导体可绕两个正交轴线弯曲在一起。 可拉伸电路还包括附接到基底基底的可拉伸传感器层，其中形成有腔，其具有暴露多个可拉伸导体之一的接触点。 可伸缩电子电路还包括一个表面安装器件（SMD）封装，其中导体接触突起安装在空腔中，并且其中通过张力相互作用在导体接触突起与接触点处的可拉伸导体之间建立了基本恒定的电连接 在可拉伸基底基板和可拉伸传感器层之间。

公开(公告)号：US08237532B2

公开(公告)日：2012-08-07

申请号：US12617002

申请日：2009-11-12

Applicant: Ryuji Takada

Inventor： Ryuji Takada

IPC: H01F5/00 ,  H01F27/02 ,  H01F27/28

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/40 ,  H01F2027/2809 ,  H01F2027/2819 ,  H01L2924/0002 ,  H02M3/28 ,  H05K1/165 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/086 ,  H05K2201/09909 ,  H05K2201/1003 ,  H05K2201/1034 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

Abstract: An electronic circuit device 1 arranged with a first substrate 11, a core 33 (magnetic body) mounted on the first substrate 11, a resin sealing body 17 which covers the first substrate 11 and the core 33, and a curable type stress relieving material 35 which reduces stress applied to the core 33 by the resin sealing body 17 is arranged within the resin sealing body 33 from the side surface periphery of the core 33 across to the first substrate 11.

Abstract translation: 布置有第一基板11，安装在第一基板11上的芯33（磁体），覆盖第一基板11和芯33的树脂密封体17和可固化型应力释放材料35的电子电路装置1 通过树脂密封体17减少施加到芯33的应力，从树脂密封体33的芯部33的侧面周向配置到第一基板11。

公开(公告)号：US08203848B2

公开(公告)日：2012-06-19

申请号：US12065001

申请日：2006-08-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto

IPC: H01R9/00

CPC classification number: H01L23/49861 ,  H01L23/3672 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/1053 ,  H05K2201/10969 ,  Y10T29/49139 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation.

Abstract translation: 提供了其中并入产生大量热量的功率元件的电路装置的简化结构。 根据本发明的电路装置包括：表面被绝缘层覆盖的电路板; 形成在所述绝缘层的表面上的导电图案; 电连接到所述导电图案的电路元件; 以及连接到由导电图案形成的焊盘的引线。 此外，功率元件固定到由引线的一部分形成的接地部的顶表面。 因此，陆部用作散热器，从而有助于散热。