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    Coating apparatus and coating method
    111.
    发明申请
    Coating apparatus and coating method 审中-公开
    涂布设备和涂布方法

    公开(公告)号：US20030170391A1

    公开(公告)日：2003-09-11

    申请号：US10378921

    申请日：2003-03-05

    Applicant: FUJI PHOTO FILM CO., LTD.

    Inventor： Go Nishino ,  Toru Onogawa

    IPC: B05D003/12 ,  B05D003/10 ,  B05D001/28

    CPC classification number: B05C1/0839 ,  B05C1/0813 ,  B05C1/0826 ,  B05C1/0856 ,  B05C1/12 ,  B05C3/18 ,  B05C11/025

    Abstract: It is an object of the present invention to provide a coating apparatus and a coating method that can effectively prevent thick coating and the like in a bar coater having a coating bar and a fulcrum supporting the coating bar from the below. The coating apparatus comprising a coating liquid-adhering device for adhering the coating liquid across an entire width of one surface of a continuously travelling belt-shaped body; a coating thickness-adjusting device located downstream from the coating liquid-adhering device with respect to the travelling direction of the belt-shaped body, and adjusting a thickness of a layer of the coating liquid adhered to the belt-shaped body by the coating liquid-adhering device into a predetermined thickness; and a drying-preventative device for preventing the coating liquid at the coating thickness-adjusting device from drying.

    Abstract translation: 本发明的目的是提供一种可以有效地防止在具有涂布条的棒涂机和从下面支撑涂布杆的支点的厚涂层等的涂布装置和涂布方法。 该涂布装置包括涂布液粘附装置，用于将涂布液粘合在连续行进的带状体的一个表面的整个宽度上; 相对于带状体的行进方向位于涂布液粘附装置的下游的涂布厚度调整装置，通过涂布液调整粘附于带状体的涂布液的层的厚度 加载装置成预定厚度; 以及用于防止涂层厚度调节装置上的涂布液干燥的防干燥装置。

    Water soluble or water dispersible fluorochemical silanes for rendering substrates oil and water repellent
    112.
    发明申请
    Water soluble or water dispersible fluorochemical silanes for rendering substrates oil and water repellent 失效
    水溶性或水分散性含氟硅烷，用于使基质油和憎水剂

    公开(公告)号：US20030168783A1

    公开(公告)日：2003-09-11

    申请号：US10053001

    申请日：2002-01-17

    Inventor： Rudolf J. Dams

    IPC: B05D003/10 ,  B05D003/04 ,  C07F007/04 ,  C07F007/12 ,  C04B033/34

    CPC classification number: C04B41/4933 ,  B05D5/083 ,  C03C17/30 ,  C04B41/009 ,  C04B41/84 ,  C07F7/1804 ,  C04B41/502 ,  C04B33/00

    Abstract: A water soluble or water dispersible fluorochemical silane represented by the general formula: X-MfnMhmMar-Gnullnull(I) wherein X represents the residue of an initiator or hydrogen; Mf represents units derived from one or more fluorinated monomer; Mh represents units derived from one or more non-fluorinated monomer; Ma represents units having a silyl group represented by the formula: 1 wherein each of Y4, Y5 and Y6 independently represents an alkyl group, an aryl group or a hydrolyzable group; G is a monovalent organic group comprising the residue of a chain transfer agent; n represents a value of 1 to 100; m represents a value of 0 to 100; and r represents a value of 0 to 100; and nnullmnullr is at least 2; with the proviso that at least one of the following conditions is fulfilled: (a) G contains a silyl group of the formula: 2 wherein Y1, Y2 and Y3 each independently represents an alkyl group, an aryl group or a hydrolyzable group and at least one of Y1, Y2 and Y3 represents a hydrolyzable water solubilising group; or (b) r is at least 1 and at least one of Y4, Y5 and Y6 represents a hydrolyzable water solubilizing group.

    Abstract translation: 由通式X-MfnMhmMar-G（I）表示的水溶性或水分散性含氟硅烷，其中X表示引发剂或氢的残基; Mf表示衍生自一种或多种氟化单体的单元; Mh表示衍生自一种或多种非氟化单体的单元; Ma表示具有由下式表示的甲硅烷基的单元：其中Y4，Y5和Y6各自独立地表示烷基，芳基或可水解基团; G是包含链转移剂残基的一价有机基团; n表示1〜100的数值。 m表示0〜100的值。 r表示0〜100的值。 n + m + r为2以上; 条件是满足以下条件中的至少一个：（a）G包含下式的甲硅烷基：其中Y 1，Y 2和Y 3各自独立地表示烷基，芳基或可水解基团，并且至少一个 Y1，Y2和Y3表示可水解水增溶基团; 或（b）r为至少1，Y4，Y5和Y6中的至少一个表示可水解的水增溶基团。

    Plated articles and methods for producing the plated articles
    114.
    发明申请
    Plated articles and methods for producing the plated articles 审中-公开
    电镀制品的电镀制品和方法

