Abstract:
A cold electron emitter may include a heavily n+ doped wide band gap (WBG) substrate, a p-doped WBG region, and a low work function metallic layer (n+-p-M structure). A modification of this structure includes heavily p+ doped region between p region and M metallic layer (n+-p-p+-M structure). These structures make it possible to combine high current emission with stable (durable) operation. The high current density is possible because the p-doped (or p+ heavily doped) WBG region acts as a negative electron affinity material when in contact with low work function metals. The injection emitters with the n+-p-M and n+-p-p+-M structures are stable since the emitters make use of relatively low extracting electric field and are not affected by contamination and/or absorption from accelerated ions. In addition, the structures may be fabricated with current state-of-the-art technology.
Abstract:
An electron emitter, such as for a display, has a substrate and regions of n-type material and p-type material on the substrate arranged such that there is an interface junction between the regions exposed directly to vacuum for the liberation of electrons. The p-type region may be a thin layer on top of the n-type region or the two regions may be layers on adjacent parts of the substrate with adjacent edges forming the interface junction. Alternatively, there many be multiple interface junctions formed by p-type particles or by both p-type and n-type particles. The particles may be deposited on the substrate by an ink-jet printing technique. The p-type material is preferably diamond, which may be activated to exhibit negative electron affinity.
Abstract:
An electron tube provided with a semiconductor cathode for emitting electrons, which semiconductor cathode is arranged on a support, a source being arranged in the vicinity of the cathode, in particular, so as to face the free (Si) surface of the cathode, which source is capable of evolving, at the increased temperatures occurring during evacuation of the tube in the manufacturing process, a reducing agent such as F2 or HF, which passivates the free (Si) surface of the cathode.
Abstract:
In an electron-emitting device, an electron supplying layer for supplying electrons is composed of an n-GaN layer. An electron transferring layer for moving electrons toward the surface is composed of non-doped (intrinsic) AlxGa1−xN (0≦x≦1) having a graded composition for the Al concentration x. A surface layer is composed of non-doped AlN having a negative electron affinity (NEA). The electron transferring layer composed of AlxGa1−xN has a band gap which is enlarged nearly continuously from the electron supplying layer to the surface layer and a negative electron affinity or a positive electron affinity close to zero. If such a voltage V as to render the surface electrode side positive is applied, the band of AlxGa1−xN is bent, whereby a current derived mainly from a diffused current flows from the electron supplying layer to the surface layer through the electron transferring layer. Thereby excellent electron emitting characteristic is obtained.
Abstract translation:在电子发射器件中,用于提供电子的电子供应层由n-GaN层组成。 用于向表面移动电子的电子转移层由具有Al浓度x的梯度组成的非掺杂(本征)Al x Ga 1-x N(0 <= x <= 1)组成。 表面层由具有负电子亲和力(NEA)的非掺杂AlN组成。 由Al x Ga 1-x N组成的电子转移层具有从电子供给层到表面层几乎连续扩大的带隙,接近零的负电子亲和力或正电子亲和力。 如果施加使表面电极侧为正的电压V,则Al x Ga 1-x N的带被弯曲,主要由扩散电流导出的电流从电子供给层通过电子转移层流向表面层。 由此获得优异的电子发射特性。
Abstract:
Disclosed is an electron discharging apparatus capable of fully accelerating electrons emitted from an electron discharging portion consisting of a pn-junction by effect of securing a greater exposure area of an accelerating electrode against said electron discharging portion. The inventive electron discharging apparatus comprises; a pn-junction formed on a surface side of a semiconductor substrate; an insulating film formed on the semiconductor substrate; a first aperture portion formed through a first insulating film formed on the pn-junction; and an accelerating electrode which is formed on the first insulating film by way of surrounding periphery of the first aperture portion. The accelerating electrode is formed so that inner edge portion of the accelerating electrode is projected into the first aperture portion area.
Abstract:
A semiconductor cathode (11) in a semiconductor structure, in which the sturdiness of the cathode is increased by covering the emitting surface (4) with a layer of a semiconductor material (7) having a larger bandgap than the semiconductor material of the semiconductor cathode. Various measures for increasing the electron-emission efficiency are indicated.
Abstract:
An electron emitting device is provided with an N type semiconductor disposed in contact with a first electrode. A P type semiconductor contacts the N type semiconductor to define a PN junction. A low work function metal electrode contacts the P type semiconductor thus defining a Schottky barrier. First and second means are provided to forward bias the PN junction and to reversed bias the Schottky barrier, respectively.
Abstract:
Image source, for converting image data in the form of serial charges into a high-resolution imagewise light pattern, combines semiconductor charge-coupled devices for receiving the charges, associated small-scale field emission arrays for converting the charges to imagewise pattern of electron emissions, an electron multiplier for intensifying the electron emissions, and a luminescent phosphor layer susceptible to light output according to the impact of the intensified electron emission. The light output may be directed onto a photosensitive image recording medium to provide means for image recording. Second and third embodiments of the contemplated image source provide light output that forms an image to be viewed directly.
Abstract:
In a semiconductor electron emission device for causing an avalanche breakdown by applying a reverse bias voltage to a Schottky barrier junction between a metallic material or metallic compound material and a p-type semiconductor, and externally emitting electrons from a solid-state surface, a p-type semiconductor region (first region) for causing the avalanche breakdown contacts a p-type semiconductor region (second region) for supplying carriers to the first region, and a semi-insulating region is formed around the first region.
Abstract:
A semiconductor element emission element having a Schottky junction in a surface region of a semiconductor, comprises a first region having a first carrier concentration, a second region having a second carrier concentration, and a third region having a third carrier concentration. All of the regions are located below an electrode forming the Schottky junction. The first, second, and third carrier concentrations satisfy a condition that the first carrier concentration of the first region is higher than the second carrier concentration of the second region and that the second carrier concentration of the second region is higher than the third carrier concentration of the third region. The first, second, and third regions have a structure that at least one second region having the second carrier concentration is located inside the third region of the third carrier concentration, and that at lease one first region having the first carrier concentration is located inside said second region having the second carrier concentration.