公开(公告)号：US20230243871A1

公开(公告)日：2023-08-03

申请号：US18295721

申请日：2023-04-04

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Ming Ting Wu ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06722 ,  G01R1/07307

Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and an array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes of an array plate and an upper retention feature comprising at least one laterally compressible spring element at a level above the lower retention feature that, in combination with the probe body, can be made to achieve a lateral configuration that is sized to pass through the hole and thereafter elastically return to a configuration that is incapable of passing through the hole so as to retain the probe and the array plate together.

公开(公告)号：US20230207426A1

公开(公告)日：2023-06-29

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  H01L21/4871 ,  H01L23/473 ,  H01L21/4882 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281 ,  F28F2260/02

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US20230204626A1

公开(公告)日：2023-06-29

申请号：US17124417

申请日：2020-12-16

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06738

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

公开(公告)号：US11262383B1

公开(公告)日：2022-03-01

申请号：US16584818

申请日：2019-09-26

Applicant: Microfabrica Inc.

Inventor： Garret R. Smalley

IPC: G01R1/067 ,  G01R3/00

Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

公开(公告)号：US20210172080A1

公开(公告)日：2021-06-10

申请号：US17069165

申请日：2020-10-13

Applicant: Microfabrica Inc.

Inventor： Gregory P. Schmitz ,  Michael S. Lockard ,  Ming-Ting Wu ,  Eric C. Miller ,  Adam L. Cohen

IPC: C25D1/00 ,  C25D5/02 ,  C25D1/08 ,  C25D5/48 ,  B32B15/01 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  C25D7/00

Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.

公开(公告)号：US10939934B2

公开(公告)日：2021-03-09

申请号：US15718734

申请日：2017-09-28

Applicant: Microfabrica Inc.

Inventor： Michael S. Lockard ,  Uri Frodis ,  Adam L. Cohen ,  Richard T. Chen ,  Gregory P. Schmitz ,  Eric C. Miller ,  Ming Ting Wu ,  Arun S. Veeramani ,  Juan Diego Perea

IPC: A61B17/3205 ,  A61B17/14 ,  A61B17/32 ,  A61B17/16 ,  A61B17/3207 ,  A61B17/221 ,  A61B10/02 ,  B33Y80/00 ,  A61B90/00 ,  F16H55/18 ,  F16H55/06 ,  A61B17/00 ,  A61B17/29 ,  F16H55/56

Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.

公开(公告)号：US20190017189A1

公开(公告)日：2019-01-17

申请号：US16118267

申请日：2018-08-30

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC: C25D5/02 ,  C23C18/16 ,  C25D1/00 ,  B81C1/00

CPC classification number: C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20180289385A1

公开(公告)日：2018-10-11

申请号：US15943598

申请日：2018-04-02

Applicant: Microfabrica inc.

Inventor： Gregory P. Schmitz ,  Ming- Ting Wu ,  Eric C. Miller ,  Juan Diego Perea

IPC: A61B17/3201 ,  A61N1/36 ,  A61B34/30 ,  A61B18/14 ,  A61B17/32 ,  A61B18/12 ,  A61B18/00 ,  B33Y10/00 ,  A61B17/00 ,  B33Y80/00 ,  C25D1/00

Abstract: Methods and devices are provided for use in medical applications involving tissue removal. One exemplary powered scissors device includes a distal housing having a fixed cutting arm located thereon, an elongate member coupled to the distal housing and configured to introduce the distal housing to a target tissue site of the subject, a rotatable blade rotatably mounted to the distal housing, the rotatable blade having at least one cutting element configured to cooperate with the fixed arm to shear tissue therebetween, a crown gear located at a distal end of an inner drive tube, and a first spur gear configured to inter-engage with the crown gear and coupled with the rotatable blade to allow the crown gear to drive the rotatable blade.

公开(公告)号：US10069230B1

公开(公告)日：2018-09-04

申请号：US15428139

申请日：2017-02-08

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani

IPC: H01R4/26 ,  H01R12/79 ,  C25D5/02 ,  C25D7/00 ,  H01R4/2412 ,  H01R4/62

Abstract: Embodiments are directed to board (e.g. PCB) mountable connectors for small gauge ribbon cables having a plurality of 28-40 AWG wires wherein the connectors are fabricated from a plurality of adhered layers comprising at least on metal.

公开(公告)号：US09597834B2

公开(公告)日：2017-03-21

申请号：US14194214

申请日：2014-02-28

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/48 ,  B29C65/56

CPC classification number: B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

Abstract: Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.