    公开(公告)号：US20030108751A1

    公开(公告)日：2003-06-12

    申请号：US10293295

    申请日：2002-11-14

    Inventor： Yukitaka Hasegawa ,  Yosuke Maruoka ,  Hiroshi Watarai ,  Yasuhiko Ogisu

    IPC: B32B015/08 ,  B05D003/10 ,  B05D001/36

    CPC classification number: C23C18/44 ,  C23C18/28 ,  Y10T428/31681

    Abstract: In the silver mirror pre-treating step, a tinnullIInull chloride solution with tinnullIInull actually serving as a co-catalyst is used for supporting tinnullIInull on the surface of the basecoat layer in the co-catalyst-supporting step. In the next washing step, the surface of the basecoat layer is washed with water. In the still next catalyst-supporting step, a palladium chloride solution with palladiumnullIInull actually serving as a catalyst is used for supporting palladiumnullIInull on the surface of the basecoat layer. After that, the resulting laminate is washed in the next washing step and then plated through silver mirror reaction in the still next plate layer-forming step.

    Abstract translation: 在银镜预处理步骤中，使用实际上用作助催化剂的锡[II]的锡[II]氯化物溶液来支持底漆涂层表面上的催化剂载体上的锡[II] 步。 在下一个洗涤步骤中，用水洗涤底漆层的表面。 在接下来的催化剂支持步骤中，使用实际作为催化剂的钯[II]的氯化钯溶液用于在底涂层的表面上负载钯[II]。 之后，在下一个洗涤步骤中洗涤所得的层压体，然后在下一个镀层形成步骤中通过银镜反应进行镀覆。

    METHOD FOR SURFACE TREATMENT OF METAL ENCLOSURE
    115.
    发明申请
    METHOD FOR SURFACE TREATMENT OF METAL ENCLOSURE 失效
    表面处理金属外壳的方法

    公开(公告)号：US20030082313A1

    公开(公告)日：2003-05-01

    申请号：US10051831

    申请日：2002-01-16

    Inventor： Wen-Shan Chien

    IPC: C23C016/00 ,  B05D003/10

    CPC classification number: C23C16/0254 ,  C23C16/402

    Abstract: A method for treating a metal enclosure to prevent the enclosure from being contaminated, comprises the steps of: (a) sand-blasting the enclosure; (b) preheating the enclosure to a predetermined temperature, and putting the enclosure into the space in a vacuum chamber between two electrodes; (c) introducing reactive gases into the vacuum chamber, the reactive gases including 1,1,3,3-tetramethyldisiloxane and oxygen; (d) applying high electrical power to the electrodes to cause the reactive gases to become an ionized plasma, the plasma reacting with a surface of the enclosure to form a layer of silicon oxide thereon. The layer of silicon oxide resists formation of a fingerprint when it is touched by a user.

    Abstract translation: 一种用于处理金属外壳以防止外壳被污染的方法，包括以下步骤：（a）对外壳进行喷砂处理; （b）将外壳预热到预定温度，并将外壳放入位于两个电极之间的真空室中的空间中; （c）将反应气体引入真空室，反应气体包括1,1,3,3-四甲基二硅氧烷和氧; （d）向电极施加高电力以使反应气体变成电离等离子体，等离子体与外壳的表面反应，在其上形成氧化硅层。 当氧化硅层被使用者触摸时，其形成指纹。

    Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application
    116.
    发明申请
    Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application 审中-公开
    ALD氮化钽和α相钽的集成用于铜金属化应用

    公开(公告)号：US20030082307A1

    公开(公告)日：2003-05-01

    申请号：US10193333

    申请日：2002-07-10

    Applicant: Applied Materials, Inc.

    Inventor： Hua Chung ,  Ling Chen

    IPC: B05D005/12 ,  B05D001/36 ,  B05D003/10

    CPC classification number: H01L21/28562 ,  C23C16/34 ,  C23C16/4411 ,  C23C16/4412 ,  C23C16/45504 ,  C23C16/45508 ,  C23C16/45512 ,  C23C16/45525 ,  C23C16/45544 ,  C23C16/45563 ,  C23C16/45582 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76871

    Abstract: A method for forming a metal interconnect on a substrate is provided. The method includes depositing a refractory metal-containing barrier layer having a thickness less than about 20 angstroms on at least a portion of a metal layer by alternately introducing one or more pulses of a metal-containing compound and one or more pulses of a nitrogen-containing compound. The method also includes depositing a seed layer on at least a portion of the barrier layer, and depositing a second metal layer on at least a portion of the seed layer. The barrier layer provides adequate barrier properties and allows the grain growth of the metal layer to continue across the barrier layer into the second metal layer thereby enhancing the electrical performance of the interconnect.

