公开(公告)号：US20220328405A1

公开(公告)日：2022-10-13

申请号：US17851046

申请日：2022-06-28

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.

公开(公告)号：US11417573B2

公开(公告)日：2022-08-16

申请号：US17034965

申请日：2020-09-28

Applicant: InnoLux Corporation

Inventor： Ker-Yih Kao ,  Liang-Lu Chen ,  Chin-Lung Ting

IPC: H01L21/66 ,  H01L25/075 ,  H01L33/62 ,  H01L27/12

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.

公开(公告)号：US20220216302A1

公开(公告)日：2022-07-07

申请号：US17561716

申请日：2021-12-24

Applicant: Innolux Corporation

Inventor： Chen-Lin Yeh ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Jen-Hai Chi ,  Yi-Hung Lin ,  Yan-Zheng Wu

IPC: H01L29/08 ,  H05K1/11 ,  H05K3/34

Abstract: Disclosed is an electronic device, including a substrate, a first electrode, a second electrode, a modulation element, a first solder, and a switch element. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The modulation element is disposed on the substrate and includes at least two connecting pads. The first solder is disposed between the first electrode and one connecting pad of the modulation element. The switch element is disposed on the substrate. The one connecting pad of the modulation element is electrically connected to the switch element sequentially through the first solder, the first electrode, and the second electrode.

公开(公告)号：US11330689B2

公开(公告)日：2022-05-10

申请号：US17037589

申请日：2020-09-29

Applicant: Innolux Corporation

Inventor： Ming Chun Tseng ,  Chin-Lung Ting ,  Ker-Yih Kao ,  Kung-Chen Kuo ,  Lien-Hsiang Chen

IPC: H05B45/40 ,  H05B45/48

Abstract: A display device is provided. The display device includes a plurality of light-emitting modules. The at least one of the plurality of light-emitting modules includes a light-emitting unit group. The light-emitting unit group includes a plurality of light-emitting units coupled to each other in series. The first current source is coupled to the light-emitting unit group, and configured to provide a first current to drive the plurality of light-emitting units. The bypass unit includes a plurality of first switch units. The bypass unit is coupled to the light-emitting unit group in parallel. The plurality of first switch units are coupled to the plurality of light-emitting units in parallel.

公开(公告)号：US20220139304A1

公开(公告)日：2022-05-05

申请号：US17496739

申请日：2021-10-07

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Ming Chun Tseng ,  Min-Hsin Lo ,  Hung Sheng Liao

IPC: G09G3/32

Abstract: The disclosure provides a light emitting device and a light emitting unit. The light emitting device includes a carrier, a first light emitting unit, and a second light emitting unit. The first light emitting unit is disposed on the carrier and has a first scan circuit, a first emit circuit, a first input terminal, and a first output terminal. The second light emitting unit is disposed on the carrier and has a second input terminal. The second input terminal is electrically connected to the first output terminal of the first light emitting unit. The first scan circuit is configured to provide a first scan signal to the first emit circuit and the second light emitting unit. The light emitting device and the light emitting unit of the disclosure may reduce the number of signal lines or have a circuit simplification effect.

公开(公告)号：US11302635B2

公开(公告)日：2022-04-12

申请号：US16920448

申请日：2020-07-03

Applicant: Innolux Corporation

Inventor： Tang Chin Hung ,  Chin-Lung Ting ,  Chung-Kuang Wei ,  Ker-Yih Kao ,  Tong-Jung Wang ,  Chih-Yung Hsieh ,  Hao Jung Huang ,  I-Yin Li ,  Chia-Chi Ho ,  Yi Hung Lin ,  Cheng-Hsu Chou ,  Chia-Ping Tseng

IPC: H01L23/528 ,  H01L27/06 ,  H01L23/522 ,  H01L21/8234 ,  H01L29/93 ,  H01L23/538 ,  H01L21/60

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

公开(公告)号：US20220003384A1

公开(公告)日：2022-01-06

申请号：US17341399

申请日：2021-06-08

Applicant: Innolux Corporation

Inventor： Jia-Huei Lin ,  Chin-Lung Ting ,  Li-Wei Mao ,  Fang-Ho Lin ,  Chieh Ying Chen

IPC: F21V7/05

Abstract: The disclosure provides a backlight module and a display device. The backlight module includes a substrate, a light-emitting element, a circuit element, and a reflective sheet. The light-emitting element is bonded onto the substrate. The circuit element is bonded onto the substrate and electrically connected to the light-emitting element. The reflective sheet is disposed on the substrate and has a first opening. The first opening at least exposes the light-emitting element. At least a portion of a surface of the circuit element is made reflective. The display device includes the backlight module and a display panel disposed on the backlight module. The backlight module and the display device of the embodiment of the disclosure may improve the mura or exhibit a more uniform brightness.

公开(公告)号：US20210375199A1

公开(公告)日：2021-12-02

申请号：US17308041

申请日：2021-05-04

Applicant: Innolux Corporation

Inventor： Chin-Lung Ting ,  Chien-Chih Chen ,  Ti Chung Chang ,  Chih-Chieh Wang ,  Jenhung Li

IPC: G09G3/3208

Abstract: A display panel and a spliced display are provided. The display panel includes a substrate, a plurality of light-emitting elements, a driving circuit, and an optical sensor. The substrate includes a through hole, and the through hole includes a hole. The plurality of the light-emitting elements are disposed on the substrate. The through hole is located in a region between two of the plurality of the light-emitting elements. The driving circuit is disposed on the substrate and electrically connected to the plurality of the light-emitting elements. The optical sensor is disposed corresponding to the through hole and receives sensing light through the hole. The width W of the hole meets the equation of H≤W

公开(公告)号：US11163392B2

公开(公告)日：2021-11-02

申请号：US16912272

申请日：2020-06-25

Applicant: InnoLux Corporation

Inventor： Chandra Lius ,  Kuan-Feng Lee ,  Jui-Jen Yueh ,  Chin-Lung Ting

IPC: G06F3/041 ,  G06F3/14 ,  G06F3/044 ,  G06K9/00

Abstract: A display device includes: a substrate; a plurality of display units disposed on the substrate, wherein two adjacent display units of the plurality of display units are arranged by a first pitch in a direction; a plurality of first sensing units disposed on the plurality of display units, wherein two adjacent first sensing units of the plurality of first sensing units are arranged by a second pitch in the direction; and a first electronic component electrically connected with the plurality of display units, wherein the second pitch is less than the first pitch, and the first electronic component and the plurality of first sensing units are disposed on opposite sides of the plurality of display units.

公开(公告)号：US11127604B2

公开(公告)日：2021-09-21

申请号：US16211194

申请日：2018-12-05

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.