    Abstract translation: 提供了一种在基板上形成金属互连的方法。 该方法包括通过交替地引入一种或多种含金属化合物的脉冲和一个或多个氮 - 氧化合物的脉冲，在金属层的至少一部分上沉积厚度小于约20埃的难熔金属阻挡层， 含有化合物。 该方法还包括在阻挡层的至少一部分上沉积种子层，以及在种子层的至少一部分上沉积第二金属层。 阻挡层提供足够的阻挡性能并且允许金属层的晶粒生长继续穿过阻挡层进入第二金属层，从而增强互连的电性能。

    Method of making porous biodegradable polymers
    117.
    发明申请
    Method of making porous biodegradable polymers 失效
    制造多孔生物可降解聚合物的方法

    公开(公告)号：US20030064156A1

    公开(公告)日：2003-04-03

    申请号：US09947182

    申请日：2001-09-04

    Applicant: Industrial Technology Research Institute

    Inventor： Hsi-Hsin Shih ,  Kuang-Rong Lee ,  Huey-Min Lai ,  Chin-Chin Tsai ,  Yuan-Chia Chang

    IPC: B05D003/10

    CPC classification number: C08J9/122 ,  A61L27/56 ,  A61L27/58 ,  C08J2201/032 ,  C08J2203/06 ,  C08J2203/08 ,  C08J2389/00 ,  Y02P20/544

    Abstract: A method of making a porous biodegradable polymer is disclosed, which comprises (a) placing a biodegradable polymer and a solvent in a chamber; (b) adding a supercritical fluid to the chamber and maintaining the chamber at a predetermined temperature for a sufficient period of time to allow the supercritical fluid to dissolve into the biodegradable polymer with the help of the solvent; and (c) venting the supercritical fluid and the solvent by reducing the pressure in the chamber, thereby obtaining a porous biodegradable polymer.

    Abstract translation: 公开了制备多孔生物可降解聚合物的方法，其包括（a）将可生物降解的聚合物和溶剂置于室中; （b）将超临界流体加入到室中并将室维持在预定温度足够的时间以允许超临界流体借助溶剂溶解到可生物降解的聚合物中; 和（c）通过降低室中的压力来排出超临界流体和溶剂，从而获得多孔生物可降解聚合物。

    Integration of barrier layer and seed layer
    118.
    发明申请
    Integration of barrier layer and seed layer 审中-公开

    公开(公告)号：US20030059538A1

    公开(公告)日：2003-03-27

    申请号：US09965370

    申请日：2001-09-26

    Applicant: Applied Materials, Inc.

    Inventor： Hua Chung ,  Ling Chen ,  Jick Yu ,  Mei Chang

    IPC: B05D003/10 ,  B05D001/36 ,  B05D005/12 ,  C23C016/00

    CPC classification number: C23C16/45525 ,  C23C16/34 ,  C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/42 ,  H01L21/2855 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76864 ,  H01L21/76871 ,  H01L21/76873 ,  H01L2221/1089

    Abstract: The present invention generally relates to filling of a feature by depositing a barrier layer, depositing a seed layer over the barrier layer, and depositing a conductive layer over the seed layer. In one embodiment, the seed layer comprises a copper alloy seed layer deposited over the barrier layer. For example, the copper alloy seed layer may comprise copper and a metal, such as aluminum, magnesium, titanium, zirconium, tin, and combinations thereof. In another embodiment, the seed layer comprises a copper allloy seed layer deposited over the barrier layer and a second seed layer deposited over the copper alloy seed layer. The copper alloy seed layer may comprise copper and a metal, such as aluminum, magnesium, titanium, zirconium, tin, and combinations thereof The second seed layer may comprise a metal, such as undoped copper. In still another embodiment, the seed layer comprises a first seed layer and a second seed layer. The first seed layer may comprise a metal, such as aluminum, magnesium, titanium, zirconium, tin, and combinations thereof. The second seed layer may comprise a metal, such as undoped copper.

    Preactivation of plastic surfaces to be metallized
    119.
    发明申请
    Preactivation of plastic surfaces to be metallized 审中-公开
    预先激活要金属化的塑料表面

    公开(公告)号：US20030039754A1

    公开(公告)日：2003-02-27

    申请号：US10212411

    申请日：2002-08-05

    Applicant: Enthone Inc

    Inventor： Andreas Johannes Konigshofen

    IPC: B05D003/10 ,  C23C016/02

    CPC classification number: C25D5/56

    Abstract: A plastic surface to be metallized is contacted with a preactivation solution after an etching step and before an activation step. The solution comprises permanganate, a crosslinking agent, and a pH buffer material. As a result of the preactivation treatment with the solution, the plastic surface is changed in such a manner that the activation step can be carried out more efficiently. The method enables plastics to be metallized more efficiently and at lower cost, or in some cases to be metallized at all.

    Abstract translation: 在蚀刻步骤之后和激活步骤之前，待金属化的塑料表面与预活化溶液接触。 该溶液包括高锰酸盐，交联剂和pH缓冲材料。 作为对溶液进行预活化处理的结果，塑料表面以更有效地进行活化步骤的方式改变。 该方法使得塑料能够更有效地以更低的成本进行金属化，或者在某些情况下是完全金属化的。

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